參考文獻 |
[1] 科技產業資訊室,「工業4.0與機械4.0範疇及內涵」,取自http://iknow.stpi.narl.org.tw/Post/Read.aspx?PostID=11726(2019.06.14)。
[2] J. Lee, B. Bagheri, and H. A. Kao, "A Cyber-Physical Systems Architecture for Industry 4.0-Based Manufacturing Systems", Manufacturing Letters, Vol. 3, pp. 18-23, 2015.
[3] F. T. Cheng, H. Tieng, H. C. Yang, M.-H. Hung, Y. C. Lin, C. F. Wei, and Z.-Y. Shieh, "Industry 4.1 for Wheel Machining Automation", Robotics and Automation Letters, Vol. 1, No.1, pp. 332-339, 2016.
[4] H. C. Huang, Y. C. Lin, M. H. Hung, C. C. Tu, and F. T. Cheng, "Development of Cloud-Based Automatic Virtual Metrology System for Semiconductor Industry", Robotics and Computer-Integrated Manufacturing, Vol. 34, pp. 30-43, 2015
[5] H. Rostami, J. Y. Dantan, and L. Homri, "Review of Data Mining Applications for Quality Assessment in Manufacturing Industry: Support Vector Machines", International Journal of Metrology and Quality Engineering, Vol. 6, No. 4, pp. 401-418, 2015.
[6] S. Lv, H. Kim, B. Zheng, and H. Jin, "A Review of Data Mining with Big Data Towards Its Applications in The Electronics Industry", Applied Sciences, Vol. 8, No. 4, p. 582, 2018.
[7] Z. Shi, J. Lee, and P. Cui, "Prognostics and Health Management Solution Development in LabVIEW: Watchdog Agent® Toolkit and Case Study", Prognostics and System Health Management Conference, pp. 1-6, 2016.
[8] A. Lukindo, “LabVIEW Queued State Machine Consumer Producer Architecture”, 取自http://www.mezintel.com/blog/labview-queued-state-machine/(2019.06.14)
[9] 莊寶鵰,張添盛,黃仕慶,「電子組裝製程失效模式與效應分析之探討」,中華民國品質學會第38 屆年會暨第8 屆全國品質管理研討會,2002。
[10] E. D. Castillo, “Process Optimization: A Statistical Approach. Springer Science & Business Media”, 2007.
[11] W. Sauer, M. Oppermann, G. Weigert, S. Werner, H. Wohlrabe, K. J. Wolter, and T. Zerna, “Electronics Process Technology: Production Modelling, Simulation and Optimization”, Springer Science & Business Media, 2007.
[12] E. Alhoniemi, “Unsupervised Pattern Recognition Methods for Exploratory Analysis of Industrial Process Data”, Doctoral thesis, Helsinki University of Technology, Finland, 2002.
[13] M. Liukkonen, E. Havia, and Y. Hiltunen, “Computational Intelligence in Mass Soldering of Electronics–A survey,” Expert Systems with Applications, Vol. 39, No. 10, pp. 9928-9937, 2012.
[14] M. Liukkonen, T. Hiltunen, E. Havia, H. Leinonen, and Y. Hiltunen, “Modeling of Soldering Quality by Using Artificial Neural Networks,” IEEE Transactions on electronics packaging manufacturing, Vol. 32, No. 2, pp. 89-96, 2009.
[15] M. Liukkonen, E. Havia, H. Leinonen, and Y. Hiltunen, “Application of self-Organizing Maps in Analysis of Wave Soldering Process”, Expert Systems with Applications, Vol. 36, No. 3, pp. 4604-4609, 2009.
[16] T. N. Tsai and C. W. Tsai, “ Development of A Closed-Loop Diagnosis System for Reflow Soldering Using Neural Networks and Support Vector Regression”, International Journal of Industrial Engineering, Vol. 21, No. 1, pp. 19-33, 2014.
[17] J. J. Sha, and E. S. Pan, “Soldering Parameter-Setting Approach Based on Improved Adaptive Neuro Fuzzy Inference Model”, Journal of Shanghai Jiaotong University, Vol.45, No.12, pp. 1741-1746, 2011.
[18] F. Howie, D. Tilbrook, and C. Lea, “Blowholing in PTH Solder Fillets: Part 7 Optimising the Soldering,” Circuit World, Vol. 13, No. 2, pp. 42-45, 1987.
[19] P. Mesenbrink, J. C. Lu, R. McKenzie, and J. Taheri, “Characterization and Optimization of a Wave-Soldering Process", Journal of the American Statistical Association, Vol. 89, No. 428, pp. 1209-1217, 1994.
[20] Y. H. Lin, W. J. Deng, J. R. Shie, and Y.-K. Yang, “Optimization of Reflow Soldering Process for BGA Packages by Artificial Neural Network”, Microelectronics international, Vol. 24, No. 2, pp. 64-70, 2007.
[21] A. McAndrew, J.H. Wang, and C.S. Tseng, “Introduction to Digital Image Processing with MATLAB”, 2011.
[22] 陳煜彬,「應用機器視覺之新式晶圓定位方法」,國立中央大學光機電工程研究所碩士論文,民國100年。
[23] 張軒慈,「應用繞射光學元件之齒輪量測系統開發」,國立中央大學光機電工程研究所碩士論文,民國105年。
[24] 陳智怡,「應用投射疊紋技術於齒輪精度量測」,中央大學光機電工程研究所碩士論文,民國106年。
[25] 歐智達光源,「同軸光源產品詳細資訊」,取自http://omnitek-lights.com/products/?p=OKCL&t=%E5%90%8C%E8%BB%B8%E7%87%88(2019.06.14)
[26] 周至華,「機器學習」,清華大學出版社,2016。
[27] L. Breiman, ”Classification and Regression Trees”, Routledge, 2017.
[28] 「支持向量機」,取自https://zh.wikipedia.org/wiki/支持向量機(2019.06.14)。
[29] N. J. Nalini, and S. Palanivel, "Music emotion recognition: The combined evidence of MFCC and residual phase", Egyptian Informatics Journal, Vol 17, pp. 1–10, 2016.
[30] 「邏輯回歸」,取自https://en.wikipedia.org/wiki/Logistic_regression(2019.06.14)。
[31] L. Breiman, ”Random forests”, Machine Learning, Vol 45, pp 5–32, 2001
[32] "IPC-A-60 Post Solder Solvent Cleaning Handbook", 取自http://www.ipc.org/toc/ipc-sc-60a.pdf(2019.06.14)
[33] OK International Inc, “ Technical Note: Extending Soldering Iron Tip Life”, 2006.
[34] R. C. Martin, “Clean Architecture: A Craftsman′s Guide to Software Structure and Design”
[35] 游峰碩,「UML物件導向系統分析與設計」,博碩文化,2017。
[36] National Instruments, “Queued Message Handler Template documentation”, 取自 http://www.ni.com/tutorial/53391/en/ (2019.06.14)
[37] J. A. Swets, ”Signal detection theory and ROC analysis in psychology and diagnostics : collected papers”, Lawrence Erlbaum Associates, 1996.
|