高功率LED固晶技術之研究

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姓名

許俊昇(Jyun-Sheng Syu) 查詢紙本館藏

畢業系所

光電科學與工程學系

論文名稱

高功率LED固晶技術之研究
(Study of die bond for high-power LEDs)

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摘要(中)

本論文中，進行三種不同固晶封裝方式，分別對不同製程下之晶片接合表現進行分析，並且利用實驗，發展出具有穩定性與一致性之金錫合金製程技術，配合X-ray分析與推力測試，對於三種不同固晶接合方式，進行機械強度之評比。
接著，提昇熱阻系統量測之穩定性與準確度，並對於不同固晶方式之LED進行熱阻量測分析，區分三種固晶方式之熱阻值優劣，最後，以熱循環測試LED，藉此進行不同固晶方式下，產品之可靠度分析，文末，以上述方式，驗證並討論出對於高功率白光LED最優異之封裝固晶技術。

摘要(英)

In this thesis, we study three different kinds of die bonding process and analyze their bonding strength. By experimentation, we develop a eutectic bonding process which is not only stable but also identical. Besides, we implement the LED assembly analysis by x-ray inspection and die shearing test.
Furthermore, we enhance the stabilization and accuracy of the thermal resistance measurement system, also, measure the thermal resistance of these three die bonding process and rank them. Finally, we tested LED reliability by thermal cycle. Through the comparison between the foregoing methods, we get the best die bonding technique for high power white-light LED.

關鍵字(中)

★ 固晶接合
★ 高功率LED
★ 封裝
★ 金錫合金

關鍵字(英)

★ eutectic
★ package
★ LED
★ high-power LED
★ Die bonding

論文目次

目錄
摘要 ......................................................................................................... II
ABSTRACT ........................................................................................... III
致謝 ....................................................................................................... IV
圖索引 ................................................................................................... IX
表索引 .................................................................................................. XV
第一章緒論
1-1 LED背景 ....................................................................................... 1
1-2研究動機與目的 .......................................................................... 4
1-3論文大綱 ....................................................................................... 6
第二章常見封裝固晶結構與形式 .................................................. 7
2-1引言 ................................................................................................ 7
2-2 LED固晶技術介紹 ..................................................................... 7
2-3破壞性推力測試法規 ................................................................. 9
2-4銀膠與錫膏固晶材料 ............................................................... 10
2-4-1 銀膠固晶方式 ...................................................................... 12
2-4-2 錫膏固晶方式 ...................................................................... 13
2-5 X-RAY與推力值分析 ............................................................. 15
第三章金錫合金固晶技術(AU/SN EUTECTIC BONDING) ....... 23
3-1引言 ............................................................................................ 23
3-2金錫合金介紹 .......................................................................... 24
3-3金錫合金製程測試 ................................................................. 27
3-3-1晶片吸取頭結構修正 ........................................................ 34
3-3-2金錫合金製程 .................................................................... 34
3-4金錫合金之X-RAY拍攝與推力值分析 .............................. 36
3-5三種固晶方式之比較 ............................................................ 39
第四章熱阻量測技術 .................................................................. 48
4-1引言 ......................................................................................... 48
4-2界面溫度(JUNCTION TEMPERATURE)與熱阻量測方式.... 49
4-2-1界面溫度量測方式 .......................................................... 49
4-2-2順向偏壓法與熱阻量測方式 .......................................... 51
4-3驗證系統穩定性與準確度 ................................................... 54
4-4不同固晶方式之熱阻值驗證 ............................................... 55
第五章 LED環境測試 ................................................................... 65
5-1 LED環境測試方法 ................................................................ 65
5-2環境測試實驗架構 ................................................................. 67
5-3不同固晶方式之環測數據分析 .......................................... 68
第六章結論..................................................................................... 81
參考文獻 ......................................................................................... 82
中英文名詞對照表 ........................................................................ 85

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指導教授

孫慶成(Ching-Cherng Sun)

審核日期

2009-10-16

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