不同負荷條件下之Sn-3.5Ag-0.5Cu無鉛銲錫低週疲勞行為

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黃俊鳴(Chun-Ming Huang) 查詢紙本館藏

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機械工程學系

論文名稱

不同負荷條件下之Sn-3.5Ag-0.5Cu無鉛銲錫低週疲勞行為
(Low-Cycle Fatigue of Sn-3.5Ag-0.5Cu Lead-Free Solder under Various Loading Conditions)

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摘要(中)

摘要
本研究主旨在探討負荷應變比與張應變持時此二種效應對於Sn-3.5Ag-0.5Cu無鉛銲錫低週疲勞行為的影響。為了避免傳統接觸式延伸計傷害試棒表面而產生提早破壞，本研究發產出一套非接觸式應變量測系統，並將之應用於低週疲勞試驗。此外，亦利用掃描式電子顯微鏡(SEM)觀察表面裂縫與破斷面，以了解此款無鉛銲錫之疲勞破裂機制。
實驗結果顯示，在各種應變振幅、應變比和張應變持時的試驗條件組合中，所得的疲勞壽命皆可以不同的Coffin-Manson關係式個別描述之。當應變比從-1增加至0和0.5時，疲勞壽命明顯降低，此結果乃是受平均應變而非平均應力的影響。而當張應變持時從0秒增加至100秒時，疲勞壽命也會明顯降低，這是因為引入潛變破壞機制所致。為描述平均應變與張應變持時此二種效應對此款無鉛銲錫低週疲勞行為的影響，本研究分別提出兩種修正型的Coffin-Manson關係式。基於這兩種修正型Coffin-Manson關係式的成功應用，本研究更提出了一統合型的Coffin-Manson修正關係式，並成功地應用於描述本研究各式不同組合試驗條件下的所有低週疲勞壽命。
由SEM觀察得知，微小的表面裂縫起始於富錫樹枝狀結構與共晶組織兩相的交界處，主要原因是兩相強度不同，循環受力後容易產生晶界差階造成應力集中所導致。裂縫的成長和連結，主要為繼續沿著富錫樹枝狀結構與共晶組織兩相的交界處，並伴隨穿過共晶組織相的穿沿晶混合模式。隨著受力循環數增加，微小裂縫連結成更大裂縫並向試棒內部成長，直到試棒完全斷裂。

摘要(英)

ABSTRACT
The purpose of this study is to investigate the influence of strain ratio and tensile hold time on low-cycle fatigue (LCF) behavior of a lead-free Sn-3.5Ag-0.5Cu solder alloy. A non-contact strain measurement system was developed and applied to the LCF tests to avoid premature failure caused by traditional contact type of extensometers. Fractography analysis with scanning electron microscopy (SEM) was conducted to determine the LCF fracture mechanism for the given solder alloy.
Results showed that LCF life of the given Sn-3.5Ag-0.5Cu, under various combinations of strain amplitude, strain ratio and tensile hold time, could be individually described by a Coffin-Manson relationship for each given testing condition. An increase of strain ratio from R = –1 to 0 and 0.5 would cause a significant reduction of LCF life due to the influence of mean strain instead of mean stress. LCF life was markedly reduced when the hold time at tensile peak strain was increased from 0 to 100 sec as a result of additional creep damages generated during LCF loading. Several modified Coffin-Manson models were proposed to describe the LCF behavior with a consideration of the effects of strain ratio and tensile hold time separately. Based on the success of these modified models, a unified LCF lifetime model was then proposed and did an excellent work in describing the LCF lives for all the given testing conditions with various combinations of strain amplitude, strain ratio and tensile hold time in the current study.
From SEM observations, it could be found that fatigue cracks were initiated at the interphases between b-Sn dendrites and eutectic phases. The fatigue cracks propagated and linked up in a mixed mode of intergranular manner along boundaries between b-Sn dendrites and eutectic phases and transgranular manner through eutectic phases.

關鍵字(中)

★ 應變持時
★ 低週疲勞
★ 無鉛銲錫
★ 應變比
★ 錫銀銅

關鍵字(英)

★ low cycle fatigue
★ lead-free solder
★ SnAgCu
★ strain ratio
★ hold time

論文目次

TABLE OF CONTENTS
Page
LIST OF TABLES IV
LIST OF FIGURES V
1. INTRODUCTION 1
1.1 Background 1
1.2 Sn-Ag and Sn-Ag-Cu Lead-Free Solder Alloys 3
1.3 Fatigue of Solders 4
1.4 Models for Low-Cycle Fatigue Life 4
1.5 Low-Cycle Fatigue in Sn-Ag and Sn-Ag-Cu 10
1.6 Purpose and Scope 12
2. EXPERIMENTAL PROCEDURES 14
2.1 Material and Specimen 14
2.2 Tensile Test 14
2.3 Low-Cycle Fatigue Test 14
2.4 Microstructural and Fractography Analyses 16
3. RESULTS AND DISCUSSION 18
3.1 Microstructure and Tensile Properties 18
3.2 Low-Cycle Fatigue 18
3.2.1 Cyclic Stress-Strain Behavior 18
3.2.2 Effects of Strain Ratio 21
3.2.3 Effects of Tensile Hold Time 24
3.2.4 Unified Low-Cycle Fatigue Life Model 27
4. CONCLUSIONS 29
REFERENCES 31
TABLES 36
FIGURES 37

參考文獻

REFERENCES
1. W. J. Plumbridge, “Review: Solders in Electronics,” Journal of Materials Science, Vol. 31, 1996, pp. 2501-2514.
2. S. K. Kang and A. K. Sarkhel, “Lead (Pb)-Free Solders for Electronic Packaging,” Journal of Electronic Materials, Vol. 23, 1994, pp. 701-707.
3. C. Kanchanomai, S. Yamamoto, Y. Miyashita, Y. Mutoh, and A. J. McEvily, “Low Cycle Fatigue Test for Solders Using Non-Contact Digital Image Measurement System,” International Journal of Fatigue, Vol. 24, 2002, pp. 57-67.
4. M. McCormack and S. Jin, “New, Lead-Free Solders,” Journal of Electronic Materials, Vol. 23, 1994, pp. 635-640.
5. M. Abtew and G. Selvaduray, “Lead-Free Solders in Microelectronics,” Materials Science and Engineering, Vol. 27, 2000, pp. 95-141.
6. D. P. Napp, “Lead Free Interconnect Materials for The Electronics Industry,” SAMPE Journal, Vol. 32, 1996, p. 59.
7. 菅沼克昭, 鉛付技術, 工業調查會, 日本, 2001. (日文)
8. W. Yang, L. E. Feltion, and R. W. Messler, “The Effect of Soldering Process Variables on the Microstructure and Mechanical Properties of Eutectic Sn-Ag/Cu Solder Joints,” Journal of Electronic Materials, Vol. 24, 1995, pp. 1465-1472.
9. Alloy Phase Diagrams, ASM Handbook, Vol. 3, ASM International, Materials Park, OH, 1992, pp.2.1-2.260.
10. M. McCormack and S. Jin, “Improve Mechanical Properties in New, Pb-Free Solder Alloys,” Journal of Electronic Materials, Vol. 24, 1995, pp. 715-720.
11. Y. Kariya and M. Otsuka, “Effect of Bismuth on the Isothermal Fatigue Properties of Sn-3.5 mass% Ag Solder Alloy,” Journal of Electronic Materials, Vol. 27, 1998, pp. 866-870.
12. Y. Kariya and M. Otsuka, “Mechanical Fatigue Characteristics of Sn-3.5Ag-X (X=Bi, Cu, Zn, and In) Solder Alloys,” Journal of Electronic Materials, Vol. 27, 1998, pp. 1229-1235.
13. J. Glazer, “Microstructure and Mechanical Properties of Pb-Free Solder Alloys for Low-Cost Electronic Assembly: A Review,” Journal of Electronic Materials, Vol. 23, 1994, pp. 693-700.
14. H. D. Solomon, “Low Cycle Fatigue of Sn96 Solder with Reference to Eutectic Solder and a High Pb Solder,” Journal of Electronic Packaging, Vol. 113, 1991, pp. 102-108.
15. P. T. Vianco and A. C. Claghorn, “Effect of Substrate Preheating on Solderability Performance as a Guideline for Assembly Process Development Part 1: Baseline Analysis,” Soldering & Surface Mount Technology, Vol. 24, 1996, pp. 12-18.
16. M. Ohring, Reliability and Failure of Electronic Material and Devices, Academic Press, San Diego, USA, 1998.
17. J. H. Lau, Solder Joint Reliability-Theory and Applications, Van Nostrand Reinhold, New York, USA, 1991.
18. R. P. Skelton, High Temperature Fatigue: Properties and Prediction, Elsevier Applied Science, New York, USA, 1987.
19. W. W. Lee, L. T. Nguyen, and G. S. Selvaduray, “Solder Joint Fatigue Models: Review and Applicability to Chip Scale Packages,” Microelectronics Reliability, Vol. 40, 2000, pp. 231-244.
20. L. F. Coffin, Jr., “A Study of the Effects of Cyclic Thermal Stresses on a Ductile Metal,” Transactions of ASME, Vol. 76, 1954, pp. 931-950.
21. S. S. Manson, “Behavior of Materials under Conditions of Thermal Stress,” Heat Transfer Symposium, University of Michigan Engineering Research Institute, 1953, pp. 9-75.
22. H. D. Solomon, “Fatigue of 60/40 Solder,” IEEE Transactions on Components, Hybrids, and Manufacturing Technology, Vol. 9, 1986, pp. 423-432.
23. L. F. Coffin Jr., “Fatigue at High Temperature,” pp. 5-34 in Fatigue at Elevated Temperature, ASTM STP 520, Edited by A. E. Carden, A. J. McEvily, and C. H. Wells, American Society for Testing Materials, Philadelphia, PA, 1973.
24. C. Kanchanomai, Y. Miyashita, Y. Mutoh, and S. L. Mannan, “Influence of Frequency on Low Cycle Fatigue Behavior of Pb-Free Solder 96.5Sn-3.5Ag,” Materials Science and Engineering A, Vol. 345, 2003, pp. 90-98.
25. X. Q. Shi, H. L. J. Pang, W. Zhou, and Z. P. Wang, “Low Cycle Fatigue Analysis of Temperature and Frequency Effects in Eutectic Solder Alloy,” International Journal of Fatigue, Vol. 22, 2000, pp. 217-228.
26. W. Engelmaier, “Fatigue Life of Leadless Chip Carrier Solder Joints During Power Cycling,” IEEE Transactions on Components, Hybrids, and Manufacturing Technology, Vol. 6, 1983, pp. 232-237.
27. S. Knecht and L. Fox, “Integrated Matrix Creep: Application to Accelerated Testing and Lifetime Predition,” Chapter 16 in Solder Joint Reliability: Theory and Applications, Edited by J. H. Lau, Van Nostrand Reinhold, New York, 1991.
28. A. R. Syed, “Thermal Fatigue Reliability Enhancement of Plastic Ball Grid Array (PBGA) Packages,” pp. 1211-1216 in Proceedings of the 46th Electronic Components and Technology Conference, Edited by R. R. Tummala and J. E. Billigmeier, Institute of Electrical and Electronics Engineers, New York, NY, 1996.
29. J. A. Collins, Failure of Materials in Mechanical Design: Analysis, Prediction, Prevention, 2nd Ed., John Wiley＆Sons, Inc., New York, USA, 1993, pp. 256-258.
30. J. A. Collins, Failure of Materials in Mechanical Design: Analysis, Prediction, Prevention, 2nd Ed., John Wiley＆Sons, Inc., New York, USA, 1993, pp. 488-494.
31. Y. Kariya, T. Morihata, E. Hazawa, and M. Otsuka, “Assessment of Low-Cycle Fatigue Life of Sn-3.5 mass% Ag-X (X=Bi or Cu) Alloy by Strain-Range Partitioning Approach,” Journal of Electronic Materials, Vol. 30, 2001, pp. 1184-1189.
32. C. Kanchanomai, Y. Miyashita, and Y. Mutoh, “Low-Cycle Fatigue Behavior and Mechanisms of a Lead-Free Solder 96.5Sn/3.5Ag,” Journal of Electronic Materials, Vol. 31, 2002, pp. 142-151.
33. C. Kanchanomai, Y. Miyashita, and Y. Mutoh, “Low-Cycle Fatigue Behavior of Sn-Ag, Sn-Ag-Cu, Sn-Ag-Cu-Bi, Lead-Free Solders,” Journal of Electronic Materials, Vol. 31, 2002, pp. 456-465.
34. C. Kanchanomai, Y. Miyashita, Y. Mutoh, and S. L. Mannan, “Influence of Frequency on Low Cycle Fatigue Behavior of Pb-Free Solder 96.5Sn-3.5Ag,” Materials Science and Engineering A, Vol. 345, 2003, pp. 90-98.
35. C. Kanchanomai and Y. Mutoh, “Effect of Temperature on Isothermal Low Cycle Fatigue Properties of Sn-Ag Eutectic Solder,” Materials Science and Engineering A, Vol. 381, 2004, pp. 113-120.
36. C. Kanchanomai and Y. Mutoh, “Low-Cycle Fatigue Prediction Model for Pb-Free Solder 96.5Sn-3.5Ag,” Journal of Electronic Materials, Vol. 33, 2004, pp. 329-333.
37. J. H. L. Pang, “Low Cycle Fatigue Study of Lead Free 99.6Sn-0.7Cu Solder Alloy,” International Journal of Fatigue, Vol. 26, 2004, pp. 865-872.
38. J. H. L. Pang, “Low Cycle Fatigue Models for Lead-Free Solders,” Thin Solid Films, Vol. 462-463, 2004, pp. 408-412.
39. K. S. Kim, S. H. Huh, and K. Suganuma, “Effects of Cooling Speed on Microstructure and Tensile Properties of Sn-Ag-Cu Alloys,” Materials Science and Engineering A, Vol. 333, 2002, pp. 106-114.
40. “Standard Practice for Strain-Controlled Fatigue Testing,” ASTM E606-92, Annual Book of ASTM Standards, Vol. 3.01, American Society for Testing and Materials, West Conshohocken, PA, USA, 1998, pp. 528-542.
41. H.-C. Tseng, “Low-Cycle Fatigue Behavior of Lead-Free Solders for Electronic Packaging Use,” M.S. Thesis, National Central University, Jhong-Li, Taiwan, 2003. (in Chinese)
42. Keyence LS-7500 Series User’s Manual, Keyence Co., Osaka, Japan, 2001.
43. M. E. Loomans and M. E. Fine, “Tin-Silver-Copper Eutectic Temperature and Composition,” Metallurgical and Materials Transactions A, Vol. 31A, 2000, pp.1155-1162.
44. K. W. Moon, W. J. Boettinger, U. R. Kattner, F. S. Biancaniello, and C. A. Handwerker, “Experimental and Thermodynamic Assessment of Sn-Ag-Cu Solder Alloys,” Journal of Electronic Materials, Vol. 29, 2000, pp. 1122-1136.
45. S. L. Mannan, “Role of Dynamic Strain Aging in Low Cycle Fatigue,” Bulletin of Materials Science, Vol. 16, 1993, pp. 561-582.
46. R. E. Read-Hill and R. Abbaschian, Physical Metallurgy Principles, 3rd Ed., PWS Publishing Company, Inc., Boston, USA, 1994, pp. 294-298.
47. W. Schutz, “Fatigue Life Prediction for Aircraft Structure and Materials,” NATO AGARD-LS-62, 1973, pp. 10-1~10-32.
48. C.-K. Lin and Y.-L. Pai, “Low-Cycle Fatigue of Austempered Ductile Irons at Various Strain Ratios,” International Journal of Fatigue, Vol. 21, 1999, pp. 45-54.
49. J. A. Collins, Failure of Materials in Mechanical Design: Analysis, Prediction, Prevention, 2nd Ed., John Wiley＆Sons, Inc., New York, USA, 1993, pp. 401-404.
50. K. Ohji, W. R. Miller, and J. Marin, “Cumulative Damage and Effect of Mean Strain in Low Cycle Fatigue of a 2024-T351 Aluminum Alloy,” Journal of Basic Engineering, ASME Transactions, Vol. 88, Series D, 1966, p. 801.
51. D.-Y. Chu, “Creep Behavior of Sn-3.5Ag and Sn-3.5Ag-0.5Cu Lead-Free Solders,” M.S. Thesis, National Central University, Jhong-Li, Taiwan, 2004.
52. J. K. Tien, S. V. Nair, and V. C. Nardone, “Creep-Fatigue Interaction in Structural Alloys,” pp. 179-213 in Flow and Fracture at Elevated Temperatures, Edited by R. Raj, Carnes Publication Services, Inc., Philadelphia, USA, 1983.
53. C. Gandhi, “Fracture Mechanism Maps for Metals and Alloys,” pp. 83-119 in Flow and Fracture at Elevated Temperatures, Edited by R. Raj, Carnes Publication Services, Inc., Philadelphia, USA, 1983.

指導教授

林志光(Chih-Kuang Lin)

審核日期

2005-7-11

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