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"Liu,CY"的相關文件

類別	日期	題名	作者
[化學工程與材料工程學系 ] 期刊論文	2011	Abnormal Cu(3)Sn Growth and Kirkendall Formation Between Sn and (111) and (220) Preferred-Orientation Cu Substrates	Huang,TS; Tseng,HW; Hsiao,YH; Cheng,CH; Lu,CT; Liu,CY
[太空科學研究所 ] 期刊論文	2011	Abnormal infrasound signals before 92 M >= 7.0 worldwide earthquakes during 2002-2008	Xia,YQ; Liu,JYT; Cui,XY; Li,JZ; Chen,WS; Liu,CY
[化學工程與材料工程研究所] 期刊論文	2009	Ag Electromigration Against Electron Flow in Sn5Ag/Cu Solder Bump	Tseng,HW; Yeh,YT; Lin,KY; Liu,CY
[化學工程與材料工程研究所] 期刊論文	2004	An effective Cu-Sn barrier layer for Au bump used in optoelectronic devices	Liu,CY; Wang,SJ
[太空科學研究所 ] 期刊論文	2011	An integrated study of anomalies observed before four major earthquakes: 2004 Sumatra M9.3, 2006 Pingtung M7.0, 2007 Chuetsu Oki M6.8, and 2008 Wenchuan M8.0	Liu,CY; Liu,JY; Chen,WS; Li,JZ; Xia,YQ; Cui,XY
[化學工程與材料工程學系 ] 期刊論文	2011	A self-formed nanonetwork meshed Pt layer on an epitaxial GaN surface	Liu,CY; Chang,CC; Chen,YJ; Chen,PH
[化學學系] 期刊論文	2010	Asymmetric indolylmaleimides as non-dopant type red color emitting dyes	Lee,YS; Lin,ZH; Chen,YY; Liu,CY; Chow,TJ
[通訊工程研究所] 期刊論文	2009	Blind Beamforming Schemes in SC-FDMA Systems With Insufficient Cyclic Prefix and Carrier Frequency Offset	Liu,CY; Chen,YF; Li,CP
[化學學系] 期刊論文	2011	Bortezomib Sensitizes HCC Cells to CS-1008, an Antihuman Death Receptor 5 Antibody, through the Inhibition of CIP2A	Chen,KF; Yu,HC; Liu,CY; Chen,HJ; Chen,YC; Hou,DR; Chen,PJ; Cheng,AL
[化學學系] 期刊論文	2010	CIP2A mediates effects of bortezomib on phospho-Akt and apoptosis in hepatocellular carcinoma cells	Chen,KF; Liu,CY; Lin,YC; Yu,HC; Liu,TH; Hou,DR; Chen,PJ; Cheng,AL
[生物醫學工程研究所 ] 期刊論文	2010	Clinical result of sintered bovine hydroxyapatite bone substitute: analysis of the interface reaction between tissue and bone substitute	Tsai,WC; Liao,CJ; Wu,CT; Liu,CY; Lin,SC; Young,TH; Wu,SS; Liu,HC
[物理研究所] 期刊論文	1998	Clusters of ionization clumps in weakly ionized annular rf discharges	Liu,CY; I,L
[化學工程與材料工程研究所] 期刊論文	2004	Correlation between interfacial reactions and mechanical strengths of Sn(Cu)/Ni(P) solder bumps	Wang,SJ; Kao,HJ; Liu,CY
[化學工程與材料工程研究所] 期刊論文	2009	Cross-Interaction Between Au/Sn and Cu/Sn Interfacial Reactions	Yen,YW; Tseng,HW; Zeng,K; Wang,SJ; Liu,CY
[化學工程與材料工程研究所] 期刊論文	2009	Dewetting Retardation on Ag/Cu Coated Light Emitting Diode Lead Frames During the Solder Immersion Process	Huang,KC; Shieu,FS; Hsiao,YH; Liu,CY
[化學工程與材料工程研究所] 期刊論文	2006	Effect of Cu additives on Sn whisker formation of Sn(Cu) finishes	Kao,HJ; Wu,WC; Tsai,ST; Liu,CY
[化學工程與材料工程研究所] 期刊論文	2003	Effect of Cu content on interfacial reactions between Sn(Cu) alloys and Ni/Ti thin-film metallization	Hsu,SC; Wang,SJ; Liu,CY
[環境工程研究所 ] 期刊論文	2001	Effects of the type of sintering atmosphere on the chromium leachability of thermal-treated municipal solid waste incinerator fly ash	Wang,KS; Sun,CJ; Liu,CY
[化學工程與材料工程研究所] 期刊論文	2009	Electromigration-Induced Failure of Ni/Cu Bilayer Bond Pads Joined with Sn(Cu) Solders	Hsiao,YH; Tseng,HW; Liu,CY
[化學工程與材料工程學系 ] 期刊論文	2010	Electromigration-induced failures at Cu/Sn/Cu flip-chip joint interfaces	Tseng,HW; Lu,CT; Hsiao,YH; Liao,PL; Chuang,YC; Chung,TY; Liu,CY
[化學工程與材料工程研究所] 期刊論文	2007	Electromigration-induced Kirkendall voids at the Cu/Cu3Sn interface in flip-chip Cu/Sn/Cu joints	Liu,CY; Chen,JT; Chuang,YC; Ke,L; Wang,SJ
[材料科學與工程研究所 ] 期刊論文	2005	Electromigration studies of Sn(Cu) and Sn(Ni) alloy stripes	Wei,CC; Liu,CY
[化學工程與材料工程研究所] 期刊論文	2003	Electromigration studies on Sn(Cu) alloy lines	Lu,CC; Wang,SJ; Liu,CY
[電機工程學系] 期刊論文	2010	Extremely High Saturation Current-Bandwidth Product Performance of a Near-Ballistic Uni-Traveling-Carrier Photodiode With a Flip-Chip Bonding Structure	Shi,JW; Kuo,FM; Wu,CJ; Chang,CL; Liu,CY; Chen,CY; Chyi,JI
[光電科學與工程學系] 期刊論文	2005	Fabricating low-loss hollow optical waveguides via amorphous silicon bonding using dilute KOH solvent	Lo,SS; Chiu,HK; Chen,CC; Hsu,SC; Liu,CY
[化學工程與材料工程學系 ] 期刊論文	2010	Fabrication of High-Power InGaN-Based Light-Emitting Diode Chips on Pyramidally Patterned Sapphire Substrate	Chen,YJ; Kuo,CH; Tun,CJ; Hsu,SC; Cheng,YJ; Liu,CY
[化學工程與材料工程學系 ] 期刊論文	2010	Growth Mechanism of a Ternary (Cu,Ni)(6)Sn(5) Compound at the Sn(Cu)/Ni(P) Interface	Huang,TS; Tseng,HW; Lu,CT; Hsiao,YH; Chuang,YC; Liu,CY
[材料科學與工程研究所 ] 期刊論文	2005	High-thermal-stability and low-resistance p-GaN contact for thin-GaN light emitting diodes structure	Lin,CL; Wang,SJ; Liu,CY
[化學學系] 期刊論文	2011	Improved exchange reaction in an ionic liquid electrolyte of a quasi-solid-state dye-sensitized solar cell by using 15-crown-5-functionalized MWCNT	Huang,KC; Chang,YH; Chen,CY; Liu,CY; Lin,LY; Vittal,R; Wu,CG; Lin,KF; Ho,KC
[化學工程與材料工程學系 ] 期刊論文	2010	Light Output Enhancement of Near UV-LED by Using Ti-Doped ITO Transparent Conducting Layer	Lin,YH; Liu,YS; Liu,CY
[化學工程與材料工程研究所] 期刊論文	2005	Metallurgical reactions of Sn-3.5Ag solder with various thicknesses of electroplated Ni/Cu under bump metallization	Huang,CP; Chen,C; Liu,CY; Lin,SS; Chen,KH
[化學工程與材料工程研究所] 期刊論文	2003	Prevention of spalling by the self-formed reaction barrier layer on controlled collapse chip connections under bump metallization	Liu,CY; Wang,SJ
[化學工程與材料工程研究所] 期刊論文	2009	Reflectivity and Abnormal Absorption at ITO/Al Interface	Lin,YH; Liu,CY
[化學工程與材料工程學系 ] 期刊論文	2010	Retardation of electromigration-induced Ni(P) consumption by an electroless Pd insertion layer	Lu,CT; Tseng,HW; Chang,CH; Huang,TS; Liu,CY
[化學工程與材料工程研究所] 期刊論文	2003	Retarding growth of Ni3P crystalline layer in Ni(P) substrate by reacting with Cu-bearing Sn(Cu) solders	Wang,SJ; Liu,CY
[太空及遙測研究中心] 期刊論文	2009	Seismoionospheric GPS total electron content anomalies observed before the 12 May 2008 M(w)7.9 Wenchuan earthquake	Liu,JY; Chen,YI; Chen,CH; Liu,CY; Chen,CY; Nishihashi,M; Li,JZ; Xia,YQ; Oyama,KI; Hattori,K; Lin,CH
[化學工程與材料工程研究所] 期刊論文	2003	Study of interaction between Cu-Sn and Ni-Sn interfacial reactions by Ni-Sn3.5Ag-Cu sandwich structure	Wang,SJ; Liu,CY
[化學工程與材料工程學系 ] 期刊論文	2010	Study of Interfacial Reactions Between Sn(Cu) Solders and Ni-Co Alloy Layers	Huang,KC; Shieu,FS; Huang,TS; Lu,CT; Chen,CW; Tseng,HW; Cheng,SL; Liu,CY
[化學工程與材料工程研究所] 期刊論文	2009	Surface oxidation of molten Sn(Ag, Ni, In, Cu) alloys	Lee,YY; Tseng,HW; Hsiao,YH; Liu,CY
[電機工程研究所] 期刊論文	1996	Variable structure controller design for robust tracking and model following	Shyu,KK; Liu,CY
[化學工程與材料工程學系 ] 期刊論文	2010	Variation of Mechanical Property and Microstructure across Sn Solder Joint in Cu/Sn/Ni Structure	Liu,CY; Tseng,HW; Song,JM

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