本研究成功地利用液態電遷移之方式製備出Mg2Ni化合物。將電流通過鎳/熔融鎂/鎳三明治結構，在熔融鎂中之鎳原子會受電遷移之效應被推向陽極界面且在熔融鎂/鎳界面生成厚的Mg2Ni化合物，而通電流之化合物厚度遠大於無電流之情形，這暗示電流可以增加界面化合物的生長。另外，從XRD分析，繞射圖中僅有（110）繞射峰，此顯示電遷移成長出之Mg2Ni化合物為單晶或有一優選方向之結構。由此觀察而知，在陽極界面生成之Mg2Ni化合物與電流方向有密切相關性。 In this study, we have successfully produced Mg2Ni compound phase by using liquid-electromigration method. By applying a current flow through Ni/molten Mg/Ni sandwich structure, the Ni atoms in the molten Mg were electromigrated toward the anode interface and formed a thick layer of Mg2Ni compound at the anode molten Mg/Ni interface. The formation of the interfacial Mg2Ni compound is much larger than that in the no-current case. It implies that the growth of the interfacial Mg2Ni compound can be enhanced by the current-stressing. Remarkably, from XRD analysis, EM-grown Mg2Ni phase show a single crystal nature, only one single peak ((110) plane) appears in the XRD diffraction pattern. This observation suggests that the formation of EM-grown Mg2Ni compound at the anode interface highly corresponds to the direction of the electron flow.