摘要(英) |
Chip floorplanning is a crucial step in chip design, determining the placement of modules on the chip canvas. A good floorplan minimizes the total wirelength of connections to different modules on the chip. Shorter wires imply less signal delay and lower power consumption, leading to faster and more efficient chip operation. However, considering the modern ICs with millions of transistors, conventional greedy-based or heuristic-based floorplan algorithms often leads to sub-optimal solutions. Reinforcement learning (RL) offers a promising approach to addressing these limitations. It learns through trial and error and guides by rewards, adapting its strategy to find the best solution. This makes RL suitable for tackling complex optimization problems like floorplanning.
This thesis introduces FusionPlanner, a novel model that effectively leverages both local and global information to autonomously create a valid chip layout design. Its performance can surpass or match state-of-the-art methods. It possesses numerous attractive advantages that are absent in previous works. Firstly, previous works on chip floorplanning have typically focused on hard macros. Our work addresses the challenges of handling soft modules by considering the area and connectivity of both soft modules and hard macros. This allows us to produce more accurate floorplans that take into account the full range of soft module options and prevent any overlap with hard macros. Secondly, our work uses a graph-based network training approach that focuses on the effective integration of edge features. Our method combines image features to capture local information and graph features to grasp global information. This integrated approach aims to enhance the perception of local details while capturing a more extensive contextual understanding within the image.
Our experiments demonstrate that our floorplan method can successfully improve the total wirelength of industrial designs with 28nm technology. In addition, our work can reduce the design time of chip floorplanning by considering soft modules earlier in the design process. |
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