參考文獻 |
[1] C. Weis, I. Loi, L. Benini, and N. Wehn, “Exploration and optimization of 3-D integrated
DRAMsubsystems,” IEEE Trans. on Computer-Aided Design of Integrated Circuits and Systems,
vol. 32, no. 4, pp. 597–610, Apr. 2013.
[2] V. F. Pavlidis and E. G. Friedman, “Interconnect-based design methodologies for threedimensional
integrated circuits,” Proc. of the IEEE, vol. 97, no. 1, pp. 123–140, Jan. 2009.
[3] P. Marchal, B. Bougard, G. Katti, M. Stucchi, W. Dehaene, A. Papanikolaou, D. Verkest,
B. Swinnen, and E. Beyne, “3-D technology assessment: path-finding the technology/design
sweet-spot,” Proc. of the IEEE, vol. 97, no. 1, pp. 96–106, Jan. 2009.
[4] T. Zhang, R. Micheloni, G. Zhang, Z. R. Huang, and J. Jian-Qiang Lu, “3-D data storage,
power delivery, and RF/optical transceiver - case studies of 3-D integration from system
design perspectives,” Proc. of the IEEE, vol. 97, no. 1, pp. 161–174, Jan. 2009.
[5] M. Koyanagi, T. Fukushima, and T. Tanaka, “High-density through silicon vias for 3-D LSIs,”
Proc. of the IEEE, vol. 97, no. 1, pp. 49–59, Jan. 2009.
[6] J.-Q. Lu, “3-D hyperintegration and packaging technologies for micro-nano systems,” Proc.
of the IEEE, vol. 97, no. 1, pp. 18–30, 2009.
[7] M. Motoyoshi, “Through-silicon via (TSV),” Proc. of the IEEE, vol. 97, no. 1, pp. 43–48,
Jan. 2009.
[8] J.-F. Li and C.-W. Wu, “Is 3D integration an opportunity or just a hype?” in IEEE Asia South
Pacific Design and Automation Conference (ASPDAC), Taipei, 2010, pp. 541–543.
[9] P. Jacob, A. Zia, O. Erdogan, P. Belemjian, J.-W. Kim, M. Chu, R. Kraft, J. McDonald, and
K. Bernstein, “Mitigatin memory wall effects in high-clock-rate and multicore CMOS 3-D
processor memory stacks,” Proc. of the IEEE, vol. 97, no. 1, pp. 108–122, Jan. 2009.
[10] S. Borkar, “3D integration for energy efficient system design,” in Proc. IEEE/ACM Design
Automation Conf. (DAC), June. 2011, pp. 214–219.
[11] U. Kang and et al., “8 Gb 3-D DDR3 DRAM using through-silicon-via technology,” IEEE
Jour. of Solid-State Circuits, vol. 45, no. 1, pp. 111–119, 2010.
[12] T. Sekiguchi, K. Ono, A. Kotabe, and Y. Yanagawa, “1-Tbyte/s 1- Gbit DRAM architecture
using 3-D interconnect for high-throughput computing,” IEEE Jour. of Solid-State Circuits,
vol. 46, no. 4, pp. 828–837, Apr. 2011.
[13] JEDEC, “JEDEC wide I/O single data rate,” http://www.jedec.org/, Dec. 2011.
[14] ——, “JEDEC high bandwidth memory (HBM) DRAM,” http://www.jedec.org/, Oct. 2013.
[15] J.-S. Kim and et al., “A 1.2V 12.8 GB/s 2Gb mobile wide-I/O DRAM with 4x128 I/Os using
TSV based stacking,” IEEE Jour. of Solid-State Circuits, vol. 47, no. 1, pp. 107–116, Jan.
2012.
[16] Y.-C. Yu, C.-W. Chou, J.-F. Li, C.-Y. Lo, D.-M. Kwai, Y.-F. Chou, and C.-W. Wu, “A built-in
self-test scheme for 3D RAMs,” in Proc. Int’l Test Conf. (ITC), Nov. 2012, Paper 14.4, pp.
1–9.
[17] X. Du, N. Mukherjee, C. Hill, W.-T. Cheng, and S. Reddy, “A field programmable memory
BIST architecture supporting algorithms with multiple nested loops,” in IEEE Asian Test
Symp. (ATS), 2006, pp. 287–292.
[18] C.-T. Huang, J.-R. Huang, C.-F. Wu, C.-W. Wu, and T.-Y. Chang, “A programmable BIST
core for embedded DRAM,” IEEE Design & Test of Computers, vol. 16, no. 1, pp. 59–70,
Jan.-Mar. 1999.
[19] C.-F. Lin, J.-C. Ou, M.-H. Wang, Y.-S. Ou, and M.-H. Ku, “Single instruction based programmable
memory BIST for testing embedded DRAM,” in IEEE Int’l Symp. on VLSI Design,
Automation, and Test (VLSI-DAT), Hsinchu, 2009, pp. 291–294.
[20] S. Boutobza, M. Nicolaidis, K. Lamara, and A. Costa, “Programmable memory BIST,” in
Proc. Int’l Test Conf. (ITC), Nov. 2005, Paper 45.2, pp. 1–10.
[21] H. Koike, T. Takeshima, and M. Takada, “A BIST scheme using microprogram ROM for
large capacity memories,” in Proc. Int’l Test Conf. (ITC), Sep. 1990, pp. 815–822.
[22] M. Kume, K. Uehara,M. Itakura, H. Sawamoto, T. Kobayashi,M. Hasegawa, and H. Hayashi,
“Programmable at-speed array and functional BIST for embedded DRAMLSI,” in Proc. Int’l
Test Conf. (ITC), Oct. 2004, pp. 988–996.
[23] P. Bernardi,M. Grosso,M. Reorda, and Y. Zhang, “A programmable BIST for DRAMtesting
and diagnosis,” in Proc. Int’l Test Conf. (ITC), Oct. 2010, Paper 15.3, pp. 1–10.
[24] J. Dreibelbis, J. Barth, H. Kalter, and R. Kho, “Processor-based built-in self-test for embedded
DRAM,” IEEE Jour. of Solid-State Circuits, pp. 1731–1740, Nov. 1998.
[25] P. Jakobsen, J. Dreibelbis, G. Pomichter, D. Anand, J. Barth, M. Nelms, J. Leach, and G. Belansek,
“Embedded DRAMbuilt in self test and methodology for test insertion,” in Proc. Int’l
Test Conf. (ITC), Nov. 2001, pp. 975–984.
[26] I. Loi, S. Mitra, T. Lee, S. Fujita, and L. Benini, “A low-overhead fault tolerance scheme for
TSV-based 3D network on chip links,” in Proc. IEEE/ACM Int’l Conf. on Computer-Aided
Design (ICCAD), 2008, pp. 598–602.
[27] R. S. Patti, “Three-dimensional integrated circuits and the future of system-on-chip designs,”
Proc. of the IEEE, vol. 94, no. 6, pp. 1214–1224, 2006.
[28] A. Tanabe, T. Takeshima, H. Koike, Y. Aimoto, M. Takada, T. Ishijima, N. Kasai, H. Hada,
K. Shibahara, T. Kunio, T. Tanigawa, T. Saeki, M. Sakao, H. Miyamoto, H. Nozue, S. Ohya,
T. Murotani, K. Koyama, and T. Okuda, “A 30-ns 64-Mb DRAM with built-in self-test and self-repair function,” IEEE Jour. of Solid-State Circuits, vol. 27, no. 11, pp. 1525–1533, Nov.
1992.
[29] T. J. Powell, F. Hii, and D. Cline, “A 256Meg SDRAM BIST for disturb test application,” in
Proc. Int’l Test Conf. (ITC), Nov. 1997, pp. 200–208.
[30] S. Tanoi, Y. Tokunaga, T. Tanabe, K. Takahashi, A. Okada,M. Itoh, Y. Nagatomo, Y. Ohtsuki,
andM. Uesugi, “On-wafer BIST of a 200-Gb/s failed-bit search for 1-Gb DRAM,” IEEE Jour.
of Solid-State Circuits, vol. 32, no. 11, pp. 1735–1742, Nov. 1997.
[31] J. Barth, J.E., D. Anand, S. Burns, J. Dreibelbis, J. Fifield, K. Gorman, M. Nelms, E. Nelson,
A. Paparelli, G. Pomichter, D. Pontius, and S. Sliva, “A 500-MHz multi-banked compilable
DRAM macro with direct write and programmable pipelining,” IEEE Jour. of Solid-State
Circuits, vol. 40, no. 1, pp. 213–222, Jan. 2005.
[32] K. Gorman,M. Roberge, A. Paparelli, G. Pomichter, S. Sliva, andW. Corbin, “Advancements
in at-speed array BIST: multiple improvements,” in Proc. Int’l Test Conf. (ITC), Oct. 2010,
Paper 3.1, pp. 1–10.
[33] W. Hong, J. Choi, and H. Chang, “A programmable memory BIST for embedded memory,”
in SoC Design Conference, 2008. ISOCC ’08. International, 2008, pp. 195–198.
[34] K. Chen, S. Li, N. Muralimanohar, J.-H. Ahn, J. Brockman, and N. Jouppi, “CACTI-3DD:
architecture-level modeling for 3D die-stacked DRAMmain memory,” in Proc. Conf. Design,
Automation, and Test in Europe (DATE), Mar. 2012, pp. 33–38.
[35] H. Sun, J. Liu, R. Anigundi, N. Zheng, J. Lu, R. Ken, and T. Zhang, “Design of 3D DRAM
and its application in 3D integrated multi-core computing systems,” Design & Test, IEEE,
vol. PP, no. 99, pp. 1–1, 2013.
[36] J. Jeddeloh and B. Keeth, “Hybrid memory cube new DRAM architecture increases density
and performance,” in VLSI Technology (VLSIT), 2012 Symposium on, June. 2012, pp. 87–88.
[37] K. Zarrineh and S. J. Upadhyaya, “Programmable memory BIST and a new synthesis framework,”
in Proc. Int’l Symp. on Fault Tolerant Computing (FTCS), Montreal, June 1999, pp.
352–355.
[38] ——, “On programmable memory built-in self test architecutres,” in Proc. Conf. Design,
Automation, and Test in Europe (DATE), Paris, Mar. 1999, pp. 708–713.
[39] K. Zarrineh and S. Upadhyaya, “A new framework for automatic generation, insertion and
verification of memory built-in self test units,” in Proc. IEEE VLSI Test Symp. (VTS), 1999,
pp. 391–396.
[40] O. Kebichi and M. Nicolaidis, “A tool for automatic generation of BISTed and transparent
BISTed RAMs,” in Proc. IEEE Int’l Conf. on Computer Design (ICCD), Oct. 1992, pp. 570–
575.
[41] R. Rajsuman, “RAMBIST builder: A methodology for automatic built-in self-test design of
embedded RAMs,” in Proc. IEEE Int’l Workshop on Memory Technology, Design and Testing
(MTDT), San Jose, 1996, pp. 50–56.
[42] C. Cheng, C.-T. Huang, J.-R. Huang, C.-W. Wu, C.-J. Wey, and M.-C. Tsai, “BRAINS: A
BIST complier for embedded memories,” in Proc. IEEE Int’l Symp. on Defect and Fault
Tolerance in VLSI Systems (DFT), Yamanashi, Oct. 2000, pp. 299–307.
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