以微陽極導引電鍍法製作鎳銅合金微柱

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鄭家宏(Jia-Hong Jeng) 查詢紙本館藏

畢業系所

機械工程學系

論文名稱

以微陽極導引電鍍法製作鎳銅合金微柱
(Fabrication of micrometer columns by micro-anode guided eletroplating)

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摘要(中)

摘要
本研究以微陽極導引電鍍法(Micro anode guided electroplating,MAGE)製作鎳銅合金微柱，討論在(1.硫酸鹽。2.檸檬酸鹽)兩種溶液中製作微鎳銅合金微柱之可行性。實驗中改變兩極偏壓及鍍浴中硫酸銅莫耳濃度探討其對鎳銅合金微柱中鎳/銅比例與微柱形貌影響。
檸檬酸鹽鍍浴中，偏壓4.2V，兩極間距為10μm，所得微柱均為鎳銅合金成分。改變溶液中的硫酸銅莫耳濃度對合金微柱之形貌影響甚鉅，硫酸銅添加4mM時所製得合金微柱表面平滑且表面顆粒粗細均勻；若添硫酸銅加超過8mM，微柱表面開始不平整且有不均勻顆粒狀析出物。
檸檬酸鹽鍍浴中，硫酸銅濃度維持在4mM，兩極間距固定為10μm、兩極偏壓逐漸由3.8V、4.0V、4.2V增加至4.4V，微柱中合金成份鎳/銅比例分別由 75/25、80/20、83/17增加至87/23；固定偏壓在3.8V時，微柱中和金成份鎳/銅之比例卻隨著鍍液中，硫酸銅濃度由4mM、8mM增加至12mM，由75/25、59/41降低至49/51，結果顯示：鎳銅合金微柱中鎳/銅比例隨著偏壓增加而變大；卻隨著硫酸銅濃度增加而變小。鎳銅合金微柱應可應用在溫度測量，其誤差值最小為0.7℃。

摘要(英)

Abstract
Micro-column with the composition of nickel-copper alloy was fabricated by micro anode guided electroplating (MAGE) method. There are two solutions were used (sulfate and citrate solution) for discussing the practicability of fabricating the micrometer Ni-Cu alloy column.
In experiment, we change the bias between anode and cathode, the concentration of copper sulfate in solution, in order to discussing the variation of the proportion of nickel to copper and the surface morphology of micro Ni-Cu alloy column by SEM.
In the citrate solution, we can fabricate a uniform micro Ni-Cu alloy column at the applied voltage was 4.2V and the gap between anode with cathode is 10μm. Changing the concentration of copper sulfate in solution is the most effect of the surface morphology and the structure of the micro-alloy column.
As the concentration of copper sulfate in solution is 4mM, the surface morphology of micro Ni-Cu alloy column is more smoothly and the structure is more solidly. When the concentration of copper sulfate is increasing to 8mM, the deposits on the column surface is becoming to roughly deposit and the diameter of column uniformly.
The proportion of nickel to copper is increasing from 75/25、80/20、83/17 to 87/23 with the in creasing of the applied voltage between the anode and cathode, but the proportion of nickel to copper is decreasing from 75/25、59/41 to 49/51 with the increasing of the concentration of copper sulfate in bath.
We did fabricated the micro Ni-Cu alloy column and successfully make use of measuring temperature.

關鍵字(中)

★ 鎳銅合金微柱
★ 合金電鍍
★ 微陽極導引電鍍

關鍵字(英)

★ micro Ni-Cu column
★ micro anode guided electroplating
★ alloy electroplating

論文目次

目錄
摘要 I
致謝 IV
目錄 V
表目錄 X
圖目錄 XI
壹、前言 1
1-1研究背景 1
1-2研究動機與目的 3
貳、文獻回顧及理論 4
2-1文獻回顧 4
2-2-1 微製造技術 4
2-1-2 國外發展 4
2-1-3 國內發展 6
2-2 電鍍原理 7
2-3局部微電鍍概說 8
2-4 微陽極導引電鍍法 9
2-4-1微電極之特性 9
2-4-2微電極之限制 11
2-5 濃度極化之影響 12
2-6合金電鍍原理 12
2-7 熱電偶量測原理 16
2-7-1 西貝克效應 (seedbeck effect) 16
2-8 熱電理論的三定律 17
2-8-1 均勻線路定律 17
2-8-2 中間金屬定律 17
2-8-2 中間溫度定律 18
参、實驗與設備 19
3-1實驗流程圖 19
3-2電極與試片製作 19
3-2-1 陽極製作流程 19
3-2-2 陰極製作流程 19
3-2-3 電解槽 20
3-3 實驗方法 20
3-3-1間歇式微電鍍 20
3-3-2合金電鍍實驗 21
3-3-2-1硫酸鎳與硫酸銅混合液 22
(a)改變硫酸銅濃度實驗 22
(b) 改變電鍍電壓實驗 22
3-3-2-2檸檬酸鹽溶液 23
(a)改變硫酸銅濃度實驗 23
(b) 改變電鍍電壓實驗 23
(c) 改變間距之實驗 24
3-3-3 熱電性質量測實驗 24
3-4 使用儀器簡介 25
3-4-1實驗設備 25
3-4-2 檢測儀器 27
肆、結果 29
4-1 硫酸鹽鍍浴製備鎳銅合金微柱 29
4-1-1 SEM形貌觀察 29
4-1-1-1 改變兩極偏壓之結果 29
4-1-1-2改變硫酸銅濃度之結果 30
4-1-2 EDS定性分析 31
4-1-2-1 改變偏壓之結果 31
4-1-2-2改變硫酸銅濃度之結果 31
4-2檸檬酸鹽鍍浴製備鎳銅合金微柱 32
4-2-1 SEM形貌觀察 32
4-2-1-1改變硫酸銅濃度之結果 32
4-2-1-2 改變兩極偏壓之結果 33
4-2-1-3 改變兩極間距之結果 34
4-2-2 EDS定性分析 34
4-2-2-1改變硫酸銅濃度之結果 35
4-2-2-2元素分布之結果 36
4-2-3 ICP定量分析 38
4-2-4 陰極極化曲線 39
4-2-4-1檸檬酸鎳溶液 39
4-2-4-2 檸檬酸銅溶液 40
4-2-4-3 檸檬酸銅鎳溶液 40
4-2-4-4改變不同硫酸銅莫耳濃度之結果 41
4-2-5 即時電鍍電流與電位監測 42
4-2-5-1 即時電鍍電流監測 42
4-2-5-2 即時電鍍電位監測 43
4-3 鎳銅合金微柱熱電性質 44
伍、討論 45
5-1 製備鎳銅合金微柱之可行性 45
5-1-1 以硫酸鹽鍍浴製備鎳銅合金微柱 45
5-1-2 以檸檬酸鹽鍍浴製備鎳銅合金微柱 47
5-2硫酸鹽鍍浴中偏壓與硫酸銅濃度對於微柱形貌之影響 50
5-2-1 偏壓對於微柱形貌之影響 50
5-2-2硫酸銅濃度對於微柱形貌之影響 50
5-3 檸檬酸鹽鍍浴中偏壓、硫酸銅濃度及間距對於微柱形貌之影響 51
5-3-1 濃度之影響 51
5-3-2 偏壓之影響 52
5-3-3 間距之影響 53
5-4 檸檬酸鹽鍍浴中偏壓與硫酸銅濃度對微柱中鎳/銅含量之影響 54
5-5 微柱中鎳/銅比例對熱電性質測量之影響 55
陸、結論 57
柒、參考文獻 58

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指導教授

林景崎(Jing-Chie Lin)

審核日期

2005-7-21

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