English  |  正體中文  |  简体中文  |  全文筆數/總筆數 : 80990/80990 (100%)
造訪人次 : 41078249      線上人數 : 838
RC Version 7.0 © Powered By DSPACE, MIT. Enhanced by NTU Library IR team.
搜尋範圍 查詢小技巧:
  • 您可在西文檢索詞彙前後加上"雙引號",以獲取較精準的檢索結果
  • 若欲以作者姓名搜尋,建議至進階搜尋限定作者欄位,可獲得較完整資料
  • 進階搜尋


    請使用永久網址來引用或連結此文件: http://ir.lib.ncu.edu.tw/handle/987654321/1929


    題名: 利用網絡模型數值模擬粉末射出成形製程毛細吸附脫脂機制
    作者: 陳釧鋒;Shu-Fong Chen
    貢獻者: 機械工程研究所
    關鍵詞: 粉末射出成形;毛細吸附脫脂;有限體積法;有限擴散聚集;蒙地卡羅法;Powder injection molding;wick debinding;finite-volume scheme;diffusion-limited-aggregation(DLA);Monte Carlo method
    日期: 2000-06-27
    上傳時間: 2009-09-21 11:34:35 (UTC+8)
    出版者: 國立中央大學圖書館
    摘要: 粉末射出成形最耗時的製程是將黏結劑從成形後的金屬或是陶瓷胚體內部移除。不僅許多缺陷容易在此製程產生,而且對此製程的認識甚少。為了縮短脫脂時間,可以利用吸附材粉末的毛細吸附作用來移除黏結劑。 本文利用二維的網絡模型,結合有限體積法和蒙地卡羅法數值模擬毛細吸附脫脂機制。數值模擬結果顯示:毛細吸附脫脂的時間與胚體的粉末粒徑成反比,與吸附材的粉末粒徑成正比。此外,胚體的脫脂比例與脫脂時間兩者成二次式關係。我們建議採用較大粒徑比值的胚體與吸附體粉末組合,可有效地縮短毛細吸附脫脂的時間。 The removal of the binder from the shaped metal or ceramic powder compact is the most consuming step in the powder injection molding (PIM). It is the source of many defects and is the manufacturing step that is least known. In order to reduce the duration of debinding, capillary extraction of the binder by wick powder may be employed. This study utilizes a two-dimensional network model to investigate the mechanism of wick debinding by the numerical simulation with a technique combining finite-volume and Monte Carlo methods. The results show that wick-debinding time is proportional to the wick powder diameter and inversely proportional to the compact powder diameter. As well as the fractional debinding rate versus wick-debinding time is squared. In order to shorten the wick-debinding time effectively, we suggest that a larger particle size ratio between compact and wick may be employed.
    顯示於類別:[機械工程研究所] 博碩士論文

    文件中的檔案:

    檔案 大小格式瀏覽次數


    在NCUIR中所有的資料項目都受到原著作權保護.

    社群 sharing

    ::: Copyright National Central University. | 國立中央大學圖書館版權所有 | 收藏本站 | 設為首頁 | 最佳瀏覽畫面: 1024*768 | 建站日期:8-24-2009 :::
    DSpace Software Copyright © 2002-2004  MIT &  Hewlett-Packard  /   Enhanced by   NTU Library IR team Copyright ©   - 隱私權政策聲明