| 摘要(英) |
Mass production of the yield (Yield) and low cost has a close relationship, with the entry of nanometer era, appearing wafer defect patterns more volatile, the decomposition ratio of the number of defects accumulate operations through equal proportions observed crystal chart subject to different proportions of defect density influence.
This paper presents a Poisson yield as the basis, the number of grains fault wafer map (NBD) clustering and fault grain direction number (NCD) is a function of two characteristics observed coordinates, the most realistic of the wafer map show observe two features located in the ratio of the coordinate position.
Ratio analysis of randomly generated uniformly observed defects in the wafer map NBD and NCD distribution of the phenomenon and proposed saber feature map correction average number of flaws in the past, proposed, in order to achieve more in line with actual wafer map model, the use of NBD and NCD analyze the relationship between NBD and NCD, and defect wafer maps of classified do more in-depth analysis and verification.
In this experiment, we use the boomerang feature map feature map do with saber verified by observing feature pattern to identify damaged grain flocking situation and the location, view the uniformity of its flaws. And then to verify the practicality feature map Not classified wafer map, and thus to improve yield, test efficiency and reduce costs. |
| 參考文獻 |
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[11] MATLAB之工程應用,http://bime-matlab.blogspot.tw/
[12] 葉昱緯,“Application of Boomerang Chart to Real-World Mass Production Wafer Maps”, 碩士論文﹐中央大學﹐2016. |
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