藍寶石薄基板圓通孔和啞鈴形通孔之超快脈 衝雷射微鑽孔研究

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姓名

鄭亦宸(Yi-Chen Zheng) 查詢紙本館藏

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光機電工程研究所

論文名稱

藍寶石薄基板圓通孔和啞鈴形通孔之超快脈衝雷射微鑽孔研究
(Study on Ultrashort Pulsed Laser Micro-drilling of Circular and Dumbell-shaped Vias in Thin Sapphire Substrate)

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摘要(中)

本研究探討藍寶石薄基板使用超快脈衝雷射進行圓通孔和啞鈴形
通孔的微鑽孔技術。由於其高熱傳導性和優異的光學特性，藍寶石薄基板在
光電子學、光學器件和生物醫學等領域具有廣泛應用前景。然而，藍寶石材
料的硬脆、難加工特性，傳統的機械鑽孔技術在 100 微米孔徑以下的微鑽
孔上已面臨瓶頸。為了克服傳統鑽孔技術的限制，本研究提出了一種基於超
快脈衝雷射的微鑽孔方法。本研究使用飛秒雷射搭配六軸移動平台的物鏡
加工系統進行研究，利用飛秒雷射產生高能量密度的光束在藍寶石薄基板
上進行微鑽孔，六軸移動平台可以改變平台角度以調整雷射的入射角度。通
過優化的飛秒雷射參數設定，本研究成功地實現了在藍寶石薄基板上形成
圓通孔和啞鈴形通孔。本研究分析不同的雷射參數對鑽孔品質的影響，包括
平滑的孔壁、無裂紋和最小錐度等，最後透過實驗調整出適當的參數組合並
實現高品質的圓通孔和啞鈴形通孔。

摘要(英)

This study investigates the micro-drilling technique of circular through-holes
and dumbbell-shaped through-holes on sapphire thin substrates using an ultrafast
pulsed laser. Due to its high thermal conductivity and exceptional optical
properties, sapphire thin substrates hold extensive potential applications in
photonics, optical devices, and biomedical fields. However, the inherent hardness
and difficulty in processing sapphire material have posed challenges for
traditional mechanical drilling techniques, particularly for micro-drilling with
hole diameters below 100 micrometers. To overcome the limitations of
conventional drilling methods, this study proposes a micro-drilling approach
based on the ultrafast pulsed laser. The study employs a femtosecond laser in
conjunction with a six-axis motion platform and objective lens system for research
purposes. The femtosecond laser generates a high-energy density beam on the
sapphire thin substrate to perform micro-drilling, while the six-axis motion
platform allows for adjustment of the laser′s incident angle by changing the
platform′s orientation. Through optimization of the femtosecond laser parameters,
this study successfully achieves circular through-holes and dumbbell-shaped
through-holes on the sapphire thin substrate. The research analyzes the impact of
different laser parameters on drilling quality, including factors such as smooth
hole walls, absence of cracks, and minimal tapering. Finally, through
experimental adjustments, an appropriate parameter combination is determined,
resulting in the realization of high-quality circular through-holes and dumbbellshaped through-holes.

關鍵字(中)

★ 藍寶石鑽孔
★ 飛秒雷射
★ 六軸平台

關鍵字(英)

★ Sapphire drilling
★ femtosecond laser
★ Six axis platform

論文目次

摘要 i
Abstract ii
誌謝 iii
目錄 iv
圖目錄 vii
表目錄 x
符號說明 xi
一、前言 1
1-1 研究動機與目的 1
1-2 論文架構 2
二、文獻回顧與理論分析 4
2-1 藍寶石的基本性質 4
2-2 傳統加工方式 5
2-3 雷射加工參數 5
2-2-1 功率 6
2-2-2 脈衝重複頻率 6
2-2-3 脈衝寬度 6
2-2-4 脈衝能量 6
2-2-5 脈衝重疊率 7
2-2-6 焦點直徑 8
2-4 飛秒雷射加工技術 8
2-5 液體輔助雷射加工技術 10
2-6 藍寶石通孔的應用與品質要求 12
2-6-1 表面微裂痕 12
2-6-2 內壁平滑度 13
2-6-3 錐度 14
2-7 六軸平台的特點與應用 14
2-8 文獻傳承與創新 15
三、研究方法 17
3-1 飛秒雷射搭配六軸平台加工系統 17
3-2 實驗設計與參數最佳化 23
3-3 品質評估方法 25
3-3-1 雷射共軛焦分析 25
3-3-2 電子顯微鏡分析 26
四、實驗結果與討論 27
4-1 實驗流程 27
4-2 六軸平台TCP校正 28
4-2-1 調整焦平面高度 29
4-2-2 量測旋轉中心 29
4-2-3 量測Z軸高度偏差 29
4-3 雷射掃描策略 31
4-4 不同加工參數對通孔品質的影響 32
4-4-1 下表面損傷 34
4-4-2 上表面破孔裂紋 37
4-4-3 雙酸蝕刻 40
4-4-4 次表面損傷驗證 48
4-4-5 不同孔徑加工參數比較 51
4-5 傾斜鑽孔路徑規劃 53
4-6 傾斜鑽孔 54
五、結論與未來展望 59
5-1 結論 59
5-2 未來展望 60
六、參考文獻 61

參考文獻

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指導教授

何正榮(Jeng-Rong Ho)

審核日期

2023-8-17

推文