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姓名 陳瑋晏(Wei-Yan Chen) 查詢紙本館藏 畢業系所 光電科學與工程學系 論文名稱 以矽中介層架構設計用於4通道 * 25-Gbps光連接模組之接收端光學次系統組裝
(Design of Receiver Optical Sub-Assembly for 4-channel * 25-Gbps Optical Interconnect Module using Silicon Interposer Structure)相關論文 檔案 [Endnote RIS 格式]
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至系統瀏覽論文 (2026-7-1以後開放)
摘要(中) 本論文提出以矽光學平台為核心,設計具嵌入式高分子聚合物波導光連接模組之接收端次系統組裝,模組傳輸速度為4通道 25-Gbps。光訊號透過高分子聚合物波導的傳遞,經過矽光學平台上的45反射面轉折耦合進光偵測器,再由高頻傳輸線將電訊號導出。此模組是以應用於版與版或晶片與晶片之間的光學連接為設計初衷。在模擬結果中,整體光路的耦光效率效率為26.1%,且以-1 dB作為光學耦合效率容忍範圍,高分子聚合物波導及光偵測器的位移容忍度皆在17 m以上。各通道間的光學串音皆在-40 dB以下。高頻傳輸線在工作頻率為0.1~62.5GHz的情況下,實際量測結果反射損耗在14 dB以上,插入損耗在0.4 dB以下。 摘要(英) In the thesis, we designed a receiver optical sub-assembly for optical interconnect combined with polymer waveguides based on silicon optical bench. The transmission speed of receiving module is 4 channel 25-Gbps. Optical signal is transferred within polymer waveguides and steered by 45 reflector coupling into photodetecter(PD). And then electrical signal is exported by high speed transmission line. The receiving module can be apply to board to board or chip to chip optical interconnect.
In simulate result, the optical coupling efficiency of system is 26.1%. And the -1 dB alignment tolerances for both polymer waveguides and PD are larger than 17 m. The inter-channel optical crosstalk are lower than -40 dB. The measured return loss is higher than 14 dB and insertion loss is lower than 0.4 dB woth the high speed transmission line works in 0.1 ~ 62.5GHz.關鍵字(中) ★ 矽
★ 光連接關鍵字(英) 論文目次 摘要 i
Abstract ii
目錄 iii
圖目錄 v
表目錄 viii
第一章 緒論 1
1-1 前言 1
1-2 光學連接模組技術與發展 4
1-3 以矽光學平台為核心設計光連接收發模組 9
第二章 光連接模組接收端次系統組裝設計 11
2-1 接收端次系統組裝架構 11
2-2 接收端光偵測器之規格 12
2-3 矽光學平台與高分子聚合物波導結構尺寸設計 13
2-4 接收端光路場圖模擬及效率分析 17
2-5 光偵測器與高分子聚合物波導位移容忍度與串音模擬 19
2-6 25-Gbps接收端高頻傳輸線設計 23
第三章 光連接接收端次系統組裝製程 26
3-1 矽基版光學平台製程 26
3-2 金屬製程與矽光學平台之整合 29
3-2-1 45度微反射面之高反射率金屬製成 29
3-2-2 25-Gbps高頻傳輸線製程 31
3-2-3 覆晶封裝之錫金焊料製程 33
第四章 接收端次系統組裝特性量測 35
4-1 矽光學平台光學特性分析 35
4-2 25-Gbps高頻傳輸線高頻特性量測 39
第五章 結論與未來展望 41
參考文獻 43參考文獻 [1] Koji Yamada, Yutaka Urino, Takahiro Nakamura, asuhiko Arakawa “Integrated Silicon-based Optical Interconnect for Fast, Compact, Energy-efficient Electronic Circuit” NTT Technical Review, Vol.11, No.2 ,2013.
[2] http://arstechnica.com/information-technology/2015/05/ibm-demos-first-fully-integrated-monolithic-silicon-photonics-chip/
[3] Roger Dangel,* Jens Hofrichter, Folkert Horst, Daniel Jubin, Antonio La Porta, Norbert Meier, Ibrahim Murat Soganci, Jonas Weiss, Bert Jan Offrein “Polymer Waveguides for Electro-Optical Integration in Data Centers and High -performance Computers“ OPTICS EXPRESS, Vol.23, No.4 ,2015.
[4] Yasunobu Matsuoka, Yong Lee, Hideo Arimoto, Toshiaki Takai, Norio Chujo, Naoki Matsushima, Masataka Sato, Shinji Komatsuzaki, Akira Ogura, Kinya Yamazaki, and Yoshinori Sunaga “A High-density 300-Gbit/s Parallel Optical Interconnect Module with Efficient Optical Sub-assembly Techniques“ IEEE,2015.
[5] Eun Kyu Kang,1 Yong Woo Lee,1 Sooraj Ravindran,2 Jun Ki Lee,3 Hee Ju Choi,4 Gun Wu Ju,1 Jung Wook Min,4 Young Min Song,5 Ik-Bu Sohn,3 and Yong Tak Lee1,* “4 channel × 10 Gb/s bidirectional optical subassembly using silicon optical bench with precise passive optical alignment“ OPTICS EXPRESS, Vol.24, No.10 ,2016.
[6] Katharine Schmidtke, Frank Flens, Alex Worrall, Richard Pitwon, Felix Betschon, Tobias Lamprecht, Roger Kr¨ahenb¨uhl “960 Gb/s Optical Backplane Ecosystem Using Embedded Polymer Waveguides and Demonstration in a 12G SAS Storage Array“ JOURNAL OF LIGHTWAVE TECHNOLOGY, VOL. 31, NO. 24, 2013.
[7] Roger Dangel, Christoph Berger, René Beyeler, Laurent Dellmann, Max Gmür, Régis Hamelin, Folkert Horst, Tobias Lamprecht, Thomas Morf, Member, IEEE, Stefano Oggioni, Mauro Spreafico, Bert Jan Offrein “Polymer-Waveguide-Based Board-Level Optical Interconnect Technology for Datacom Applications“ IEEE TRANSACTIONS ON ADVANCED PACKAGING, VOL. 31, NO. 4, 2008
[8] http://www.kingfisherfiber.com/Application-Notes/02-Optical-Loss-Test-Concepts.aspx
[9] 許志宏, “具繞射式光學元件之矽基45微反射面研究,” 中央大學光電所碩士論文, 台灣 (2007)指導教授 伍茂仁、張正陽 審核日期 2016-7-27 推文 plurk
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