博碩士論文 101521111 詳細資訊




以作者查詢圖書館館藏 以作者查詢臺灣博碩士 以作者查詢全國書目 勘誤回報 、線上人數:39 、訪客IP:3.21.159.223
姓名 楊其峻(Chi-Chun Yang)  查詢紙本館藏   畢業系所 電機工程學系
論文名稱 應用於動態隨機存取記憶體之混合式自我測試方法
(A Hybrid Built-In Self-Test Scheme for DRAMs)
相關論文
★ 應用於三元內容定址記憶體之低功率設計與測試技術★ 用於隨機存取記憶體的接線驗證演算法
★ 用於降低系統晶片內測試資料之基礎矽智產★ 內容定址記憶體之鄰近區域樣型敏感瑕疵測試演算法
★ 內嵌式記憶體中位址及資料匯流排之串音瑕疵測試★ 用於系統晶片中單埠與多埠記憶體之自我修復技術
★ 用於修復嵌入式記憶體之基礎矽智產★ 自我修復記憶體之備份分析評估與驗證平台
★ 使用雙倍疊乘累加命中線之低功率三元內容定址記憶體設計★ 可自我測試且具成本效益之記憶體式快速傅利葉轉換處理器設計
★ 低功率與可自我修復之三元內容定址記憶體設計★ 多核心系統晶片之診斷方法
★ 應用於網路晶片上隨機存取記憶體測試及修復之基礎矽智產★ 應用於貪睡靜態記憶體之有效診斷與修復技術
★ 應用於內嵌式記憶體之高效率診斷性資料壓縮與可測性方案★ 應用於隨機存取記憶體之有效良率及可靠度提升技術
檔案 [Endnote RIS 格式]    [Bibtex 格式]    [相關文章]   [文章引用]   [完整記錄]   [館藏目錄]   [檢視]  [下載]
  1. 本電子論文使用權限為同意立即開放。
  2. 已達開放權限電子全文僅授權使用者為學術研究之目的,進行個人非營利性質之檢索、閱讀、列印。
  3. 請遵守中華民國著作權法之相關規定,切勿任意重製、散佈、改作、轉貼、播送,以免觸法。

摘要(中) 動態隨機存取記憶體(DRAM)在電子系統中扮演著重要的角色。近來,多通道動態隨機存取記憶體已被應用於三維或2.5維晶片中。由於多通道動態隨機存取記憶體在三維或2.5維晶片中測試操作困難,內建自我測試電路(built-in self-test)被視為一個好的測試方法。不同的內建自我測試電路已經被廣泛應用於動態隨機存取記憶體的測試。在先前已經有許多內建自我測試電路的技術被提出,而其大部分設計成可程式化(programmability)來支援不同的測試演算法。

在本論文中,我們首先針對各種應用於隨機存取記憶體的可程式化內建自我測試電路做探討。並且對於不同的可程式化內建自我測試電路進行詳盡的分析。隨後,我們提出了一個應用於動態隨機存取記憶體的混合式內建自我測試方法。所提出的混合式自我測試電路包含了一個支援對於金屬光罩改變(metal-change) 可程式化的微指令形式控制器(microcode-based controller) 和支援對於使用中模式暫存器和型態參數可程式化的有限狀態機形式控制器(FSM-based controller)。因此,如果所需的測試演算法沒有被預先存在唯讀記憶體中 (read-only-memory),我們僅需要改變金屬光罩來改變支援的測試演算法。現場可程式化可以滿足堆疊後測試(post-bond test)的需求,例如:驅動能力、 熱補償、不同個數的堆疊晶粒等。而我們也實際做出了應用於一個多通道動態隨機存取記憶體的混合式內建自我測試電路。實驗結果顯示,當應用在一個20Gb 4-通道動態隨機存取記憶體中單通道且支援行軍式(March)和非行軍式演算法與使用TSMC 90nm的製程時,我們的混合式自我測試電路僅需要18.2K邏輯閘數。最後,我們提出了一個應用於動態隨機存取記憶體的記憶體內建自我測試電路編譯器(compiler)。提出的內建自我測試電路編譯器可以產生出不同形式的內建自我測試電路,包括有限狀態機形式、微指令形式、可程式化微指令形式和我們所提出的混合式內建自我測試電路。

摘要(英) Dynamic random access memory (DRAM) is one key component in electronic systems. Recently,

multi-channel DRAMs have been proposed for three dimensional (3D) or 2.5D chips. Due to the

poor test accessibility, built-in self-test (BIST) method is considered a good approach for the postbond

testing of multi-channel DRAMs in 2.5D/3D chips. Various BIST schemes were presented to

test DRAMs. To support different test algorithms, most of those BISTs are designed as they have

the programmability of test algorithms.

In this thesis, we first survey existing programmable BIST schemes for RAMs. Comparison

of different programmable BISTs is conducted . Then, a hybrid BIST scheme for DRAMs is proposed.

The hybrid BIST consists of a microcode-based controller for supporting the metal-change

programmability of test algorithms and an FSM-based controller for supporting the in-field programmability

of mode registers and configuration parameters. Thus, if the needed test algorithms

are out of the test algorithms stored in the read-only-memory, only metal changing is needed to

change the supported test algorithms. The in-field programmability can meet the requirement of

post-bond test on the uncertainties of test thermal, number of stacked dies, driving strength of

drivers, and so on. We also have implemented the hybrid BIST for a multi-channel DRAM. Simulation

results show that only about 18.2K gates are needed to support March and non-March test

algorithms for a single channel within a 20Gb 4-channel DRAM using TSMC 90nm standard cell

library. Finally, a memory BIST compiler for DRAMs is proposed. The memory BIST compiler

can generate different types of memory BISTs including the FSM-based, microcode-based,

microcode programmable, and proposed hybrid BISTs.
關鍵字(中) ★ 內建自我測試電路 關鍵字(英) ★ BIST
論文目次 1 Introduction 1

1.1 Dynamic Random Access Memory (DRAM) . . . . . . . . . . . . . . . . . . . . 1

1.2 Existing Built-In Self-Test Techniques . . . . . . . . . . . . . . . . . . . . . . . . 4

1.3 BIST Challenges of Modern DRAMs . . . . . . . . . . . . . . . . . . . . . . . . 5

1.3.1 DQ Strobe Signal . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5

1.3.2 Double Edge-trigger Issue . . . . . . . . . . . . . . . . . . . . . . . . . . 6

1.3.3 Burst Length for Diagnostic Data Exportation . . . . . . . . . . . . . . . . 7

1.3.4 Overflow of ATE Storage . . . . . . . . . . . . . . . . . . . . . . . . . . . 8

1.3.5 Critical DRAM Access Mode, Power and Test Condition . . . . . . . . . . 8

1.4 Thesis Contribution . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10

1.5 Thesis Organization . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10

2 Survey of Programmable BIST Schemes for DRAMs 12

2.1 Motivation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12

2.2 Reviews of Various Programmable BIST Schemes . . . . . . . . . . . . . . . . . . 12

2.2.1 Programmable FSM-based BIST . . . . . . . . . . . . . . . . . . . . . . . 12

2.2.2 Microcode-based BIST . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14

2.2.3 Microcode Programmable BIST . . . . . . . . . . . . . . . . . . . . . . . 16

2.3 Analysis . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19

2.4 Summary . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20

3 A Hybrid Built-In Self Test Scheme for DRAMs 21

3.1 Why Hybrid BIST . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 21

3.2 Proposed Hybrid BIST Scheme . . . . . . . . . . . . . . . . . . . . . . . . . . . . 23

3.2.1 Overall Test Architecture . . . . . . . . . . . . . . . . . . . . . . . . . . . 23

3.2.2 BIST Command and Microcode Instruction . . . . . . . . . . . . . . . . . 24

3.2.3 Hybrid BIST Architecture . . . . . . . . . . . . . . . . . . . . . . . . . . 28

3.2.4 Hybrid BIST Operation Flow . . . . . . . . . . . . . . . . . . . . . . . . 39

3.2.5 Programmability of Test Algorithms and Example . . . . . . . . . . . . . 41

3.3 Simulation and Comparison Results . . . . . . . . . . . . . . . . . . . . . . . . . 43

3.3.1 Simulation Results . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 43

3.3.2 Bandwidth Analysis . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 46

3.3.3 Different Types of BIST Schemes . . . . . . . . . . . . . . . . . . . . . . 49

3.4 Comparison Results . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 51

3.5 Summary . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 53

4 A Compiler of Programmable BIST for DRAMs 54

4.1 Motivation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 54

4.2 Proposed Memory BIST Compiler . . . . . . . . . . . . . . . . . . . . . . . . . . 55

4.2.1 Proposed BIST Templates . . . . . . . . . . . . . . . . . . . . . . . . . . 55

4.2.2 ROM Information Generator . . . . . . . . . . . . . . . . . . . . . . . . . 59

4.2.3 BIST Data Format . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 60

4.2.4 Compilation Flow of Proposed Memory BIST Compiler . . . . . . . . . . 62

4.3 Experimental and Comparison Results . . . . . . . . . . . . . . . . . . . . . . . . 62

4.4 Summary . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 66

5 Conclusion and FutureWork 67

5.1 Conclusion . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 67

5.2 Future Work . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 68
參考文獻 [1] C. Weis, I. Loi, L. Benini, and N. Wehn, “Exploration and optimization of 3-D integrated

DRAMsubsystems,” IEEE Trans. on Computer-Aided Design of Integrated Circuits and Systems,

vol. 32, no. 4, pp. 597–610, Apr. 2013.

[2] V. F. Pavlidis and E. G. Friedman, “Interconnect-based design methodologies for threedimensional

integrated circuits,” Proc. of the IEEE, vol. 97, no. 1, pp. 123–140, Jan. 2009.

[3] P. Marchal, B. Bougard, G. Katti, M. Stucchi, W. Dehaene, A. Papanikolaou, D. Verkest,

B. Swinnen, and E. Beyne, “3-D technology assessment: path-finding the technology/design

sweet-spot,” Proc. of the IEEE, vol. 97, no. 1, pp. 96–106, Jan. 2009.

[4] T. Zhang, R. Micheloni, G. Zhang, Z. R. Huang, and J. Jian-Qiang Lu, “3-D data storage,

power delivery, and RF/optical transceiver - case studies of 3-D integration from system

design perspectives,” Proc. of the IEEE, vol. 97, no. 1, pp. 161–174, Jan. 2009.

[5] M. Koyanagi, T. Fukushima, and T. Tanaka, “High-density through silicon vias for 3-D LSIs,”

Proc. of the IEEE, vol. 97, no. 1, pp. 49–59, Jan. 2009.

[6] J.-Q. Lu, “3-D hyperintegration and packaging technologies for micro-nano systems,” Proc.

of the IEEE, vol. 97, no. 1, pp. 18–30, 2009.

[7] M. Motoyoshi, “Through-silicon via (TSV),” Proc. of the IEEE, vol. 97, no. 1, pp. 43–48,

Jan. 2009.

[8] J.-F. Li and C.-W. Wu, “Is 3D integration an opportunity or just a hype?” in IEEE Asia South

Pacific Design and Automation Conference (ASPDAC), Taipei, 2010, pp. 541–543.

[9] P. Jacob, A. Zia, O. Erdogan, P. Belemjian, J.-W. Kim, M. Chu, R. Kraft, J. McDonald, and

K. Bernstein, “Mitigatin memory wall effects in high-clock-rate and multicore CMOS 3-D

processor memory stacks,” Proc. of the IEEE, vol. 97, no. 1, pp. 108–122, Jan. 2009.

[10] S. Borkar, “3D integration for energy efficient system design,” in Proc. IEEE/ACM Design

Automation Conf. (DAC), June. 2011, pp. 214–219.

[11] U. Kang and et al., “8 Gb 3-D DDR3 DRAM using through-silicon-via technology,” IEEE

Jour. of Solid-State Circuits, vol. 45, no. 1, pp. 111–119, 2010.

[12] T. Sekiguchi, K. Ono, A. Kotabe, and Y. Yanagawa, “1-Tbyte/s 1- Gbit DRAM architecture

using 3-D interconnect for high-throughput computing,” IEEE Jour. of Solid-State Circuits,

vol. 46, no. 4, pp. 828–837, Apr. 2011.

[13] JEDEC, “JEDEC wide I/O single data rate,” http://www.jedec.org/, Dec. 2011.

[14] ——, “JEDEC high bandwidth memory (HBM) DRAM,” http://www.jedec.org/, Oct. 2013.

[15] J.-S. Kim and et al., “A 1.2V 12.8 GB/s 2Gb mobile wide-I/O DRAM with 4x128 I/Os using

TSV based stacking,” IEEE Jour. of Solid-State Circuits, vol. 47, no. 1, pp. 107–116, Jan.

2012.

[16] Y.-C. Yu, C.-W. Chou, J.-F. Li, C.-Y. Lo, D.-M. Kwai, Y.-F. Chou, and C.-W. Wu, “A built-in

self-test scheme for 3D RAMs,” in Proc. Int’l Test Conf. (ITC), Nov. 2012, Paper 14.4, pp.

1–9.

[17] X. Du, N. Mukherjee, C. Hill, W.-T. Cheng, and S. Reddy, “A field programmable memory

BIST architecture supporting algorithms with multiple nested loops,” in IEEE Asian Test

Symp. (ATS), 2006, pp. 287–292.

[18] C.-T. Huang, J.-R. Huang, C.-F. Wu, C.-W. Wu, and T.-Y. Chang, “A programmable BIST

core for embedded DRAM,” IEEE Design & Test of Computers, vol. 16, no. 1, pp. 59–70,

Jan.-Mar. 1999.

[19] C.-F. Lin, J.-C. Ou, M.-H. Wang, Y.-S. Ou, and M.-H. Ku, “Single instruction based programmable

memory BIST for testing embedded DRAM,” in IEEE Int’l Symp. on VLSI Design,

Automation, and Test (VLSI-DAT), Hsinchu, 2009, pp. 291–294.

[20] S. Boutobza, M. Nicolaidis, K. Lamara, and A. Costa, “Programmable memory BIST,” in

Proc. Int’l Test Conf. (ITC), Nov. 2005, Paper 45.2, pp. 1–10.

[21] H. Koike, T. Takeshima, and M. Takada, “A BIST scheme using microprogram ROM for

large capacity memories,” in Proc. Int’l Test Conf. (ITC), Sep. 1990, pp. 815–822.

[22] M. Kume, K. Uehara,M. Itakura, H. Sawamoto, T. Kobayashi,M. Hasegawa, and H. Hayashi,

“Programmable at-speed array and functional BIST for embedded DRAMLSI,” in Proc. Int’l

Test Conf. (ITC), Oct. 2004, pp. 988–996.

[23] P. Bernardi,M. Grosso,M. Reorda, and Y. Zhang, “A programmable BIST for DRAMtesting

and diagnosis,” in Proc. Int’l Test Conf. (ITC), Oct. 2010, Paper 15.3, pp. 1–10.

[24] J. Dreibelbis, J. Barth, H. Kalter, and R. Kho, “Processor-based built-in self-test for embedded

DRAM,” IEEE Jour. of Solid-State Circuits, pp. 1731–1740, Nov. 1998.

[25] P. Jakobsen, J. Dreibelbis, G. Pomichter, D. Anand, J. Barth, M. Nelms, J. Leach, and G. Belansek,

“Embedded DRAMbuilt in self test and methodology for test insertion,” in Proc. Int’l

Test Conf. (ITC), Nov. 2001, pp. 975–984.

[26] I. Loi, S. Mitra, T. Lee, S. Fujita, and L. Benini, “A low-overhead fault tolerance scheme for

TSV-based 3D network on chip links,” in Proc. IEEE/ACM Int’l Conf. on Computer-Aided

Design (ICCAD), 2008, pp. 598–602.

[27] R. S. Patti, “Three-dimensional integrated circuits and the future of system-on-chip designs,”

Proc. of the IEEE, vol. 94, no. 6, pp. 1214–1224, 2006.

[28] A. Tanabe, T. Takeshima, H. Koike, Y. Aimoto, M. Takada, T. Ishijima, N. Kasai, H. Hada,

K. Shibahara, T. Kunio, T. Tanigawa, T. Saeki, M. Sakao, H. Miyamoto, H. Nozue, S. Ohya,

T. Murotani, K. Koyama, and T. Okuda, “A 30-ns 64-Mb DRAM with built-in self-test and self-repair function,” IEEE Jour. of Solid-State Circuits, vol. 27, no. 11, pp. 1525–1533, Nov.

1992.

[29] T. J. Powell, F. Hii, and D. Cline, “A 256Meg SDRAM BIST for disturb test application,” in

Proc. Int’l Test Conf. (ITC), Nov. 1997, pp. 200–208.

[30] S. Tanoi, Y. Tokunaga, T. Tanabe, K. Takahashi, A. Okada,M. Itoh, Y. Nagatomo, Y. Ohtsuki,

andM. Uesugi, “On-wafer BIST of a 200-Gb/s failed-bit search for 1-Gb DRAM,” IEEE Jour.

of Solid-State Circuits, vol. 32, no. 11, pp. 1735–1742, Nov. 1997.

[31] J. Barth, J.E., D. Anand, S. Burns, J. Dreibelbis, J. Fifield, K. Gorman, M. Nelms, E. Nelson,

A. Paparelli, G. Pomichter, D. Pontius, and S. Sliva, “A 500-MHz multi-banked compilable

DRAM macro with direct write and programmable pipelining,” IEEE Jour. of Solid-State

Circuits, vol. 40, no. 1, pp. 213–222, Jan. 2005.

[32] K. Gorman,M. Roberge, A. Paparelli, G. Pomichter, S. Sliva, andW. Corbin, “Advancements

in at-speed array BIST: multiple improvements,” in Proc. Int’l Test Conf. (ITC), Oct. 2010,

Paper 3.1, pp. 1–10.

[33] W. Hong, J. Choi, and H. Chang, “A programmable memory BIST for embedded memory,”

in SoC Design Conference, 2008. ISOCC ’08. International, 2008, pp. 195–198.

[34] K. Chen, S. Li, N. Muralimanohar, J.-H. Ahn, J. Brockman, and N. Jouppi, “CACTI-3DD:

architecture-level modeling for 3D die-stacked DRAMmain memory,” in Proc. Conf. Design,

Automation, and Test in Europe (DATE), Mar. 2012, pp. 33–38.

[35] H. Sun, J. Liu, R. Anigundi, N. Zheng, J. Lu, R. Ken, and T. Zhang, “Design of 3D DRAM

and its application in 3D integrated multi-core computing systems,” Design & Test, IEEE,

vol. PP, no. 99, pp. 1–1, 2013.

[36] J. Jeddeloh and B. Keeth, “Hybrid memory cube new DRAM architecture increases density

and performance,” in VLSI Technology (VLSIT), 2012 Symposium on, June. 2012, pp. 87–88.

[37] K. Zarrineh and S. J. Upadhyaya, “Programmable memory BIST and a new synthesis framework,”

in Proc. Int’l Symp. on Fault Tolerant Computing (FTCS), Montreal, June 1999, pp.

352–355.

[38] ——, “On programmable memory built-in self test architecutres,” in Proc. Conf. Design,

Automation, and Test in Europe (DATE), Paris, Mar. 1999, pp. 708–713.

[39] K. Zarrineh and S. Upadhyaya, “A new framework for automatic generation, insertion and

verification of memory built-in self test units,” in Proc. IEEE VLSI Test Symp. (VTS), 1999,

pp. 391–396.

[40] O. Kebichi and M. Nicolaidis, “A tool for automatic generation of BISTed and transparent

BISTed RAMs,” in Proc. IEEE Int’l Conf. on Computer Design (ICCD), Oct. 1992, pp. 570–

575.

[41] R. Rajsuman, “RAMBIST builder: A methodology for automatic built-in self-test design of

embedded RAMs,” in Proc. IEEE Int’l Workshop on Memory Technology, Design and Testing

(MTDT), San Jose, 1996, pp. 50–56.

[42] C. Cheng, C.-T. Huang, J.-R. Huang, C.-W. Wu, C.-J. Wey, and M.-C. Tsai, “BRAINS: A

BIST complier for embedded memories,” in Proc. IEEE Int’l Symp. on Defect and Fault

Tolerance in VLSI Systems (DFT), Yamanashi, Oct. 2000, pp. 299–307.

指導教授 李進福(Jin-Fu Li) 審核日期 2015-8-27
推文 facebook   plurk   twitter   funp   google   live   udn   HD   myshare   reddit   netvibes   friend   youpush   delicious   baidu   
網路書籤 Google bookmarks   del.icio.us   hemidemi   myshare   

若有論文相關問題,請聯絡國立中央大學圖書館推廣服務組 TEL:(03)422-7151轉57407,或E-mail聯絡  - 隱私權政策聲明