以乾式黏著劑應用於微流體系統接合之研究

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徐婉萁(Wan-Ci Syu) 查詢紙本館藏

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能源工程研究所

論文名稱

以乾式黏著劑應用於微流體系統接合之研究
(The Study of Dry Adhesive Bonding Phenomena in Microfluidics System)

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摘要(中)

本論文以乾式接著劑之雙面膠帶快速密封微流道基板，達成高接合強度與高品質之微流體系統。接合製程於微流體系統中的流道完整性相關聯，除了乾式膠帶以外的結合方法都必須在高溫高壓或是使用溶劑的條件下才能完成，這會降低成功率及耗費高成本。膠帶接合法容易操作且可於常溫、低壓及短時間內達成有效接合，然而製程簡易的條件下選用合適的膠帶與優化的接合參數對於微流體系統的品質可有效提升。具黏彈性膠帶與基材性質使接合介面有氣泡，進而影響接合強度，且不僅氣泡帶來影響，膠帶厚度亦是影響強度的因素，但較少學者詳細探討膠帶接合法中之接合影響因素，因此本論文針對膠帶接合法作相關探討。
為了製備高接合強度高品質的微流體系統，本論文探討雙面膠帶厚度、接合時間和覆蓋層性質三種影響性能的接合參數，使用30μm、50μm、60μm和80μm四種厚度的雙面膠及0秒(手壓)、5秒和15秒的接合時間，並分別接合不可撓覆蓋層和可撓覆蓋層。以顯微影像分析接合後之介面氣泡率與測量接合強度，並觀察流道橫切面形貌，結果以60μm雙面膠帶接合15秒時間有高的接合強度及好的介面形貌，分別接合不可撓覆蓋層之平均氣泡率為0.47±0.18%，比手動壓合減少了約7.97%，使接合強度增加約2.07 bar至11.26±1.49 bar；接合可撓覆蓋層透過緩壓操作之平均氣泡率為0.25±0.06%，與0秒相比下降約2.11%，使接合強度提升約0.97 bar至3.93±0.36 bar。不可撓覆蓋層因具有較好的剛性使強度遠大於可撓覆蓋層約7.3 bar，但可撓覆蓋層亦有足夠高的接合強度應用於微流體系統。
流道橫切面形貌可驗證接合介面中的黏著劑沒有被擠壓進入流道空間內，能夠保持完整的流道形貌不變形不堵塞。另外為觀察接合品質穩定性將接合完成之微流道裝置存放於大氣環境中30和60天，結果顯示放置時間對高強度裝置影響小。可為膠帶接合法製備微流體系統提供接合參數與膠帶選擇的參考依據，可幫助提升製程良率並適用於未來大量生產需求。

摘要(英)

In this study, the microchannel sealed with double-sided adhesive tape to achieve high bonding strength and high-quality microfluidic system. Bonding process was related to the microchannel integrity in the microfluidic system. Besides the dry adhesive tape bonding, it must be fabricated with the high temperature and pressure or via solvent conditions, which lead to low yield and high cost. The tape bonding is simple to operate, and the material is easily obtainable. Moreover, an effective bonding can be achieved at room temperature, low pressure and short bonding time. However, selecting suitable tapes and optimized bonding parameters in the simple manufacturing process can effectively improve the quality of the microfluidic chip. Due to the viscoelasticity of adhesive tape and substrate properties to produce the bubble phenomenon, the bonding strength will be affected. The bonding strength is influenced by two factors: the bubble and thickness of the tape. Few scholars discuss in detail the bonding strength factors with the tape bonding method. Therefore, we focus on investigating dry-adhesive bonding in this thesis.
In order to fabricate high bonding strength and high-quality microfluidic chips, this study discusses three parameters that affect the performance: tape thickness, bonding time, and properties of cover layer. This is achieved using 30μm, 50μm, 60μm, and 80μm thick double-sided tape and 0sec (hand press), 5sec, and 15sec bonding time, and bonding with inflexible cover layer and flexible cover layer respectively. The bubble ratio was analyzed by microscopic image, the bonding strength was measured, and the cross-section morphology of the channel was observed. The results were obtained by bonding with 60μm double-sided tape with 15sec bonding time of high bonding strength and competent interface morphology. The average bubble ratio of the inflexible cover layer is 0.47±0.18%, which is 7.97% lower than 0sec bonding time, and the bonding strength is increased by 2.07 bar to 11.26±1.49 bar; the average bubble ratio of the flexible cover layer is 0.25±0.06%, decreased about 2.11% compared to 0sec, and increases the bonding strength of about 0.97 bar to 3.93±0.36 bar. The inflexible cover layer is stronger than the flexible cover layer since the bonding strength increased 7.3 bar due to its better rigidity. Though the flexible cover layer also has enough bonding strength for the microfluidic chip.
The cross-section of the channel can verify the interface adhesive is not squeezed into the channel, and the shape of the channel remains constant without deformation or clogging. In addition, the devices were stored in the atmosphere for 30 and 60 days to observe the bonding-quality stability. The results show that the storage time does not significantly effect high-strength devices. It can be a reference for the preparation of microfluidic system by tape bonding process and the selection of tapes, which can improve the process yield and apply to mass production requirements in the future.

關鍵字(中)

★ 乾式黏著劑
★ 接合製程
★ 微流體系統
★ 接合強度
★ 氣泡率

關鍵字(英)

論文目次

摘要 I
Abstract II
誌謝 IV
目錄 V
圖目錄 VII
表目錄 XI
一、前言 1
1-1 微流體系統及其應用 1
1-2 微流體系統之基板材料演進 2
1-3 高分子微流體系統製作方法 2
1-4 微流體系統之結合封裝 3
1-4-1 直接結合(Direct bonding) 4
1-4-2 間接結合(Indirect bonding) 5
1-4-3 利用膠帶接合法製備微流體系統應用於生物檢測之例 15
1-5 研究動機 21
二、實驗材料設備及方法 22
2-1 實驗材料 22
2-2 實驗方法 22
2-2-1 微流體系統製程 23
2-2-2 接合介面之顯微影像觀察 24
2-2-3 接合強度量測 25
三、結果與討論 27
3-1 膠帶結構之差異 27
3-2 接合參數造成性能之影響 30
3-2-1 不同雙面膠帶厚度對於氣泡現象之影響 30
3-2-2 接合時間對於氣泡與接合強度之關係 35
3-3 以不同雙面膠帶厚度接合之流道橫切面 48
3-4 放置時間對於微流體系統接合之影響 50
四、結論 52
References 53
附錄 57

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指導教授

曹嘉文(Chia-Wen Tsao)

審核日期

2018-7-25

推文