銅與鎳在銲料中的交互作用

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李魁斌(Quei-Pin Li) 查詢紙本館藏

畢業系所

化學工程與材料工程學系

論文名稱

銅與鎳在銲料中的交互作用
(Cross-Interaction of Ni and Cu in Sn)

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摘要(中)

在現今實際BGA或Flip Chip銲點中，銲料的兩端分別為UBM或表面處理層。故一個實際銲點結構可視為一metal/solder/metal的三明治結構。而Ni/solder/Cu的結構又是微電子銲點中很常見的一種組合。故本研究主要的目的是要探討在此類的結構中，Cu/solder及Ni/solder間的界面反應是否會互相影響。亦即在Ni/solder/Cu銲點之兩界面間是否會有交互作用？然而在本實驗室過去的研究中曾經證實[TSA2]，在Flip Chip銲點中兩界面之交互作用在迴銲完後就已發生。但由於在迴銲的過程中，兩端會有部分的金屬溶入銲料當中，使整個系統變的過於複雜。故在本研究中，我們使用電鍍的方式，製造出Flip Chip尺寸的Ni/Sn/Cu擴散偶。利用其不需經過複雜的迴銲過程的優點，來探討在單純200 ℃的固態反應下，Cu、Ni在銲料間交互作用的情況。並將之與作為對照組的單一Ni/Sn、Cu/Sn界面反應結果比較，觀察其三者間的差異。
在單純200 ℃的固態反應15分鐘的時間。由金相觀察的結果發現，Ni、Cu兩端界面皆生成Cu-Sn介金屬，其組成由EPMA分析得知為Cu6Sn5的介金屬。故我們可以得知，在此Ni/Sn/Cu擴散偶中，經過短時間的固態反應後，Cu端Cu原子已擴散至Ni端影響其界面介金屬的生成。亦即此時Cu、Ni間的交互作用已經產生。經過長時間的反應，Ni、Cu兩端生成的介金屬種類並沒有變化，在Ni端為(Cu1-xNix)6Sn5，Cu端則為不含Ni的Cu6Sn5及Cu3Sn。但在介金屬的形態上，卻與一般固/固反應界面生成物的形態較為不同，會呈現較大的高低起伏。在反應動力學方面，在Ni/Sn/Cu系統中，經過長時間的固態反應後，當對端有Cu層存在時，使Ni界面生成以Cu為主的(Cu1-x Nix)6Sn5，故會抑致Ni端Ni的消耗。相反的當對端有Ni層存在時，使兩端界面皆生成以Cu為主的介金屬Cu6Sn5及Cu3Sn，故會加速Cu端Cu的消耗。

摘要(英)

In a real solder joint, the solder is always sandwiches between two metals. And the Ni/solder/Cu combination is one of the most common one in microelectronics devices. The objective of this study is to investigate whether the cross-interaction will occur between the interface of solder/Cu and Ni/solder. In fact, it is reported that the two interfaces of Ni/solder/Cu joint would interact after reflow. Therefore, it is known that the dissolved metal results in the system become complex. As the result, the Ni/Sn/Cu diffusion couples were prepared by electroplating in this study to investigate the cross-interaction of Cu and Ni in solder joint only in solid/solid reaction. Experiments were carried out at 200 ℃ for 15 minutes. It was found that Cu6Sn5 compound existed at both Ni/Sn and Cu/Sn interface. Basing on the result, we can say that the cross-interaction of Ni and Cu in a solder joint occurred very quickly at 200 ℃thermal aging.
After long term thermal aging, the reaction product didn’t change at both Ni/Sn and Cu/Sn interface. There is(Cu1-xNix)6Sn5 at Ni/Sn interface and Cu6Sn5、Cu3Sn at Sn/Cu interface.Beside it, we found that the microstructure of these reaction product is different from Sn/Cu and Sn/Ni diffusion couple. In other words, the morphology of IMC is largger variation than Sn/Cu and Sn/Ni diffusion couple. In thermodynamic kinetics, it has been show that the formation of of (Cu1-xNix)6Sn5 over the Ni layer can reduce the Ni consumption rate. At the same time, the Cu consumption rate of the opposite side was accelerated.

關鍵字(中)

★ 鎳
★ 交互作用
★ 銅

關鍵字(英)

★ cross-interaction
★ Ni
★ Cu

論文目次

目錄
中文摘要……………………………………………………….……….Ⅰ
英文摘要……………………………………………………….……….Ⅲ
目錄……………………………………………………………………..Ⅳ
圖目錄…………………………………………………………..………Ⅵ
表目錄………………………………………………………………..ⅩⅠ
第一章緒論
1.1 微電子構裝技術 ……...………………………………..1
1.1.1 球矩陣式封裝(Ball Grid Arroy, BGA）…..........…..2
1.1.2覆晶製程技術（Flip Chip）………….…………..……4
1.2 無鉛銲料…………………………………………………6
1.3 實驗目的…………………………………………………7
第二章文獻回顧
2.1 含Cu銲料與Ni基材的界面反應………………..……..8
2.2 含Ni銲料與Cu基材的界面反應……………………..13
2.3 Cu與Ni在銲點中的交互作用………………………...19
2.4 實驗規劃…………………………………………...…..28
第三章實驗方法與步驟
3.1 Ni/Sn/Cu擴散偶固態熱處理反應(aging)實驗步驟….29
3.1.1 Ni/Sn/Cu擴散偶的製備…………..……………….29
3.1.2 Ni/Sn/Cu擴散偶固態熱處理反應…………..…….30
3.2 反應後試片的處理、觀察及分析………………….......33
3.2.1 試片之金相處理………….…………………….....33
3.2.2 試片的金相觀察及分析……………….………...34
第四章實驗結果與討論
4.1 Ni/Sn/Cu擴散偶在200 ℃之固態熱處理…………….36
4.2 Ni/Sn/Cu、Sn/Ni、Sn/Cu擴散偶間反應之比較……....48
4.2.1 Ni/Sn/Cu、Ni/Sn擴散偶的比較……………..........48
4.2.2 Ni/Sn/Cu、Cu/Sn擴散偶的比較…………………50
4.3 反應生成介金屬之動力學探討…………………….....54
4.3.1 Ni/Sn、Cu/Sn界面反應之動力學探討……….….54
4.3.2 Ni/Sn/Cu、Ni/Sn、Cu/Sn各界面反應動力學比較..59
4.4 Au/Sn/Cu結構與Ni/Sn/Cu結構的比較…...…………65
第五章結論……………………………………………………………69
參考文獻………………………………………………………………..72

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指導教授

高振宏(C. R. Kao)

審核日期

2005-6-28

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