參考文獻 |
1. P. G. Kim and K. N. Tu, J. Appl. Phys., 80(7), 3822, (1996).
2. C. Chen, C. E. Ho, A. H. Lin and C. R. Kao, J. Electronic Mater., 29(10),
1200, (2000).
3. S. W. Chen and Y. W. Yen, J. Electronic Mater., 28(11), 1203, (1999).
4. K. N. Tu, Acta Metall., 21, 347 (1973).
5. S. K. Kang and V. Ramachandran, Scripta Metall., 14, 421, (1980).
6. P. G. Kim, J. W. Jang and K. N. Tu, J. Appl. Phys., 86(12), 6746, (1999).
7. J. A. van Beek, S. A. Stolk, F. J. J. and van Loo, Z. Metallkde. 73, 439, (1982).
8. L. F. Miller, in Proc. IEEE Electr. Comp. and Conf., IEEE, New York, 52, (1968).
9. V. C. Marcotte and N. G. Koopman, in Proc. 31st IEEE Electr. Comp. Conf., IEEE, New York, 157, (1981).
10. K. Zeng and K. N. Tu, Mater. Science and Engineering R, 38, 55, (2002).
11. S. K. Kang, W. K. Choi, D. Y. Shih, P. Lauro, D. W. Henderson, T. Gosselin and D. N. Leonard, Electr. Comp. and Tech. Conf., 146, (2002).
12. S. W. Chen, S. H. Wu, and S. W. Lee, J. of Electronic Mater., 32, 1188, (2003).
13. C. M. Tsai, W. C. Luo, C. W. Chang, Y. C. Shieh and C. R. Kao, J. of Electronic Mater., 33, 1424, (2004).
14. S. J. Wang and C. Y. Liu, J. Electronic Mater., 32(11), 1303, (2003).
15. C. Y. Liu and S. J. Wang, J. Electronic Mater., 32(1), L1, (2003).
16. M. S. Shin and Y. H. Kim, J. of Electronic Mater., 32(12), 1448, (2003).
17. D. R. Frear and P. T. Vianco, Metall. Trans. A, 25A, 1509, (1994).
18. J. K. Lin et al., Proc. 51st Electr. Comp. and Tech. Conf., 455, (2001).
19. D. Frear, D. Grivas and J.W. Morris Jr., J. Electronic Mater., 16, 181, (1987).
20. L. Quan, D. Frear, D. Grivas and J.W. Morris Jr., J. Electronic Mater., 16, 203, (1987).
21. L. F. Miller, in Proc. IEEE Electr. Comp. Conf., IEEE, New York, 52, (1968).
22. V. C. Marcotte and N. G. Koopman, in Proc. 31st IEEE Electr. Comp. Conf., IEEE, New York, 157, (1981).
23. C. E. Ho, R. Y. Tsai, Y. L. Lin and C. R. Kao, J. Electronic Mater., 31, 548, (2002).
24. S. J. Wang, H. J. Kao and C. Y. Liu, J. Electronic Mater., 33(10), (2004).
25. W. T. Chen, C. E. Ho and C. R. Kao, J. Mater. Research, 17, 263, (2002).
26. S. J. Wang and C. Y. Liu, Scripta Materialia, 49, 813, (2003).
27. S. K. Kang, D. Y. Shih, D. Leonard, D. W. Henderson, T. Gosselin, S. Cho, Jin Yu and W. K. Choi, JOM, 56, 34, (2004).
28. K. N. Tu and K. Zeng, Mater. Science and Engineering R, 34, 1, (2001).
29. M. Onishi and H. Fujibuchi, Trans. JIM, 16, 539, (1975).
30. V. E. Starke et al., Z. Metallkd., 55, 107, (1964).
31. W. G. Bader, Welding Journal, 48, 551, (1969).
32. B. Meagher, D. Schwarcz and M. Ohring, J. of Mater. Science, 31, 5479, (1996).
33. J. F. Kuhman, C. H. Chinang, P. Harde, F. Reier, W. Oesterle, I. Urban and A. Klein, Mater. Science and Engineering A, 242, 22, (1998).
34. M. Klein, B. Wiens, M. Hutter, H. Oppermann, R. Aschenbrenner, and H. Reichl, Electr. Comp. and Tech. Conf., 40, (2000).
35. H. K. Kim and K. N. Tu, Phys. Rev. B, 53, 16027, (1996).
36. H. K. Kim and K. N. Tu, Appl. Phys. Lett. 67, 2002, (1995).
37. J. O. Suh, K. N. Tu and A. M. Gusak, Mater., Tech. and Reliability for Advanced Interconnects, 863, 375, (2005).
38. C. Y. Liu and K. N. Tu, J. Mater. Research, 13, 1, (1998).
39. J. J. Wierer, D. A. Steigerwald, M. R. Krames, J. J. O’Shea, M. J. Ludowise, G. Christenson, Y. C. Shen, C. Lowery, P. S. Martin, S. Subramanya, W. Go¨ tz, N. F. Gardner, R. S. Kern, and S. A. Stockman, App. Phys. Letter, 78, 32, (2001).
40. S. Zama, D. F. Baldwin, T. Hikami and H. Murata, IEEE Trans. on Electr. Packaging Manufacturing, 24(4), (2001).
41. F. J. Schmuckle, F. Lenk, M. Hutter, M. Klein, H. Oppermann, G.. Engelmann, M. Topper, K. Riepe and W. Heinrich, Microwave Symposium Digest, 2005 IEEE MTT-S International, 12-17 June, p. 1007, (2005).
42. L. Yin, Stephan J. Meschter, Timothy J. Singler, Acta Materialia, 52, 2873, (2004).
43. P. G.. Kim, K. N. Tu, Materials Chemistry and Physics, 53, 165, (1998).
44. C. Y. Liu, S. J. Wang, J. Mater. Research, 19(9), (2004).
45. O. B. Karlsen, A. Kjekshus, E. Røst, Acta Chemica Scandinavica, 46, 147, (1992).
46. C. C. Jao, Y. W. Yen, H. M. Hsiao, C. Lee and Y. Tseng, Proceedings of 2005 Chinese Society for Materials Science Annual Meeting, no. 2-1-O-004, (2005).
47. Brunner, B., Gordon, R., Marr, S., Proceedings of the 2nd Summit on PWB Surface Finishes and Solderability, IPC National Conference, p. 132, (1998).
48. K. S. Kim, S. H. Huh, K. Suganuma, J. of Alloys and Compounds, 352, 226, (2003).
49. O’Connell Jon, Agilent Tech. White Paper 2002.
50. Minnaarra, D. Shangguan, D. Xie, J. Sundelin, T. Lepisto and E. Ristolainen, J. Electronic Mater., 33(9), 977, (2004).
51. T. L. Su, L. C. Tsao, S. Y. Chang, T. H. Chuang, J. of Mater. Engineering and Performance, 11(4), 365, (2002).
52. C. Thwaites, Trans. Inst. Met. Finishing, 43, 143, (1965).
53. C. K. Cung, S. F. Tai, 2004 Inter Society Conf. on Thermal Phenomena, p. 116.
54. Henry Y. Lu, Haluk Balkan, K. Y. Simon Ng, JOM, 57(6), 30, (2005).
55. Kang S. K., Lauro P., Shih D. Y., Henderson DW., Bartelo J., Gosselin T., Cain S. R., Goldsmith C., Puttlitz K., Hwang T. K., Choi W. K., Materials Trans., 45(3), 1, (2004).
56. G. Humpston and D. M. Jacobson, “Principles of Soldering and Brazing”, ASM International, Materials Park, OH, (1993).
57. C. H. Yu and K. L. Lin, J. Mater. Research, 20(3), 666, (2005).
58. H. A. H. Steen, Swedish Institute for Metals Research, Report No. IM-1643, (1982).
59. K. Johal and J. Brewer, Proceddings of IPC Works 2000, paper no. S03-3, Miami, FL, (2000).
60. C. Y. Lee and K. L. Lin, Thin Solid Films, 249, 201, (1994).
61. J.W. Jang, D.R. Frear, T.Y. Lee and K.N. Tu, J. Appl. Phys., 88, 6359 (2000).
62. J. W. Jang, P. G. Kim, K. N. Tu, D. R. Frear, and P. Thompson, J. Appl. Phys.,
85, 8456, (1999).
63. Z. Mei, P. Callery, D. Fisher, F. Hua and J. Glazer, Advances in Electronic Packaging, Proceedings of the Pacific Rim/ASME International Intersociety Electr. and Photonic Packaging Conf., vol. 2, p. 543, (1997).
64. Z. Mei, M. Kaufmann, A. Eslambolchi and P. Johnson, Proceeding of Electr. Component and Tech. Conf., p. 952, (1998).
65. M. O. Alam, Y. C. Chan, K. C. Hung, Microelectronics Reliability, 42, p. 1065, (2002).
66. D. Goyal, T. Lane, P. Kinzie, and C. Panichas, Proceedings of 52th Electr. Comp. and Tech. Conf., p. 732, (2002).
67. Y. D. Jeon and K. W. Paik, Proceedings of the 51th Electr. Comp. and Tech. Conf., p. 732, (2001).
68. K. Zeng, V. Vuorinen and J. K. Kivilahti, IEEE Transactions on Electr. Packaging Manufacturing, 25, 3, 162, (2002).
69. H. D. Blair, T. Pan and J. M. Nicholson, Electr. Comp. and Tech. Conf., 6, p. 259, (1998).
70. H. Matsukia, H. Ibukab and H. Sakab, Science and Technology of Advanced Mater., 3, pp. 261-270, (2002).
71. Solder Data Sheet, Welco Castigs, 2 Hillyard Street, Hamilton, Ontario, Canada.
72. D. R. Frear, S. N. Burchett, H. S. Morgan and J. H. Lau, eds., The Mechanics of Solder Alloy Interconnects, p. 60 (Van Nostrand Reinhold, New York, 1994).
73. D. E. Gray, ed., American Institute of Physics Handbook, pp. 2-61 ff. (McGraw-Hill, New York, 1957).
74. S. W. Chen, S. W. Lee and M. C. Yip, J. of Electronic Mater. 32(11), 1284, (2003). |