以雷射還原金屬離子逕行線路圖案化於玻璃基板

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姓名

林晉毅(Ching-Yi Lin) 查詢紙本館藏

畢業系所

光電科學與工程學系

論文名稱

以雷射還原金屬離子逕行線路圖案化於玻璃基板
(Metallic Wire Patterning on Glass Substrate by Laser Reduction of Silver Ions)

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摘要(中)

本論文以鎖模之鈦藍寶石飛秒雷射在含有金屬離子的有機高分子材料中，引發銀離子的還原反應以製作出線寬達微米級的連續銀導線，其電阻率約為1.8×10-5 Ω•m ~ 4.3×10-5 Ω•m之間。實驗中改變不同雷射的照射條件，如入射光強度、樣品移動速度，觀察其變化與形成金屬結構之關係。藉由實驗參數組合，可製作出最小線寬為1.5 μm的金屬結構。
此外，本研究嘗試將金屬銀導線製作於軟性基板上，雖然成功地使銀還原於基板上，但礙於軟性基板的表面附著力不佳且耐熱性差，故難以製作出完整的連續銀導線，未來可嘗試表面粗糙化物理性的附著力或透過塗佈接著層獲得具化學性之鍵結，透過改良基板的表面附著力與薄膜中的銀粒子尺寸，以期達到在低溫下製成連續銀導線於軟性基板上。

摘要(英)

In this thesis, continuous silver micro-wires were fabricated by femtosecond laser direct writing (FLDW) of polyvinylpyrrolidone (PVP) films containing silver ions. The minimum line width achieved by FLDW is 1.5 μm. Using a solution with relatively higher concentration of silver nitrate, the resistivity of continuous silver wires can be further lowered down to 1.8×10-5 Ω•m.
Attempt of producing silver micro-wires on the flexible substrates was conducted. Although the result shows silver can be reduced on the substrate, the poor heat resistance and surface adherence of the flexible substrate hinder the production of continuous silver wires. Future area of work for improving the production process where surface roughening in combination of smaller silver particle size might lower the manufacturing temperature on flexible substrate effectively.

關鍵字(中)

★ 雷射
★ 圖案化
★ 金屬離子

關鍵字(英)

論文目次

中文摘要 i
Abstract ii
誌謝 iii
目錄 iv
圖目錄 vi
表目錄 ix
第一章緒論 1
1-1 前言 1
1-2 製程方式 2
1-3 研究動機 7
1-4 論文架構 8
第二章原理與研究方法 9
2-1 有機銀膠體 9
2-1-1 銀前驅物 10
2-1-2 保護劑 11
2-1-3 反應時間影響 18
2-1-4 溫度影響 19
2-2 雷射圖案化機制 20
2-2-1 雷射光還原 20
2-2-2 雷射退火 25
第三章實驗步驟與架構 28
3-1 實驗流程與樣品製作 28
3-2 雷射圖案化系統 30
3-3 電阻率量測系統 34
第四章實驗結果與討論 36
4-1 反應時間 36
4-2 溫度 39
4-3 雷射參數 41
4-3-1 入射功率 41
4-3-2 移動速度 45
4-4 電阻率 48
4-5 光還原閥值 51
第五章結論與未來展望 54
5-1 結論 54
5-2 未來展望 55
參考文獻 56

參考文獻

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指導教授

戴朝義

審核日期

2017-7-24

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