低溫錫鉍合金與銅基材之濕潤性質探討

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莊博勛(Bo-Xun Zhuang) 查詢紙本館藏

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化學工程與材料工程學系

論文名稱

低溫錫鉍合金與銅基材之濕潤性質探討

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至系統瀏覽論文 (2028-7-31以後開放)

摘要(中)

隨著先進電子構裝的技術提升，由於多層堆疊的結構中內含有各種不同性質的材料，高溫製程容易造成晶片翹曲及長期可靠度的問題，Sn-58Bi銲料之熔點為138度、具有好的抗潛變能力。濕潤性質對於迴焊是非常重要的，所以本實驗選用助焊劑含鹵素及不含鹵素之Sn-58Bi銲料及不含鹵素之Sn-56Bi1Ag0.2C銲料探討其在銅基板上於不同迴焊溫度及時間的濕潤性質。
從TG-DTA結果發現，有無鹵素對銲料熔點並無影響，然而添加銅銀之後銲料熔點下降了一度，含鹵素之SnBi銲料之接觸角不論時間長短或迴焊時間長短都大於18度，說明溫度對於該銲料濕潤性質影響不大，然而不含鹵素的SnBi銲料接觸角都比含鹵素銲料低，說明其濕潤性質較好。從前面的熱分析結果發現，在到達熔點後其熱重損失率有鹵素銲料為無鹵素銲料的兩倍多，代表助焊劑在迴焊過程中快速的揮發，來不及保護銲料及基板被氧化，造成濕潤性質下降，另外再添加了銀銅的SnBi銲料因為銀具有良好的抗氧化性，使銲料之接觸角降低，同時使濕潤性質變好。

摘要(英)

With advancements in advanced electronic packaging technologies, the inclusion of various materials with different properties in multilayer stack structures poses challenges such as chip warpage and long-term reliability issues when subjected to high-temperature processes. Sn-58Bi solder, with a melting point of 138°C, exhibits excellent resistance to creep deformation. Wetting property is crucial during reflow, thus in this experiment, both halogen-containing and halogen-free Sn-Bi solder, as well as halogen-free Sn-56Bi1Ag0.2C solder, were selected to investigate their wetting characteristics on copper substrates at different reflow temperatures and times.
From the TG-DTA results, it was observed that the addition of halogens had no impact on the solder′s melting point. The addition of copper-silver to the solder resulted in a one-degree decrease in the melting point. For the halogen-containing SnBi solder, the contact angle was consistently above 18 degrees. This indicates that temperature had minimal effect on the wetting property . On the other hand, the halogen-free solder exhibited lower contact angles compared to the halogen-containing solder, indicating better wetting characteristics. The thermal analysis results showed that the halogen-containing solder had a rapidly weight loss rate after reaching the melting point. This suggests that the flux in the halogen-containing solder evaporated rapidly during the reflow process, possibly leading to insufficient protection of the solder and substrate from oxidation, resulting in a decrease in wetting property. The addition of silver and copper to the SnBi solder improved wetting characteristics, as silver possesses excellent antioxidation properties, leading to better wetting properties.

關鍵字(中)

★ 濕潤性
★ 接觸角
★ 錫鉍
★ 銲料

關鍵字(英)

論文目次

摘要 I
Abstract II
致謝 III
目錄 IV
圖目錄 VI
表目錄 VIII
1 第一章緒論 1
1-1 前言 1
1-2 電子構裝簡介 2
1-3 電子構裝技術 4
1-3-1 通孔插裝技術 (Through-Hole Technology) 5
1-3-2 表面貼裝技術 (Surface Mount Technology) 6
1-3-3 覆晶構裝 (Flip Chip Technology) 7
1-3-4 三維積體電路構裝 (Three-dimensional Integrated Circuit) 9
1-4 低溫銲料簡介 13
1-4-1 Sn-Bi銲料 14
1-4-2 Sn-Bi銲料添加元素 20
1-5 濕潤性質(wettability) 23
1-6 研究動機 26
2 第二章實驗方法 27
2-1 銲料及樣品製備 27
2-2 試片分析 28
2-2-1 原子力顯微鏡 (Atomic force microscope, AFM) 29
2-2-2 熱重熱示差分析儀(Thermogravimetry/Differential Thermal Analyzer, TG-DTA) 29
2-2-3 掃描式電子顯微鏡 (Scanning Electron Microscope, SEM) 30
3 第三章結果與討論 31
3-1 熱性質分析 31
3-2 Sn-Bi銲料之濕潤性探討 34
3-2-1 鹵素對於Sn-Bi銲料的濕潤性影響 34
3-2-2 Sn-56Bi-1Ag-0.2Cu銲料濕潤性質 40
4 第四章結論 44
參考文獻 45

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指導教授

吳子嘉

審核日期

2023-8-14

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