參考文獻 |
[1] 楊龍杰著,認識微機電,滄海書局,台中市,2001年。
[2] 范智文,“利用電化學加工製作微電極和微孔之研究與分析”,國立中央大學機械所,博士論文,2010年。
[3] 徐泰然著,微機電系統與微系統-設計與製造,朱銘祥譯,美商麥格羅‧希爾國際股份有限公司台灣分公司,台北市,2003年。
[4] B. Bhattacharyya, J. Munda and M. Malapati, “Advancement in electrochemical micro-machining,” International Journal of Machine Tools and Manufacture, Vol. 44, No.15, pp. 1577-1589, 2004.
[5] 黃暐倫,“利用遮罩式電化學加工製作穿孔之最佳化參數分析”,國立中央大學機械所,碩士論文,2016年。
[6] X.L. Chen, N.S. Qu, H.S. Li and D. Zhu, “The fabrication and application of a PDMS micro through-holes mask in electrochemical micro-manufacturing,” Advances in Mechanical Engineering, Vol. 6, Article ID 943092, 2014.
[7] M. Datta and D. Landolt, “Fundamental aspects and applications of electrochemical microfabrication,” Electrochimica Acta, Vol. 45, No.15-16, pp. 2535-2558, 2000.
[8] R. V.Shenoy and M. Datta, “Effect of mask wall angle on shape evolution during through - mask electrochemical micromachining,” Journal of the Electrochemical Society, Vol. 143, No.2, pp. 544-549, 1996.
[9] J. Liu, D. Zhu, N.S. Qu and H.S. Li, “Micro multiple holes produced by through-mask electrochemical machining in metal sheets,” Electromachining & Mould, Vol. 3, pp. 37-39, 2008.
[10] D. Zhu, N.S. Qu, H.S. Li, Y.B. Zeng, D.L. Li and S.Q. Qian, “Electrochemical micromachining of microstructures of micro hole and dimple array,” CIRP Annals-Manufacturing Technology, Vol. 58, No.1, pp. 177-180, 2009.
[11] S. Q. Qian, D. Zhu, N.S. Qu, H.S. Li and D.S. Yan, “Generating micro-dimples array on the hard chrome-coated surface by modified through mask electrochemical micromachining,” The International Journal of Advanced Manufacturing Technology, Vol. 47, No.9, pp. 1121-1127, 2010.
[12] L. Wang, Q.D. Wang, X.Q. Hao, Y.C. Ding and B.H. Lu, “Finite element simulation and experimental study on the through-mask electrochemical micromachining (EMM) process,” The International Journal of Advanced Manufacturing Technology, Vol. 51, No.1, pp. 155-162, 2010.
[13] A. Ivanov, “Simulation of electrochemical etching of silicon with COMSOL,” Proceedings of COMSOL Conference, Stuttgart, Germany, 2011.
[14] A. Ivanov and U. Mescheder, “Dynamic simulation of electrochemical etching of silicon,” Proceedings of COMSOL Conference, Milan, Italy, 2012.
[15] A. Ivanov and U. Mescheder, “Primary current distribution model for electrochemical etching of silicon through a circular opening,” Proceedings of COMSOL Conference, Grenoble, France, 2015.
[16] C. Winkelmann and W. Lang, “Influence of the electrode distance and metal ion concentration on the resulting structure in electrochemical micromachining with structured counter electrodes,” International Journal of Machine Tools and Manufacture, Vol. 72, pp. 25-31, 2013.
[17] A. D. Davydov, T. B. Kabanovaaand V. M. Volgina, “Modeling of through-mask electrochemical micromachining,” Chemical Engineering, Vol. 41, pp. 85-90, 2014.
[18] X.L. Chen, N.S.Qu, H.S. Li and Z.N. Guoc, “Removal of islands from micro-dimple arrays prepared by through-mask electrochemical micromachining,” PrecisionEngineering, Vol. 39, pp. 204-211, 2015.
[19] S. Qian, and F. Ji, “Investigation on the aluminum-alloy surface with micro-pits array generating by through double mask electrochemical machining,” AASRI International Conference on Industrial Electronics and Applications, pp. 59-62, London UK, 2015.
[20] V.K. Jain and D. Gehlot, “Anode shape prediction in through-mask-ecmm using FEM,” Machining Science and Technology, Vol. 19, No. 2, pp. 286-312, 2015.
[21] X. Zhang, N.Qu, H. Li and Z. Xu, “Investigation of machining accuracy of micro-dimples fabricated by modified microscale pattern transfer without photolithography of substrates,” The International Journal of Advanced Manufacturing Technology, Vol. 81, No.9, pp. 1475-1485, 2015.
[22] H.S. Li, G.G. Wang, N.S. Qu and D.D. Zhu, “Through-mask electrochemical machining of a large-area hole array in a serpentine flow channel,” The International Journal of Advanced Manufacturing Technology, Vol. 89, pp. 933-940, 2017
[23] 田福助著,電化學-理論與應用,高立圖書有限公司,台北市,1996年。
[24] J. F. Thorpe and R. D. Zerkle, “Analytic determination of the equilibrium electrode gap in electrochemical machining,” International Journal of Machine Tool Design and Research, Vol. 9, No.2, pp. 131-144, 1969.
[25] S. Hinduja and M. Kunieda. “Modelling of ECM and EDM processes, ”CIRP Annals-Manufacturing Technology, Vol. 62, No. 2, pp. 775-797, 2013.
[26] 中仿科技公司:COMSOL Multiphysics V4.x 几何建模用戶指南,2010年,取自:www.CnTech.com.cn。
[27] M.A. Bejar, and F. Gutierrez, “On the determination of current efficiency in electrochemical machining with a variable gap,” Journal of Materials Processing Technology, Vol. 37, No.1, pp. 691-699, 1993.
[28] S.J. Lee, “COMSOL in electrochemical applications,” Proceedings of COMSOL Conference, Taipei, Taiwan, 2013.
[29] T. Isono, “Density, viscosity, and electrolytic conductivity of concentrated aqueous electrolyte solutions at several temperatures. Alkaline-earth chlorides, lanthanum chloride, sodium chloride, sodium nitrate, sodium bromide, potassium nitrate, potassium bromide, and cadmium nitrate,” Journal of Chemical and Engineering Data, Vol. 29, No.1, pp. 45-52, 1984.
[30] 陳千蕙,“移動刀具之遮罩式微電化學加工模擬與分析”,國立中央大學機械所,碩士論文,2016年。
[31] 陳泓悅,“熱流場對靜態刀具遮罩式微電化學加工的影響性”,國立中央大學機械所,碩士論文,2017年。 |