P型鎂矽錫之元件測試與模組製作

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姓名

吳宛儒(Wan-Ju Wu) 查詢紙本館藏

畢業系所

電機工程學系

論文名稱

P型鎂矽錫之元件測試與模組製作
(Study of P-type Mg2(SiSn) Thermoelectric Devices and Modules)

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摘要(中)

近年來，溫室氣體的排放量不斷上升，導致全球暖化問題日益嚴峻。為此，各國專家學者積極尋求可再生能源的替代方案，並致力於擴大能源回收與再利用的研究。其中，熱電發電技術因其具有廣泛的應用前景而備受關注。熱電發電是利用溫度差來發電，根據塞貝克效應（Seebeck effect），當材料兩側存在溫度差時，就會產生電位差，進而產生電流，實現熱能向電能的轉換。
儘管目前熱電材料的轉換效率仍有待提高，但利用回收廢熱發電的方式仍具有可觀的發展潛力。科學家們不斷探索新的熱電材料，並透過合成和結構設計來提升其能量轉換效率。本論文以P型Mg2SnAg0.02+25 at% Mg+4% Mg2Si熱電材料為研究對象，探討了金屬擴散接合、導電銀漿接合、薄膜沉積接合和焊接測試等方法將其與N型Mg2(SiSn)材料組成熱電元件的可行性，並對元件的接合強度和輸出特性進行了量測與分析。
實驗結果表明，最佳的串接方式為金屬擴散接合，橋接金屬選用100um Ni片。採用冷壓方式將30um Al /30um Ag /20um Sn箔片疊加在P、N試片的表面，並進行1小時燒結，使金屬擴散接合成PNPN模組。最後，在PNPN模組兩端的試片表面塗覆導電Ag漿後，使用WU-4焊料焊接組成大型熱電模組。對具有最佳參數的PNPN大型模組進行了後續的熱電性能量測，並對其接合強度和輸出特性進行了進一步的分析。

摘要(英)

Due to the increase in greenhouse gases in recent years, the problem of global warming has become increasingly serious, and experts from all over the world are actively searching for alternative new energy sources and expanding research on energy recycling and reuse. One of the most popular research areas is thermoelectric power generation. Thermoelectric power generation is the use of temperature difference to generate electricity, according to the Seebeck effect, when there is a temperature difference between the two sides, that is, the potential difference, which generates electric current, realizing the result of the conversion of thermal energy into electrical energy.
Currently, the conversion efficiency of thermoelectric materials is still facing challenges, but the use of recycled waste heat and the generation of temperature difference in power generation still has considerable potential for development. Scientists are constantly striving to develop new thermoelectric materials by synthesizing and designing different structures to improve their energy conversion efficiency. In this paper, we focus on P-type Mg2SnAg0.02+25 at% Mg+4% Mg2Si thermoelectric material and try to form a thermoelectric element with N-type Mg2 (SiSn) by metal diffusion bonding, conductive Ag paste bonding, and soldering test, and then we measure and analyze the bonding strength and output characteristics of the element.
In the test results, we compared the best way to connect the thermoelectric elements, the selected bridge metal is 100um Ni sheet, and use the cold-pressing method to stack the contact metal 30um Al /30um Ag /20um Sn foil on the surface of P, N specimen respectively, and sintering for 1 hour to make the metal diffusion bonded to the PNPN module. Finally, the conductive Ag paste is coated on the surface of the specimen at the front and back of the PNPN module, and soldered with WU-4 solder to form a large-scale thermoelectric module. The PNPN module with optimal parameters is subsequently measured and analyzed for bond strength and output characteristics.

關鍵字(中)

★ P型鎂矽錫
★ 熱電材料
★ 熱電元件與模組製作

關鍵字(英)

★ P-type Mg2(SiSn)
★ Thermoelectric Materials
★ Thermoelectric Devices and Modules

論文目次

摘要 i
Abstract ii
誌謝 iv
目錄 v
圖目錄 ix
表目錄 xiv
1 第一章緒論 1
1-1 前言 1
1-2 研究目的及動機 2
2 第二章理論背景與文獻回顧 4
2-1 熱電效應 4
2-1-1 Seebeck效應 4
2-1-2 Peltier效應 6
2-1-3 Thomson效應 7
2-1-4 熱電效應統整結論 9
2-2 熱電優值係數(Thermoelectric figure of merit) 10
2-2-1 熱電優值與轉換效率之關係 12
2-2-2 電子熱導對熱導係數的影響 14
2-2-3 聲子熱導對熱導係數的影響 15
2-3 熱電材料介紹及應用 16
2-3-1 熱電材料種類與結構 16
2-3-2 熱電材料的應用 20
2-4 文獻回顧 21
2-4-1 Mg2(SiSn)晶體結構 21
2-4-2 P-type Ag摻雜之Mg2Sn 22
2-4-3 鋁作為Mg2(SiSn)之接觸金屬 26
2-5 熱電模組之研究 28
2-5-1 熱電材料接合 29
2-5-2 熱電元件電極接合研究 34
2-5-3 擴散阻擋層 36
3 第三章實驗量測儀器 37
3-1 電阻率量測 37
3-2 Seebeck係數量測 41
3-3 熱電塊材熱傳導率之量測 43
3-3-1 比熱量測 44
3-3-2 熱擴散係數量測 46
3-3-3 密度量測 47
3-4 掃描電子顯微鏡（SEM） 48
3-5 X射線繞射儀（XRD） 49
3-6 離子濺鍍機 (Sputter) 50
3-7 單一試片及模組輸出量測 51
4 第四章實驗方法與步驟 53
4-1 實驗前言 53
4-2 實驗流程 54
4-3 實驗樣品製備 55
4-3-1 P型矽粉摻雜 55
4-3-2 製備P型鎂矽粉末 58
4-3-3 高溫燒結鎂矽錫試片 61
4-4 熱電元件及模組製作 64
4-4-1 金屬與P、N粉末一起冷壓接合 64
4-4-2 Sputter Cu接合 66
4-4-3 導電Ag漿接合 68
4-4-4 金屬擴散接合 69
4-4-5 金屬擴散搭配焊料接合 71
4-5 大型模組製作 72
4-5-1 導電Ag漿接合成大型模組 72
4-5-2 金屬擴散搭配焊料接合成大型模組 73
5 第五章實驗結果與討論 74
5-1 熱電元件及模組實驗結果討論 74
5-1-1 金屬與P、N粉末一起冷壓接合測試結果 74
5-1-2 Sputter Cu與導電Ag漿接合測試結果 78
5-1-3 金屬擴散接合測試結果 79
5-1-4 金屬擴散搭配焊料接合測試結果 80
5-2 大型模組測試結果 84
5-2-1 導電Ag漿接合大型模組測試結果 85
5-2-2 金屬擴散搭配焊料接合大型模組測試結果 86
6 第六章結論與未來展望 89
參考文獻 90

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指導教授

辛正倫(Cheng-Lun Hsin)

審核日期

2024-7-23

推文