| 摘要(英) |
Portable electronic products has strong growth momentum led to huge demand of highly effective miniaturized chips. Wafer level chip scale package (WLCSP) as intermediary, plays an important role, making IC packages tend to be more thin and short in widespread use. However, under the globalization and the highly competitive industry, semiconductor foundry under the low margins and high-cost challenges facing the brunt, try all means to enhance the competitiveness of their firms. At the same time, savings in production costs is the key to improve the productivity, through automated production technology, productivity improvements can be achieve. It is one key to business continuity management.
Wafer level chip scale package is capital and labor-intensive industries, a huge human cost accompanied by a yearly increase of basic salary. It has a direct impact and compression to the enterprise′s profit. Currently, automatic optical inspection (AOI) machine has been widely used in manufacturing process for "wafer type" test but, not enough to replace human as the highest proportion of "die" visual inspection station. This research develops a convenient wafer level image sensing IC "die" automated optical inspection equipment aimed to import manpower to the highest proportion of "final visual inspection" workstations. We hope to fully apply it to the full inspection product in the future.
|
| 參考文獻 |
一、中文部份：
1.半導體科技網站(2005)，新世代半導體封裝材料技術的發展趨勢，Retrieved May 20, 2015，取自：http://ssttpro.acesuppliers.com/semiconductor。
2.何宗漢(2012)，半導體構裝之發展趨勢及製程簡介，國立成功大學碩博專題演，Retrieved May 15, 2015，取自：http://www.feu.edu.tw/edu/mse/web。
3.李侑青(2013)，以不均勻背景匹配為基礎的自動光學檢測技術，國立中央大學資訊工程未出版博士論文。
4.陳亮嘉、卓嘉弘與何宣緯(2008)，運用雙頻傅立葉頻譜轉換之即時光學動態三維輪廓量測技術，工研院機械月刊, 34(8)，頁48-60，新竹市：越吟書局。
5.陳志忠(2001），液晶顯示器的像素缺陷與相對亮度均一性之自動化檢測，私立中原大學機械工程未出版碩士論文。
6陳亮嘉(2007)，光學影像之基礎建立，國立台灣大學自動化光學研究室網站，Retrieved April 23, 2015，取自：http://140.112.14.7/~measlab/course/2013。
7.陳聖凱(2014)，應用AOI技術於半導體晶圓檢測研究，南台科技大學知識分享平台，Retrieved June 01, 2015，取自：http://eshare.stust.edu.tw/View/215305。
6.趙文傑、張啟燦、蘇顯渝、曹益平、向立群與陳文靜(2004)，氣球快速洩氣之動態三維量測，光電工程, 31(5)，頁42-45，台北市。
8.鄧潤澤(2001)，Flip Chip技術簡介與應用，統一證券最新IC封裝研究報告，Retrieved April 11, 2015，取自：http://www.moneydj.com/z/zu/zua。
9. 梁有燈(1999)，機械視覺在BGA銲球尺寸量測上之應用，中華大學機械與航太工程研究所未出版碩士論文。
10.葉明淵(2014)，漏檢因素之資料探勘分析與探討-以X公司晶圓級晶片尺寸封裝製程為例，國立中央大學工業管理未出版碩士論文，第二章。
11.孫世英(2011)，應用漫射光學檢測系統改善 LCD Cell製程真偽缺陷偵測準確度，國立交通大學平面顯示技術未出版碩士論文。
12.蕭瑞陽、吳昇翰與許學文(2007)，何謂無塵室，大葉大學自動控製無塵室專題研究，(頁2)，彰化市。
13.Chtung (2000)，封裝方式的演進與未來，國立中山大學資管系網站精華區，Retrieved June 06, 2015，取自：http://bbs3.nsysu.edu.tw/txtVersion/Treasure。
14.Sixman (2012)，IC載板與PCB板的差別，Blogspot網站，Retrieved June 01, 2015，取自：http://wwwsixman.blogspot.tw/2012/08。
15.交大機械系學會電子系刊(2015)，機器人不可或缺的核心—機器視覺，新竹市。
二、英文部分：
1.Ai, J. Y., & Zhu, X. F. (2002). Analysis and Detection of Ceramic-Glass Surface Defects Based on Computer Vision, Proceedings of the 4th World Congress on Intelligent Control and Automation, 4(1), 3014-3018.
2.Ahmad, M. B., & Choi, T. S. (1999). Local Threshold And Boolean Function Based Edge Detection, Transactions on Consumer Electronics, 45(3), 674-679.
3.Casasent, D., & Krishnapuram, R. (1987). Curved Object Location by Hough Transformation and Inversions, Pattern Recognition, 20(1), 181-188.
4.Daut, D. G., & Zhao, D. (1993). A Flaw Detection Method Based on Morphological Image Processing, IEEE Transactions on Circuit and Systems for Video Technology, 3(6), 389-398.
5.Elmabrouk, A., & Aggoun, A. (1998). Edge Detection Using Local Histogram Analysis, Electronics Letters, 34(12), 1216-1217.
6.Gonzales, R. C., & Woods, R. E. (2003). Digital Image Processing 2/E, Addison-Wesley Publishing Company, 610-624.
7.Lee, D. B., & Chou, C. C. (2009). Automated bonding position inspection on multi-layered wire IC using machine vision, International Journal of Production Research, 48(23), 6977-7001.
8.Jain, A, K., & Newman, T. S. (1995). A Survey of Automated Visual Inspection, Computer Vision and Image Processing, 61(2), 231-262.
9.Jiang, X. Y., & Mojon, D. (2003). Adaptive Local Thresholding by Verification-Based Multithreshold Probing with Application to Vessel Detection in Retinal Images, IEEE Transactions on Pattern Analysis and Machine Intelligence, 25(1), 131-137.
10.Nakagawa, Y., & Rosenfeld, A. (1978). Edge/Border coincidence as an aid in edge extraction, IEEE Trans. Systems Man Cybernet, 8(1), 899-901.
11.Ostu, N (1979). A Threshold Selection Method from Gray-Level Histogram, IEEE Transactions on Systems, Man, and Cybernetics, 9(1), 62-66.
|
[Endnote RIS 格式]
[相關文章]
[文章引用]
[完整記錄]
[館藏目錄]
至系統瀏覽論文 ( 永不開放)
plurk
funp
live
udn
HD
myshare
netvibes
friend
youpush
delicious
baidu
Google bookmarks
del.icio.us
hemidemi
facebook
twitter
google
reddit