參考文獻 |
1. S. Sivaram, H. Bath, R. Leggett, A. Maury, K. Moning and R. Tolles, “Planarizing interlevel dielectrics by chemical mechanical polishing”, Solid State Technology, 35, 87 (May 1992).
2. A. C. Adams and C. D. Capio, “Planarization of phosphorous-doped silicon dioxide”, J. Electrochem. Soc., 128, 423 (1981).
3. L. K. White, “Planarization properties of resistant polyimide coatings”, J. Electrochem. Soc., 130, 1543 (1983).
4. L. Debruin and J. M. Laarhoven, “Advanced multiple-step resist etchback planarization”, in Proc. IEEE VMIC Conference, 404 (1988).
5. R. H. Wilson and P. A. Piacente, “Effect of circuit structure on resist thickness”, J. Electrochem. Soc., 133, 981 (1986).
5. R. H. Wilson and P. A. Piacente, “Effect of circuit structure on resist thickness”, J. Electrochem. Soc., 133, 981 (1986).
7. A. Schiltz and M. Pons, “Two-layer planarization process”, J. Electrochem. Soc., 133, 178 (1986).
8. A. N. Saxena and D. Pramanik, “Planarization techniques for multilevel metallization”, Solid State Technology, 29, 95 (1986).
9. D. B. Tuckerman and A. H. Weiberg, “Planarization of gold and aluminum thin films using a pulsed laser”, Solid State Technology, 29, 129 (1986).
10. S. K. Gupta and R. I. Chin, “Characterisation of spin-on-glass films as a planarizing dielectric”, in Proc. ACS Symp., 22, 295 (1986).
11. A. Schiltz, “Advantages of using spin-on-glass layer in intermediate dielectric planarization”, in Proc. Microcircuit Eng. Conference, 5, 413 (1986).
12. L. B. Rothman, “Process for forming passivated metal interconnection system with a planar surface”, J. Electrochem. Soc., 130, 1131 (1983).
13. H. Fritzsche and N. Ibaraki, “Etching of tapered via holes in sandwiched dielectric interlayer for multilevel metallization”, in Proc. IEEE VMIC Conference, 253, (1985).
14. E. R. Sirkin and I. A. Blech, “A method of forming contacts between two conducting layers separated by a dielectric”, J. Electrochem. Soc., 131, 123, (1984).
15. P. Sanseau, A. Schiltz, G. Rabilloud and L. Verdet, “Improve lift-off pillar fabrication technique using a polyphenylquinozaline polymer”, J. Electrochem. Soc., 17, 170 (1988).
15. P. Sanseau, A. Schiltz, G. Rabilloud and L. Verdet, “Improve lift-off pillar fabrication technique using a polyphenylquinozaline polymer”, J. Electrochem. Soc., 17, 170 (1988).
17. I. Ali, R. Sudipto and R. Shinn, “Chemical polishing of interlayer dielectric”, Solid State Technology, 63 (Oct. 1994).
17. I. Ali, R. Sudipto and R. Shinn, “Chemical polishing of interlayer dielectric”, Solid State Technology, 63 (Oct. 1994).
19. T. Izumitani, “Polishing mechanism of optical glasses”, Glass Technology, 12, 131 (1971).
20. M. Tomozawa, and K. Hirao, “Diffusion of water into oxides during microhardness indenttation”, J. of Materials Science Letters, 867 (1987).
21. F. W. Preston, “The theory and design of plate glass polishing machines”, J. Soc. Glass Technology, 11, 214 (1927).
22. J. F. Archard, “Contact and rubbing of flat surface”, J. Appl. Phys., 24, 981 (1953).
23. M. Tomozawa, “Oxide CMP mechanism”, Solid State Technology, 169, (July 1997).
24. Joseph H. Tylczak and Albany Oregon, “ASM Handbook: friction, lubrication and wear technology”, 18, 184 (1990).
25. T. W. Healy, G. R. Wiese, D. E. Yates and B. V. Kavanagh, “Heterogulation in mixed oxide colloidal dispersion”, J. Colloid and Interface Science, 42, 647 (1973).
25. T. W. Healy, G. R. Wiese, D. E. Yates and B. V. Kavanagh, “Heterogulation in mixed oxide colloidal dispersion”, J. Colloid and Interface Science, 42, 647 (1973).
27. L. M. Cook., “Chemical process in glass polishing”, J. of Non-Crystalline Solids, 152 (1990).
28. C. Millot, “Geology of clay”, Springer-Uerrlag, New York, 55 (1970).
28. C. Millot, “Geology of clay”, Springer-Uerrlag, New York, 55 (1970).
28. C. Millot, “Geology of clay”, Springer-Uerrlag, New York, 55 (1970).
28. C. Millot, “Geology of clay”, Springer-Uerrlag, New York, 55 (1970).
polishing”, IEEE transactions on Electron Devices, 43, 739 (May 1996).
32. Denny A. Jone, “Principles and prevention of corrosion”, Macmillan Publishing Company, New York, 49 (1991).
33. Ingemar Olefjord and Anders Nylund, “Surface analysis of oxidized aluminum”, Surface and Interface Analysis, 21, 290 (1994).
34. Y. L. Wang, J. Wu, C. W. Liu, T. C. Wang and Dun Jowei, “Material characteristics and chemical mechanical polishing of aluminum alloy thin films”, Thin Solid Film, 397 (1998).
34. Y. L. Wang, J. Wu, C. W. Liu, T. C. Wang and Dun Jowei, “Material characteristics and chemical mechanical polishing of aluminum alloy thin films”, Thin Solid Film, 397 (1998).
34. Y. L. Wang, J. Wu, C. W. Liu, T. C. Wang and Dun Jowei, “Material characteristics and chemical mechanical polishing of aluminum alloy thin films”, Thin Solid Film, 397 (1998).
34. Y. L. Wang, J. Wu, C. W. Liu, T. C. Wang and Dun Jowei, “Material characteristics and chemical mechanical polishing of aluminum alloy thin films”, Thin Solid Film, 397 (1998).
34. Y. L. Wang, J. Wu, C. W. Liu, T. C. Wang and Dun Jowei, “Material characteristics and chemical mechanical polishing of aluminum alloy thin films”, Thin Solid Film, 397 (1998).
39. D. Stein, D. Hetherington, M. Dugger and T. Stout, “Optical interferometry for surface measurements of CMP pads”, J. Electronic Materials, 25, 1623 (1996).
39. D. Stein, D. Hetherington, M. Dugger and T. Stout, “Optical interferometry for surface measurements of CMP pads”, J. Electronic Materials, 25, 1623 (1996).
39. D. Stein, D. Hetherington, M. Dugger and T. Stout, “Optical interferometry for surface measurements of CMP pads”, J. Electronic Materials, 25, 1623 (1996).
42. C. Yi, W. C. Tu, S. Hsieh and H. C. Chen, “Comparison between W-CMP and WEB for contact plug/via formation” Proc. of VIMIC Specialty Conference on CMP Planarization, 107 (1997).
42. C. Yi, W. C. Tu, S. Hsieh and H. C. Chen, “Comparison between W-CMP and WEB for contact plug/via formation” Proc. of VIMIC Specialty Conference on CMP Planarization, 107 (1997).
42. C. Yi, W. C. Tu, S. Hsieh and H. C. Chen, “Comparison between W-CMP and WEB for contact plug/via formation” Proc. of VIMIC Specialty Conference on CMP Planarization, 107 (1997).
45. E. Tseng, C. Yi, H. C. Chen, “ A mechanical model for DRAM dielectric chemical mechanical polishing process” Proc. of VIMIC Specialty Conference on CMP Planarization, 258 (1997).
46. H. W. Chiou, L. J. Chen and H. C. Chen, “On monitoring CMP removal rate by in-situ temperature measurements”, Proc. of VIMIC Specialty Conference on CMP Planarization, 131 (1997).
47. H. W. Chiou and L. J. Chen, “Proportional -integral-derivative (PID) run to run control of CMP removal rate”, Proc. of VIMIC Specialty Conference on CMP Planarization, 375 (1997).
48. H. Hocheng H. Y. Tsai and l. J. Chen, ”A kinematic analysis of CMP based on velocity model”, Proc. of VIMIC Specialty Conference on CMP Planarization,
277 (1997).
277 (1997).
50. B. Withers, E. Zhao, W. Krusell, R. Jairath and S. Hosali, “Wide margin CMP for STI”, Solid State Technology, 173 (July 1998).
51. G. Nanz and L. E. Camilletti, “Modeling of chemical-mechanical polishing : a review”, IEEE Transaction Semiconductor Manufacturing, 8, 382 (1995).
52. S. R. Runnels and L. M. Eyman, “Tribology analysis of chemical-mechanical polishing”, J. Electrochem. Soc., 141, 1698 (1994).
53. S. R. Runnels, “Feature-Scale fluid-based erosion modeling for chemical mechanical polishing”, J. Electrochem. Soc., 141, 1900 (1994).
54. S. R. Runnels, “Advance in physically based erosion simulators for CMP”, J. Electronic Materials, 25, 1574 (1996).
55. S. R. runnels and T. Olavson, ”Optimizing wafer polishing through phenomenological modeling”, J. Electrochem. Soc., 142, 2032 (1995).
56. J. Warnock, “Two-dimensional process model for chemimechanical polish planarization”, J. Electrochem. Soc., 138, 2398 (1991).
57. F. C. Chou, M. N. Fu and L. J. Chen, “A comprehensive CMP fluid dynamics 3-D simulation”, Proc. of VMIC conference, 175 (1997).
58. D. P. Y. Bramono and L. M. Racz, “Numerical flow visualization of slurry in a chemical mechanical planarization process”, Proc. of CMP-VMIC, 185 (1998).
59. C. Rogers, L. Racz, J. Coppeta, A. Philipossian, F. B. Kaufman and D. Bramono, “Analysis of flow between a wafer and pad during CMP processes”, J. Electron.
Mater., 27, 1082 (1998).
Mater., 27, 1082 (1998).
61. C. Srinivasa-Murthy, D. Wang, S. P. Beaudoin, T. Bibby, K. Holland and T. S. Cale, “Stree distribution in chemical mechanical polishing”, Thin Solid Films, 308-309, 533 (1997).
62. C. S. Murthy, D. Wang, S. Beaudoin and T. Cale, “Non-uniformity in CMP process: An effect of stress”, Procs. of VMIC Specialty Conference on CMP Planarization, 281 (1997).
63. D. Wang, J. Lee, K. Holland, T. Bibby, S. Beaudoin and T. Cale, “Von Mises stress in chemical mechanical polishing processes”, J. Electrochem. Soc., 144, 1121 (1997).
64. C. W. Liu, B. T. Dai, W. T. Tseng and C. F. Yeh, “Modeling of the wear mechanism during chemical mechanical polishing”, J. Electrochem. Soc., 143, 716 (1996).
64. C. W. Liu, B. T. Dai, W. T. Tseng and C. F. Yeh, “Modeling of the wear mechanism during chemical mechanical polishing”, J. Electrochem. Soc., 143, 716 (1996).
66. J. Coppeta, C. Rogers, A. Philipossian and F. B. Kaufman, “Characterizing slurry flow during CMP using laser induced fluorescence”, Proc. of CMP-MIC Conference, 307 (1997).
66. J. Coppeta, C. Rogers, A. Philipossian and F. B. Kaufman, “Characterizing slurry flow during CMP using laser induced fluorescence”, Proc. of CMP-MIC Conference, 307 (1997).
Santa Clara, CA, USA, 36 (1998).
Santa Clara, CA, USA, 36 (1998).
69. Z. Stavreva, D. Zeidler, M. Plotner, and K. Drescher, “Characteristics in chemical mechanical polishing of copper: comparison of polishing pads”, Appl. Surf. Sci., 108, 39 (1997).
69. Z. Stavreva, D. Zeidler, M. Plotner, and K. Drescher, “Characteristics in chemical mechanical polishing of copper: comparison of polishing pads”, Appl. Surf. Sci., 108, 39 (1997).
71. M. N. Fu and F. C. Chou, “Flow simulation for chemical mechanical planarization”, Jpn. J. Appl. Phys., 38, 4709 (1999).
72. A. Modak, P. Monteith and N. Parekh, “Components of within-wafer non-uniformity in a dielectric CMP process”, Proc. of CMP-MIC Conference, 169 (1997).
72. A. Modak, P. Monteith and N. Parekh, “Components of within-wafer non-uniformity in a dielectric CMP process”, Proc. of CMP-MIC Conference, 169 (1997).
74. CFX-F3D, Version 4.1, Computational Fluid Dynamics Services, UK, (1995).
75. C. M. Rhie and W. L. Chow, “Numerical study of the turbulent flow pass an airfoil with trailing edge separation”, AIAA JI, 21, 1527 (1983).
76. J. P. Van Doormaal and G. D. Raithby, “Enhancements of the simple method for predicting incompressible fluid flows”, Numerical Heat Transfer, 7, 147 (1984).
77. T. F. A. Bibby, R. Harwood, D. Schey and K. McKinley, “Cartesian coordinate
maps for chemical mechanical planarization uniformity characterization”, Thin
Solid Film, 308-309, 512 (1997).
Solid Film, 308-309, 512 (1997).
79. Data Sheet of Rodel Inc. |