| 摘要(英) |
In this study, we used a marked PMMA board was sandwiched between PMMA substrates as a micro-channel wafer, and a bonding solvent (acetone, alcohol) was placed for bonding, and the bonding status was observed. PMMA has different reactivity to the bonding solvent and changes with the increase of the bonding pressure applied. Therefore, this experiment is designed for bonding pressure parameters of 30N, 40N, and 50N, and bonding is performed with alcohol, acetone, and their mixed solvents. Observe the microstructure using an optical microscope, perform stress analysis with digital photoelasticity, and observe the bonding strength using the Lashin test. It has been found through experiments that acetone is more reactive to PMMA than alcohol and has better bonding ability, but it also has more damage to the structure of PMMA materials, and the increase in bonding force intuitively increases the bonding strength. |
| 參考文獻 |
[1] Dung-An Wang, Qiao-Dong Ji, “Design and fabrication of a microchannel for energy harvesting,” pp.2-4, 2013.
[2] A. Mathur, S.S. Roy, M. Tweedie, S. Mukhopadhyay, S.K. Mitra, J.A. McLaughlin, “Characterisation of PMMA microfluidic channels and devices fabricated by hot embossing and sealed by direct bonding,” Current Applied Physics, pp.1-2, 2009.
[3] M-E Vlachopoulou, A Tserepi, P Pavli , P Argitis, M Sanopoulou and K Misiakos, “A low temperature surface modification assisted method for bonding plastic substrates,” Journal of Micromechanics and Microengineering, pp.1-2, 2008.
[4] Donald M Kenney, “Method of Isolating Chips of a Wafer of Semiconductor Material,” U.S.Pat.3332137, 1967.
[5] M. Shimbo, K. Furukawa, K. Fukuda, and K. Tanzawa, “Siliconto‐silicon direct bonding method,” Journal of Applied Physics, pp.2987-2989, 1986.
[6] Q.-Y. TONG et al., Semiconductor Wafer Bonding : Science And Technology, John Wiley&Sons, Inc. pp. 17-135, 1999.
[7] Zongbo Zhang, Xiaodong Wang, Yi Luo ,Shengqiang He, Liding Wang, “Thermal assisted ultrasonic bonding method for poly(methyl methacrylate) (PMMA) microfluidic devices,” Talanta, pp.1-4, 2010.
[8] Tien His Lee, “Semiconductor thin film transfer by wafer bonding and advanced ion implantation layer splitting technologies,” ProQuest Dissertations And Theses, pp.100-121, 1998.
[9] Suzhu Yu, Shu Pei Ng, Zhenfeng Wang, Chu Long Tham, Yong Chear Soh, “Thermal bonding of thermoplastic elastomer film to PMMA for microfluidic applications,” Surface and Coatings Technology, pp.1-2, 2016.
[10] Hong Hanh Tran, Wenming Wu, Nae Yoon Lee, “Ethanol and UV-assisted instantaneous bonding of PMMA assemblies and tuning in bonding reversibility,” Sensors and Actuators B: Chemical, pp.1-3, 2012.
[11] S. H. Ng, R. T. Tjeung, Z. F. Wang, A. C. W. Lu, I. Rodriguez, N. F. de Rooij, “Thermally activated solvent bonding of polymers,” Institute of Materials Research and Engineering, pp.1-5, 2008.
[12] Lynh Huyen Duong, Pin-Chuan Chen, “Novel Solvent Bonding Method for Creation of a Three-Dimensional, Non-planar, Hybrid PLA/PMMA Microfluidic Chip,” Sensors and Actuators A Physical, pp.2-9, 2018.
[13] Jian Zhou, Arutha Kulasinghe, Amanda Bogseth, Ken O’Byrne, Chamindie Punyadeera and Ian Papautsky, “Isolation of circulating tumor cells in non-small-cell-lung-cancer patients using a multi-flow microfluidic channel,” Microsystems & Nanoengineering, pp.1-5, 2019.
[14] 曾垂拱, 徐仰億, “A method for quantitative stress analysis by digital photoelasticity,” 國立台灣科技大學機械工程系, pp.2-12, 1997. |
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