Sn-3Ag-0.5Cu-XNi(X=0.0~0.1 wt%)銲料迴銲後機械性質與電化學遷移之探討

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彭中南(Chung-nan Peng) 查詢紙本館藏

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論文名稱

Sn-3Ag-0.5Cu-XNi(X=0.0~0.1 wt%)銲料迴銲後機械性質與電化學遷移之探討
(Mechanical property and Electrochemical Migration of the Sn-3Ag-0.5Cu-XNi(X=0.0~0.1 wt%) Reflowed on Cu-pads in various solution.)

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摘要(中)

本論文在探討四元無鉛銲料Sn-3Ag-0.5Cu-XNi(X=0.0~0.1)迴銲後之界面結構、機械性質以及電化學遷移行為。
由金相圖觀察得知，在Sn-3Ag-0.5Cu銲料中添加微量的鎳(0.005~0.1%)，組織並沒什麼變化，但會讓Cu6Sn5與Cu3Sn變為(Cu,Ni)6Sn5與(Cu,Ni)3Sn，若鎳濃度增加，將會使較粗的介金屬化合物層變為較細的(Cu,Ni)6Sn5。
在錫球的ㄧ半(大約160μm)切面進行微硬度的量測，跟在錫球的1/4(大約80μm)的地方進行推球試驗ㄧ樣，發現微硬度(Hv)及推球強度(N)隨著鎳含量的增加並沒有什麼太大的改變，然而若在介金屬層附近的地方進行量測(大約15μm)，則發現微硬度會隨著鎳含量的添加(0.005~0.1wt%)從23.12±0.21(Hv)，上升到26.28±0.34(Hv)，而推球強度則會從22.12±0.12 (N)，上升到28.34±0.47 (N)。
在電化學遷移試驗方面，Sn-3Ag-0.5Cu-XNi(X=0.0~0.1)以250℃熱處裡迴銲在銅墊上，浸入逆滲透純水(導電度約10.6μS/cm)中，施加不同偏壓(2V,3V及5V)，量測其電化學遷移時兩極間之電流，當電流急速上升造成兩極短路所耗費的時間，稱為電化學遷移時間(tm)，比較此四元銲錫之電化學遷移時間(tm)顯示：當施加3V偏壓時，隨著銲料中鎳含量從0.0增加至0.1wt%，其電化學遷移時間(tm)從66秒縮短到28秒，但若與傳統錫鉛銲料相比，則Sn-3Ag-0.5Cu-XNi(X=0.0~0.1)仍優於傳統錫鉛。
由陽極動態及化曲線可以得知，隨著鎳含量的增加其陽極電流越大，顯示隨著鎳含量的增加，會促進陽極表面金屬離子的解離，與陰極表面金屬離子的還原。

摘要(英)

The microstructure, mechanical properties and electrochemical migration for the Sn-3Ag-0.5Cu-XNi(X=0.0~0.1) lead-free solders reflowed on Cu-pads were investigated. Metallurgical observation indicated that a slight addition (0.005~0.100 wt%)of nickel in the Sn-3Ag-0.5Cu solder caused no marked change in the bulk microstructure but led to thicken the interlayer by formation of (Cu, Ni)6Sn5 on the (Cu, Ni)3Sn instead of Cu6Sn5 on Cu3Sn. The higher nickel concentration, the thicker is the intermetallic layer in which finer (Cu, Ni)6Sn5 distributed.
At the half-level (roughly 160 μm -height from the pad) and one fourth-level (about 80 μm -height from the pad) of the solder hemisphere, both the microhardness (Hv) and shear strength were almost invariant with increasing the addition of nickel. However, at the level near the intermetallic layer (with a height of 15 μm Cu-pad) the microhardness increased from 23.12±0.21(Hv) to 26.28±0.34(Hv) and the shear strength increases from 22.12±0.12 (N) to 28.34±0.47 (N) with increasing nickel from 0.005 to 0.100 wt%.
In the electrochemical migration test, a couple of conductors made of Sn-3Ag-0.5Cu-XNi(x=0.0~0.1) on Cu-pads annealed at 250℃ for 60 s was immersed in de-ionized water (with conductivity of 10.6μS/cm) exerted with 2, 3 and 5 V across the conductors. The duration of short circuit was defined as the migration time(tm) that was determined by a sudden rise of current. At a bias of 3 V, the magnitude of tm decreased from 66s to 28s with increasing the nickel content from 0 to 0.100 wt% in the solder. However, the resistance to migration is much better for Sn-3Ag-0.5Cu-XNi(X=0.0~0.1) solders than the traditional Sn-Pb one.
The anodic potentiodynamic polarization shows that the anodic current of Sn-3Ag-0.5Cu-XNi(X=0.0~0.1) solder increase with increasing nickel content in the solders. It implies that dissolution of metal contents from the anode and their re-deposition on cathode increases with increasing the nickel content.

關鍵字(中)

★ 電化學遷移
★ 銲料

關鍵字(英)

★ electrchemical migration
★ solder

論文目次

摘要(中文) I
摘要(英文) III
致謝 Ⅳ
目錄 V
表目錄 XI
圖目錄 XII
第一章前言 1
1.1 電子構裝相關知識介紹 1
1.2 晶片連接方式 5
1.3 無鉛銲錫的崛起 8
1.4 Sn-Ag-Cu合金銲料近年來發展優勢 11
1.5 研究動機與目的 13
第二章文獻回顧與理論 15
2.1 電化學理論 15
2.1.1 金屬的遷移 15
2.2 各種元素的遷移反應 17
2.2.1 錫的電化學遷移 17
2.2.2 銀的電化學遷移 19
2.2.3 銅的電化學遷移 20
2.2.4 鎳的電化學遷移 21
2.3 合金的電化學遷移 23
2.3.1 合金的溶解 23
選擇性溶解（selective dissolution） 23
同時溶解（simultous dissolution） 23
2.4 無鉛銲錫中添加鎳元素之研究 24
第三章實驗方法 25
3.1 實驗流程圖簡介 25
3.2 銅基板製備 25
3.2.1 選用電路板 25
3.2.2 製作光罩 26
3.2.3 洗電路板 26
3.2.4 剪裁 26
3.3 Sn-3Ag-0.5Cu無鉛銲料的製備 26
3.3.1 母合金的製作 26
(a) Sn-Cu 母合金熔煉 26
(b) Sn-Ni 母合金熔煉 27
3.3.2 Sn-3Ag-0.5Cu-xNi 無鉛銲料熔煉程序 27
3.3.3 澆鑄 27
3.3.4 檢測無鉛銲料成分 27
3.3.5 後段試片製作 28
(a)滾壓 28
(b) 剪切 28
3.4電化學實驗槽體製作 28
3.4.1電化學遷移實驗 29
3.4.2陽極動態極化掃描 29
3.4.3 陽極銲球之絕對反應電位量測 30
3.4.4推球試驗 30
3.4.5微硬度試驗 31
3.5儀器分析 32
3.5.1 感應耦合電漿質譜儀(ICP-MS Inductively Coupled Plasma Mass Spectrometer) 32
3.5.2光學顯微鏡（OM）觀察 32
3.5.3 掃描式電子顯微鏡（SEM）拍攝分析 33
第四章結果 34
4.1 Sn-3Ag-0.5Cu-XNi(X=0.0~0.1wt%)迴銲後之金相觀察、結構分析與表面分析 34
4.1.1 Sn-3Ag-0.5Cu-XNi(X=0.0~0.1wt%)迴銲後之金相觀察 34
4.1.2 Sn-3Ag-0.5Cu-XNi(X=0.0~0.1wt%)迴銲後銲球與銅墊介面之SEM觀察與EDS分析 34
4.1.3 Sn-3Ag-0.5Cu-XNi(X=0.0~0.1wt%)迴銲後之FE-EPMA結果 35
4.1.4 EPMA之Color Mapping 分析 35
4.1.5 銲料迴銲完之微硬度結果 36
4.1.6 銲料迴銲完之推球結果 36
4.2 Sn-3Ag-0.5Cu-XNi(X=0.0~0.1)在水中之電化學遷移 37
4.2.1電化學遷移之短路電流量測 37
4.2.2 Sn-3Ag-0.5Cu-XNi(X=0.0~0.1)在不同偏壓(2V、3V、5V)下之曲線遷移電流與時間關係 37
4.2.3兩迴銲電極間析出物的觀察 38
4.3 Sn-3Ag-0.5Cu-XNi(X=0.0~0.1wt% )在導電度為50000μS/cm溶液中的電化學遷移 39
4.3.1 在不同偏壓下Sn-3Ag-0.5Cu-XNi(X=0.0~0.1)遷移電流與時間之關係 39
4.4 Sn-3Ag-0.5Cu-XNi(X=0.0~0.1wt% )在10.6µS/cm逆滲透純水中之極化分析 40
4.4.1 純金屬在導電度為10.6μs/cm逆滲透純水中之動態極化曲線分析 40
4.4.2 Sn-3Ag-0.5Cu-XNi(X=0.0~0.1wt% )在10.6µS/cm逆滲透純水中之陽極動態極化分析 40
4.4.3 相對電位量測 41
第五章討論 42
5.1微結構與機械性質相關性 42
5.1.1迴銲後錫球中的金相 42
5.1.2迴銲後錫球中的介金屬化合物 43
5.1.3鎳含量對機械性質的影響 45
5.2 銲料之電化學行為探討 47
5.2.1 銲料在水中之電化學遷移行為 47
第六章結論 52
第七章參考文獻 54

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指導教授

林景崎(Jing-chie Lin)

審核日期

2007-7-18

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