| 摘要(英) |
Solder jointing technology is very important for the modern electronic industry.
Due to Pb has a toxic nature and the environmental and health hazard concerns. So,
Pb-free solders are developed to replace SnPb. Yet, high strength mechanical
property, the superior creep resistance and thermal fatigue are the important issues for
the solder joint reliability. On the other hand, silver would be very costy in the
future. The low-cost Sn(Cu) alloys offer good advantages for the future Pb-free
solders. However, Cu and Ni are often used in the bond pads on the chip and broad
side for the current flip-chip interconnect structure. It has been reported that the
solder microstructure (Sn phase and eutectic structure) near the Ni side is weaker than
that near the Cu. But, we do not clearly understand the relation between solder joint
microstructure with hardness along Ni and Cu bond pad. So, the main objective of
this thesis is to study the correlation between the hardness and the microstructure of
Sn(Cu) alloys.
The microstructure of hyper-eutectic and hypo- eutectic of Sn(Cu) alloys are
investigated under different cooling rates and aging times. For the hypo-eutectic
Sn(Cu) alloys (Sn0.4Cu and Sn0.7Cu ), their microstructure mainly contain the
primary Sn grains and the eutectic structure. The eutectic structure is composed of
Sn phase and Cu6Sn5 compound phase. The major reason for the appearance of Sn
grains in the eutectic Sn0.7Cu should be due to the non-equilibrium cooling during
the solidification process of Sn0.7Cu alloy. Furthermore, for the Sn1.0Cu alloy,
round primary Cu6Sn5 particles was uniformly exhibited in Sn1.0Cu. For Sn1.4Cu
and Sn2.1Cu alloys, contain chunky Cu6Sn5 particles and eutectic structure of Sn and
Cu6Sn5 compound phase. It found that the hardness initially would increase with Cuadditives in Sn(Cu) alloys. As the Cu concentration reaches 1.0 wt%, the hardness
has a maximum value. Then, hardness started decreasing with Cu concentration.
According to our hardness testing results, the hardness is inversely proportional
to the Cu6Sn5 compound particle size and space. Thus, the hardness can be further
formulated as Rn
H = k4 1 and Ln
H = k3 1 , respectively. From Sn1.0Cu results
shown previously, it was further formula as empirical equation can be expressed as :
or , In conclusion, we formulate an the empirical
equation for regulating the hardness of Sn(Cu) solder alloys ;
and
or and . |
| 參考文獻 |
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