本論文提供一種即時影像導引的微電鍍系統，有別於以往的間 歇式電鍍，使用CCD擷取影像並判斷微陽極和陰極的間距，固定此 間距，進而改善所沉積的微銅柱之結構性質及表面外觀。 以往使用間歇式的方式，在電鍍的過程中，因為兩極間的電流 會隨著間距的改變而產生變化，因此容易導致銅微柱沉積的結構性 質不均以及外觀的凹凸不平 。 連續式電鍍是利用影像處理的方式，透過CCD及馬達控制使兩 極間間距在電鍍過程中保持不變，固定兩極間距，使得兩極間電場 變動不大，沉積可較為均勻，且析鍍速率一定，可使沉積的微銅柱 整體結構性質相同及外觀平滑。 本論文除了使用影像辨識與馬達控制方法於微電鍍上，結合統 計學中的Entropy和Energy的值來判斷氣泡的多少，並探討最適合鍍 液的光源及光源方向，用以改善影像放大後光源不足而難以處理的 問題。完成自動辨識兩極間距並配合微步進馬達在電鍍過程中保持 兩極間間距固定，達成連續電鍍的目的，實驗的結果也顯示相對於 以往間歇式電鍍在結構性質及外觀皆有明顯的進步。 The thesis has designed a real time image guide continuity mode of electroplating system, different with the intermittent mode of electroplating. We use CCD to obtain image, and judge the distance between micro-anode and the copper columns by image process, keep this distance be a constant during the electroplating, finally improve the structure character and surface appearance. In the intermittent mode of electroplating process, the current between two poles will change by their distance. It's easily to make the structure character of micro-scale copper columns not uniform, and the surface will not smooth. Continuity mode of electroplating using the image process way, by magnifier to control the gap, keep the gap inner a range made the electric field will not change, the deposition will be more uniform, and the rate of growth be a constant were help for getting uniform structure character and smooth surface. The thesis except using the image process and motor control on electroplating, also combine the Entropy and Energy were two of the statistics way to verify the result of judge the bubble at the image. And discuss the most suitable color and the incidence direction with the light source, to improve the reduce intensity of light when enlarge the image. Complete the automatic judge the gap between two poles, and keep the gap during the electroplating with micro-stepping motor, reach the gold of continuity mode of electroplating. The result of experiment will show the improved of the structure character and surface opposite the intermittent mode of electroplating.