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    Please use this identifier to cite or link to this item: http://ir.lib.ncu.edu.tw/handle/987654321/1682

    Title: LTCC 陶瓷基板雷射切割研究
    Authors: 許世宗;SHIH-TSUNG HSU
    Contributors: 光機電工程研究所
    Keywords: 陶瓷基板;雷射切割;ceramic substrate;Laser cutting
    Date: 2008-07-17
    Issue Date: 2009-09-21 09:57:37 (UTC+8)
    Publisher: 國立中央大學圖書館
    Abstract: 本研究主要使用CO2 雷射與運用控制破裂切割原理在陶瓷基板 切割。並使用所建立的雷射切割平台,來驗證破裂控制切割原理與 實際應用在LED 低溫共燒陶瓷基板上。 Localized heating by CO2 laser followed by water quenching was applied to control fracture growth for cutting ceramic substrate. The process was successfully demonstrated on breaking LED LTCC ceramic substrate with a laser cutting platform
    Appears in Collections:[光機電工程研究所 ] 博碩士論文

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