博碩士論文 953203021 詳細資訊




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姓名 林宗漢(Zong-Han Lin)  查詢紙本館藏   畢業系所 機械工程學系
論文名稱 以微陽極導引電鍍法於氯化膽鹼離子液體中析鍍鎳之研究
(Micro-Anode Guided Electroplating of Nickel from the Bath of Choline Chloride Based Ionic Liquids)
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摘要(中) 本論文主旨在於:自含鎳離子之乙二醇或尿素之氯化膽鹼離子液體鍍浴系統中,利用微陽極導引法進行鎳金屬之微電鍍研究。藉由改變析鍍參數(如: 溫度、偏壓、微陽極之起鍍間距、鍍液成分、硼酸的添加與否)等,討論其對析鍍行為之影響,除了以掃描式電子顯微鏡觀察析鍍物之形貌外,進一步利用析鍍電流監測,以及採用有限元素法之電場模擬等資料,從電場強度、電荷交換及質傳速率等差異,來理解離子溶液中微電鍍鎳之行爲。
隨著溫度提升,導致鍍液黏度下降及離子擴散係數提高,使鍍浴中質傳效果增高。改變鍍浴成份時(提高鍍液中之乙二醇比例),將可提升鍍浴導電率,增大析鍍電流,因而加速電荷之交換。微陽極之起鍍間距增加,會導致電場強度減弱,降低析鍍電流,減緩電荷交換速率。偏壓增加則會提高電場強度,增高析鍍電流,加速電荷交換。添加硼酸則可防止因鍍浴pH升高,而在析鍍時生長出氫氧化鎳。
摘要(英) Micro-anode guided electroplating (MAGE) of nickel from the bath of ionic liquid system such as choline chloride, including choline chloride/urea and choline chloride/ethylene glycol, has been investigated. Experimental parameters such as bath temperature, electrical bias, gap between two electrodes, mole ratio of ethylene glycol to choline chloride in the bath, addition of boric acid in the bath were concerned to explore their influence on the morphology of the Ni-deposit. Electron scanning microscopy (SEM) was used to examine the
morphology of the deposits. The current in the depositing process was monitored. Finite element analysis was employed to comprehend the electroplating mechanism of MAGE in the ionic liquid system by virtue of
electric field strength, electron transfer process and the rate of mass transfer.
With increasing bath temperature, the viscosity of the electrolyte decreased. The decrease of viscosity results in diffusion enhancement of the electro-active species thus facilitating their mass transport. The conductivity of the system was found to increase with increasing the ratio of ethylene glycol to choline chloride in the bath. The strength of electric field will reduce if the initial gap between the electrodes is extended or less electrical bias was employed. The bath involved boric acid tends to maintain a constant pH value and the possible formation of nickel hydroxide could be prevented.
關鍵字(中) ★ 氯化膽鹼
★ 離子液體
★ 微陽極導引電鍍法
★ 鎳
關鍵字(英) ★ micro anode guided electroplating
★ ionic liquid
★ nickel
★ choline chloride
論文目次 中文摘要 …………………………………………………………… I
英文摘要 …………………………………………………………… II
誌謝 …………………………………………………………… III
目錄 …………………………………………………………… IV
圖目錄 …………………………………………………………… VIII
表目錄 …………………………………………………………… XII
壹、 簡介……………………………………………………… 1
1-1 研究背景………………………………………………… 1
1-2 微陽極導引電鍍法……………………………………… 2
1-3 離子液體………………………………………………… 3
1-4 研究動機與目的………………………………………… 4
貮、 文獻回顧及原理學說…………………………………… 6
2-1 文獻回顧………………………………………………… 6
2-1-1 微電析之國外發展……………………………………… 6
2-1-2 微電析之國內發展……………………………………… 8
2-1-3 離子液體之國外發展…………………………………… 10
2-1-4 離子液體之國內發展…………………………………… 12
2-2 電鍍原理………………………………………………… 13
2-2-1 直流電電鍍……………………………………………… 13
2-2-2 物質移動之途徑………………………………………… 14
2-2-3 電荷交換程序…………………………………………… 17
2-3 微陽極導引電鍍概說…………………………………… 17
2-3-1 微陽極導引電鍍原理…………………………………… 17
2-3-2 微電極之特性…………………………………………… 18
2-3-3 微電極之限制…………………………………………… 20
2-3-4 微電極情況下濃度極化之影響………………………… 21
2-4 離子液體性質概說……………………………………… 21
2-4-1 離子液體之熔點………………………………………… 21
2-4-2 離子液體之親水性……………………………………… 22
2-4-3 離子液體之電位窗……………………………………… 22
2-4-4 離子液體之選用………………………………………… 22
參、 實驗設備與方法………………………………………… 24
3-1 鍍浴組成………………………………………………… 24
3-1-1 藥品……………………………………………………… 24
3-1-2 調配方法………………………………………………… 24
3-2 電極製作………………………………………………… 25
3-2-1 微陽極製作流程………………………………………… 25
3-2-2 陰極試片製作流程……………………………………… 25
3-3 實驗方法………………………………………………… 26
3-3-1 實驗流程………………………………………………… 26
3-3-2 微電鍍實驗……………………………………………… 26
3-4 儀器設備………………………………………………… 27
3-4-1 實驗儀器………………………………………………… 27
3-4-2 檢測儀器………………………………………………… 29
肆、 結果……………………………………………………… 31
4-1 沉積物之瘤狀物與表面顆粒之定義…………………… 31
4-2 氯化膽鹼/尿素離子液體之析鍍結果………………… 31
4-3 氯化膽鹼/乙二醇離子液體之析鍍結果……………… 31
4-3-1 不同溫度下之析鍍結果………………………………… 31
4-3-1-1 鍍浴溫度對沉積物成長之影響…………………… 32
4-3-1-2 鍍浴溫度對沉積物形貌之影響…………………… 32
4-3-2 不同偏壓下之析鍍結果………………………………… 32
4-3-2-1 析鍍偏壓對沉積物成長之影響…………………… 32
4-3-2-2 析鍍偏壓對沉積物形貌之影響…………………… 33
4-3-3 不同兩極間距之析鍍結果……………………………… 33
4-3-4 不同鍍液組成之析鍍結果……………………………… 34
4-3-5 鍍液中添加硼酸之析鍍結果…………………………… 34
4-4 析鍍電場模擬…………………………………………… 35
4-4-1 氯化膽鹼/尿素配方中析鍍鎳之電場模擬…………… 35
4-4-2 氯化膽鹼/乙二醇配方中析鍍鎳之電場模擬………… 35
伍、 討論……………………………………………………… 36
5-1 溫度對析鍍之影響……………………………………… 36
5-2 偏壓及間距對析鍍之影響……………………………… 38
5-3 鍍浴組成對析鍍之影響………………………………… 39
5-4 添加硼酸對析鍍之影響………………………………… 39
陸、 結論……………………………………………………… 41
柒、 未來展望………………………………………………… 42
捌、 參考文獻………………………………………………… 43
參考文獻 [Abb1] Andrew P. Abbott, Glen Capper, David L. Davies, Raymond K. Rasheed and Vasuki Tambyrajah, “Novel Solvent Properties Of Choline Chloride/Urea Mixtures”, CHEM. COMMUN. , pp70-71, 2003.
[Abb2] Andrew P. Abbott, John C. Barron, Karl S. Ryder, and David Wilson[, “Eutectic-Based Ionic Liquids with Metal-Containing Anions and Cations”, Chem. Eur. J. , 13, pp. 6495-6501, 2007.
[Abb3] Andrew P. Abbott, Glen Capper, Katy J. McKenzie, Karl S. Ryder,“Electrodeposition of Zinc–Tin Alloys from Deep Eutectic Solvents based on Choline Chloride”, Journal of Electroanalytical Chemistry, Vol. 599, pp. 288-294, 2007.
[Abb4] Andrew P. Abbott, Jason Griffith, Satvinder Nandhra, Cecil O'Connor, Stella Postlethwaite, Karl S. Ryder and Emma L. Smith, “Sustained electroless deposition of metallic silver from a choline
chloride-based ionic liquid”, Surface & Coatings Technology, 202, pp. 2033-2039, 2008.
[Abr] M. Abraham, J. Arnold, W. Ehrfeld, K. Hesch, H. Mobius,T. Paatzsch, C. Schulz, "Laser-LIGA: A Cost Saving Process for Flexible Production of Micro-structures ", SPIE, Vol. 2639, pp.164-173, 1995.
[Alk] Richard C. Alkire and Tan-Jen Chen, ”High-Speed
Selective Electroplating with Single Circular Jets”, J. Electrochem. Soc., Vol. 129, No. 11, pp.2424-2432, 1982.
[Bard1] A. J. Bard, R.Faulkner, Electrochemical Methods in
Electrochemistry, John Wiley& Sons, Inc., pp. 28-140, 2001.
[Bard2] A. J. Bard, R.Faulkner, Electrochemical Methods in
Electrochemistry, John Wiley& Sons, Inc., pp. 534-549, 2001.
[Boc] J. O’M. Bockris, D. M. Drazic, Electro-chemical Science, New York, Taylor & Francis Ltd, London and Haper & Row Publishers, Inc. Barnes & Noble Import Division, p.181, 1972.
[Bru] R. Bruck, K. Hahn, J. Steinecker, “Technology Description Methods for LIGA processes”, J. Micromech. Microeng, Vol. 5, pp.196-198, 1995.
[Chang] 張庭綱,”微陽極導引電鍍法製作微銅柱及銅柵欄之
研究”,國立中央大學機械工程學系碩士論文,2004。
[Chan] 熊楚強,王月,電化學,文京圖書,1996。
[Chen1] 陳承志,“銅基材上之單軸微電析鎳製程研究”,
國立中央大學機械工程研究所碩士論文,1999。
[Chen2] 陳泊余,“銅基材上之單軸微電析鎳製程研究”,國立成功大學化學工程研究所博士論文,2000。
[Coo] E. I. Cooper, E. J. M. O’ Sullivan, ” Proceeding of the eighth International Symposium of Molten Salts, Physical and High Temperature Materials Division Proceeding”, J. Electrochem. Soc, pp. 386, 1992.
[Crow] D. R. Crow, Principles and Applications of
Electrochemistry, 4th Edition, 高立圖書代理, 1994.
[Dat] M. Datta, L. T. Romankiw, D. R. Vigliotti, and R.
J. van Guffeld, “Jet and Laser-Jet Electrochemical
Micromachining of Nickel and Steel“, J. Electrochem. Soc., Vol. 136, No.8 August, pp.2251-2256, 1999.
[ElG] El-Giar E M and Thomson D J, Localized
electrochemical plating of interconnectors for
microelectronics Proc. IEEE Conf. Communications,
Power and Computing WESCANEX 97, pp.327-329, 1997.
[Gil] Eliezer Gilead i, “Electrode Kinetics”, VCH Publishers, Inc., 1993。
[Gon] A-M. Goncalves, C. Mathieu, M. Herlem, A. Etcheberry,“Using Pt microelectrodes in Liquid Ammonia for Studying Proton Reduction“, J. Electroanalytical Chemistry, Vol. 477, 1999, pp. 140-145, 1999.
[Hsiu] 許淑愛,“室溫離子熔液中電沈積碲化鎘及鈀銦合金”,國立成功大學化學工程研究所碩士論文,2003。
[Huang] 黃景帆,“低溫離子熔液中核磁共振與鎘(II)、錫(II)金屬離子電化學研究”,國立成功大學化學工程研究所碩士論文,2001。
[Hun] Madden J D and Hunter I W, “Three-dimensional
microfabrication by localized electrochemical
deposition”, J. Microelectromech. Syst., Vol. 5, pp. 24-32, 1996.
[Hur] F. H. Hurley, J. P. Wier, J. Electrochem. Soc., 98,
203, 1951.
[Iku] K. Ikuta, K. Hirowatari and T. Ogata, “Three dimens ional micro integrated fluid system (MIFS) fabricated by stereo lithography” , Journal of Micro Electro Mechanical System, pp.1-6, 1994.
[Jeng] 鄭家宏,”以微陽極導引電鍍法製作鎳銅合金微柱”,國立中央大學機械工程研究所碩士論文,2005。
[Kaw] 川崎元雄,呂政峰編譯,電鍍學,世一書局,1993。
[Kun] Masanori Kunieda, Ritsu Katoh, Yasushi Mori, “Rapid Prototyping by Selective Elecrodeposition Using
Electrolyte Jet”, Annals of the CIRP, Vol. 47, No.1, pp. 161-164, 1998.
[Lai] 賴格源,“微陽極導引電鍍銅其組織及底部覆蓋範圍之探討”,國立中央大學機械工程研究所碩士論文,2006。
[Low] F. A. Lowenheim, Electroplating, New York, McGraw
Hill, 1978.
[Mar] Shoji Maruo and Satoshi Kawata, “Two-photon-absorbed near infrared Photopolymerization for Three-Dimensional Microfabrication”, Journal of Microelectromechanical Systems, Vol. 7, No. 4, pp411-415, 1998.
[Rai] P. Rai-Choudhury editor, “HANDBOOK of Microlithography Micro-machining, and Micro-fabrication”, Volume 1 and 2, IEE Materials and Devices Series12 and 12B, 1997.
[Rom] Lubomyr T. Romankiw “Electrodeposition technology theory and practice” IBM T. J. Watson Research Centrt Yorktown Heights, New York, pp. 425-565, 1986.
[Sai] R.A. Said, “Shape Formation of Microstructures
Fabricatedby Localized Electrochemical Deposition”, J. Electrochemical Society, Vol.150, No.8, pp. 549-557, 2003.
[Tai] 戴嘉成,“室溫離子熔液中電沈積碲化銻”,國立成功大學化學工程研究所碩士論文,2004。
[Vis] A. E. Visser. R. P. Swatloski, W. M. Reichert, S. T. Griffin. R.D. Rogers, “Traditional Extractants in Nontraditional Solvents: Groups 1 and 2 Extraction by Crown Ethers in Room-Temperature Ionic Liquids”, Industrial and Engineering Chemistry Research, 39,
pp.3596-3604, 2000.
[Wal1] F. T. Wallenberger and M. Boman, “Inorganic fibers and microstructures directly from the vapour phase”, Composites Science and Technology, Vol. 51, pp.
193-212, 1994.
[Wal2] P. Walden, Bull. Acad. Imper. Sci, pp.1800, 1994.
[Wil] J. S. Wilkes, J. A. Levisky, R. A. Wilson, C. L. Hussey, Inorg. Chem., 21, pp.1263, 1982.
[Yang] 楊仁泓,”局部電化學沉積法之ㄧ維結構製程及機械
性質量測”,大葉大學機械研究所碩士論文,2004。
[Yeh] 葉柏青,“微陽極導引電鍍與監測”,國立中央大學機械工程研究所碩士論文,2000。
[Yeo1] S.H. Yeo and J.H. Choo, “On the effects of Ultrasonic vibrations on localized electrochemical deposition”, J. Micromech. Microeng., vol. 11, pp271-279, 2002.
[Yeo2] 游絢博,“陽極單軸間歇運動下之直流、脈衝微電析
鎳”,國立中央大學機械工程研究所碩士論文,2000。
[Yeo3] 游睿為,“單軸步進運動陽極在瓦茲鍍浴中進行微電析鎳過程之監測與解析”,國立中央大學機械工程研究所碩士論文,2001。
[Yoke] J. T. Yoke, J. F. Weiss and G. Tollin, Inorg. Chem., vol. 2, pp.1210,1963。
指導教授 林景崎(Jing-Chie Lin) 審核日期 2008-7-15
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