| 摘要(英) |
In the batch cleaning of silicon wafers, the fluid flow in the cleaning tank is important. It affects the cleanliness of the silicon wafer, the subsequent production process, and the final product yield. In order to analyze the fluid flow in the cleaning tank, we build a numerical model to investigate in depth, and try to optimize the cleaning tank.
There is a lack of information about removal mechanism of particles attached to the wafer surface. Therefore, this study first explains all the forces of particle attached on wafer surface, and how to remove particles by fluid flow. And then proposes a novel method to verify the effectiveness of the simulation. It aims to calculate the theoretical value of the shear stress through the particle removal mechanism. Next, we compare that with the existing particle residual distribution and the simulation result of the wafer surface shear stress, to determine the validity of the numerical model. After that, we discuss fluid flow situation in the cleaning tank and give a detailed explanation. Finally, we change the flow rate and geometry in this model to figure out which way is benefit for batch cleaning. By altering different parameters mentioned above, we conclude that changing the geometry of the cleaning tank components is an effective way to optimize the cleaning efficiency. |
| 參考文獻 |
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