參考文獻 |
參考文獻
[1] Zywitzki O and Hoetzsch G 1996 Surf. Coat. Technol. 86-87 640-647.
[2] Jones K et al. 1998 Appl. Phys. Lett. 83 8010-8015
[3] Vacandio F et al. 2001 Electrochim. Acta 46 3827-3834
[4] Wang X, Yoshikawa A 2004 Prog. Cryst. Growth Charact. Mater. 48-49 42-103
[5] Jergel M, Snchez O and Albella J 2004 Surf. Coat. Technol. 180-181 140-144
[6] Mahmood A et al. 2003 Diam Relat Mater 12 1315-1321
[7] Altun H and Sen S 2005 Surf. Coat. Technol. 197 193-200
[8] Vissutipitukul P and Aizawa T 2005 Wear 259 482-489
[9] Yao S and Kao W 2006 Tribol Int 39 332-341
[10] Sproul W et al. 1998 Vacuum 51 641-646
[11] Oliveira I C, Grigorov K G, Maciel H S, Massi M and Otani C 2004 Vacuum 75 331-338
[12] Zhang J X et al. 2005 Surf. Coat. Technol. 198 68-73
[13] Guo Q X, Yoshitugu M, Tanaka T and Ogawa H 2005 Thin Solid Films 483 16-20
[14] Quirk M and Serda J 2001 Trans. Semicond. Manuf. 9 081001
[15] Stranski J N and Krastanov L 1938 Ber. Akad. Wiss. Wien. 146 797-1938.
[16] 莊達人,VLSI 製造技術,高立圖書有限公司,1996年。
[17] Schiller S et al. 1993 Surf. Coat. Technol. 61 331-337
[18] Kelly P J and Arnell R D 1999 Vacuum 17 945–953
[19] Bradley J W, Bcker H, Aranda Y and Arnell R D 2002 Plasma Sources Sci. Technol. 11 165-174
[20] Miyagi T et al. 2013 Thin Solid Films 442 32–25
[21] Benegra M et al. 2006 Thin Solid Films 494 146-150
[22] Koski K and Juliet P 1999 Surf. Coat. Technol. 116-119 716–720
[23] Bruer G, Ruske M and Teschner G 1998 Vacuum 51 655–659
[24] Sellers J et al. 1998 Surf. Coat. Technol. 98 1245–1250
[25] Oettel H and Wiedemann R 1995 Surf. Coat. Technol. 6 273–278
[26] Knotek O, Elsing R and Jungblut F 1991 Surf. Coat. Technol. 46 265–274
[27] Watari K, Hotta Y, Mitsuishi K and Yamazaki M 2006 J. Eur. Ceram. Soc. 26 385–390
[28] Belkind A. et al. 2005 New J. Phys. 7 90
[29] Okano H, Takahashi Y, Tanaka T and Nakano S 1992 Jpn. J. Appl. Phys.31 3446-3451
[30] Ishihara M and Yamamoto K 2001 Jpn. J. Appl. Phys. 40 2413–2416
[31] Chapman, B., Glow Discharge Processes, John Wiley & Sons lnc, 1980.
[32] 羅正忠,半導體製程技術導論,歐亞出版社,2006 年。
[33] Hutchinson I et al. Principles of Plasma Diagnostics 2nd, Cambridge University Press, 2002.
[34] Chodun R, Nowakowska K and Zdunek K 2015 Materials Science-Poland 33 894–901
[35] Acosta J, Rojo A, Salas O and Oseguera J 2007 Surf. Coat. Technol. 201 7992–7999
[36] Pearson K. et al. 1901 On lines and planes of closest fit to systems of points in space. The London, Edinburgh, and Dublin Philosophical Magazine and Journal of Science 2 559–572.
[37] Hotelling H. et al. 1993 Analysis of a complex of statistical variables into principal components. Journal of Educational Psychology 24, 417–441.
[38] J. Hogenboom and L. Barina, "Principal component analysis and sidechannel attacks-master thesis;′ Master′s thesis, 2010.
[39] Sanginésa R, Abundiz-Cisnerosa N, Utrera H O, Diliegros-Godinesb C and Machorro M R 2018 J. Phys. D 51 9
[40] Maa D L, Liua H Y, Denga Q Y, Yangb W M, Silinsc K, Huanga N, Lenga Y X 2019 Vacuum 160 410–417
[41] Barshilia H C, Deepthi B, Rajam K S 2008 Thin Solid Films 516 4168–4174
[42] Chodun R and Zdunek K 2015 Mater. Sci. Pol. 33 894-901
[43] Welzel, U., J. Ligot, P. Lamparter, A. C. Vermeulen, E. J. Mittemeijer, “Stress analysis of polycrystalline thin films and surface regions by X-ray diffraction”, Journal of Applied Crystallography, 38, 1-29, 2004.
[44] Cullity, B. D., S. R. Stock, Elements of X-Ray Diffraction, Prentice Hall, 2001.
[45] Birkholz, M. et al. Thin Film Analysis by X-Ray Scattering, Wiley, 2006.
[46] Akhilesh P, Shankar D, Sandeep D and Davinder K 2016 Mater Sci Semicond Process 52 16-23
[47] Ibrahim A and Newaz G 2009 Thin Solid Films 517 4372–4378
[48] Chang C T, Yang Y C , Lee J W and Lou B S 2014 Thin Solid Films 572 161-168
[49] Jiao X Q , Shi Y , Zhong H, Zhang R and Yang J 2014 J. Mater Sci.: Mater. Electron. 26 801–808
[50] Chodun R, Zdunek K 2015 Mater. Sci. Pol. 33 894-901
[51] Chang C T, Yang Y C , Lee J W and Lou B S 2014 Thin Solid Films 572 161-168
[52] Choudhary R K, Mishra P, Biswas A and Bidaye A C 2013 Mater. Sci. Eng. C 759-462
[53] Jin H , Zhou J, Dong S R, Feng B, Luo J K, Wang D M , Milne W I and Yange C Y 2012 Thin Solid Films 520 4863-4870
[54] Cheng H, Sun Y, Hing P 2003 Thin Solid Films 434 112–120
[55] Wang C C, Lu C J, Shiao M H and Shieu F S 2005 J. Vac. Sci. Technol. B 23 621
[56] Chenga H, Sunb Y, Zhangb J X, Zhangc Y B, Yuanb S and Hing P 2003 J. Cryst. Growth 254 46–54
[57] Wang C C, Chiu M C, Shiao M H and Shieua F S 2004 J. Electrochem. Soc. 151 F252-F256
[58] Lu Y F, Ren Z M, Chong T C, Cheong B A, Chow S K, and Wang J P 2000 J. Appl. Phys. 87 1540
[59] Zhanga J X, Chenga H, Chena Y Z, Uddina A, Yuana S, Gengb S J, Zhang S 2005 Surf. Coat. Technol. 198 68–73
[60] Molleja J G, Gómez B J, Ferrón J, Gautron1 Eric and et al. 2013 Eur. Phys. J. Appl. Phys. 64 20302
[61] Mirpuri C, Xu S,Long J D and Ostrikov K 2007 Jpn. J. Appl. Pys. 101 024-312
[62] Xua X H, Wua H S, Zhanga C J and Jin Z H 2001 Thin Solid Films 388 62-67
[63] Cherng J S, Chang D S 2010 Vacuum 84 653–656
[64] Chiu K H, Chen J H, Chen H R and Huang R S 2007 Thin Solid Films 515 4819–4825
[65] Knisely K E , Hunt B, Troelsen B, Douglas E, Griffin B A and Stevens J E 2018 J. Micromech. Microeng. 28 115-009
[66] Liu H Y, Tang G S 2013 J. Cryst. Growth 363 80–85
[67] Aveyarda J, Bradley J W, McKaya K, Fiona McBrideb, Donaghya D, Ravalb R and Raechelle A. D’Sa 2017 J. Mater. Chem. 5 2500-2510
[68] Lee H C, Lee J Y 1997 J. Mater. Sci. Mater. Electron. 8 385-390
[69] Leea H C, Leea J Y, Ahn H J 1994 Thin Solid Films 251 136- 140
[70] Barshilia H C, Deepthi B, Rajam K S 2008 Thin Solid Films 516 4168–4174
[71] Huang H J, Kau1 L H, Wang S H, Hsieh Y L, Lee C C, Fuh Y K and Li T T 2019 Int. J. Adv. Manuf. Technol 101 329–337
[72] Jia X, Jin C, Buzza M, Wang W and Lee J 2016 Renew. Energ. 99 1191–1201
[73] Wang S H, Chang H E, Lee C C, Fuh Y K and Li T T 2020 Mater. Chem. Phys. 240 122186 |