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    Please use this identifier to cite or link to this item: http://ir.lib.ncu.edu.tw/handle/987654321/2365


    Title: TFT-LCD螢幕掉落破壞分析驗證與包裝系統設計;Simulation and Validation of Drop Failure and Package System for TFT-LCD Monitors
    Authors: 石宗甫;Zong-Fu Shi
    Contributors: 機械工程研究所
    Keywords: 掉落測試;破壞邊界曲線;衝擊測試;damage boundary curve;drop test;shock test
    Date: 2004-09-22
    Issue Date: 2009-09-21 11:44:54 (UTC+8)
    Publisher: 國立中央大學圖書館
    Abstract: 摘要 TFT-LCD monitor 是具有高精度、高單價之產品,而產品在物流運送過程中經常會遭受到振動、衝擊、掉落等機械力的作用,進而使產品造成破壞,所以產品在物流過程中必須包覆緩衝包裝材料加以保護。本研究延續實驗室所進行產品掉落測試,執行包裝系統的設計和修改,進而滿足規範的要求,而且能減少產品空間和包裝材料的使用,達到降低成本的目的。 本研究主要分成產品特性測試和包裝設計測試兩部分,依循先前已知monitor的face_6無法通過IEC法規的規定,故對於face_6進行包裝系統的改善;首先量測產品的容許速度變化與容許加速度,了解其破壞範圍。並利用LS-DYNA進行模擬,分析其破壞的原因。而在包裝設計階段,利用容許速度變化判斷產品是否需要包裝;在這前提下利用容許加速度值設計包裝系統的規格,前期設計的四個包裝系統先進行掉落測試的模擬,判斷是否滿足容許加速度,而滿足的包裝系統B、C、D在進行實際掉落測試;其中包裝系統D滿足IEC規範的掉落測試,在比較模擬的結果也發現只有包裝系統D沒有破壞的情形產生,所以包裝系統D滿足IEC規範。 本文提供包裝設計的方法,輔以LS-DYNA有限元素軟體進行產品破壞原因的分析與包裝系統掉落測試的模擬,可對產品的破壞進行設計的修正及改善,然後再進行包裝設計模擬,以減少開發設計的時間及成本,提昇產品的競爭力。 TFT-LCD monitors are manufactured precisely and so far relatively expensive. During transportation, the products are often subjected to unintentional drops, vehicle vibration, shock inputs, and compression loads, etc. These mechanical forces may cause products damages or losing functions. To prevent shock damages, products are usually protected by package systems. The study based on previous work performs the package-system design and modification. The proposed new package system is satisfied for the IEC regulations. Furthermore, the amount of material used by the package system is less than that of original design. The study includes both the characterizing the damage boundary curve and modifying the package system of the test TFT-LCD monitor. Based on previous work, it is noted that the face_6 drop test cannot fulfill the IEC regulations. Therefore, the package system of the TFT-LCD monitor needs further modification. First, the shock characteristics of the product are determined by conducting the damage boundary test. It includes both critical velocity change and critical acceleration. Moreover, the causes of damage are also numerically analyzed by using the LS-DYNA package. The simulations of drop test for modified package systems are performed. Then, The numerical analysis is validated by practical drop test. After comparison between the drop test and numerical simulation, the package system satisfying the IEC regulations can be achieved. In the study, the procedures about designing a cushioning package system are provided. The finite element analysis assists in exploring the causes of the damage. The numerical analysis is validated by practical drop test. These tasks help to perform the design or modification of both the TFT-LCD monitor and package system. They can shorten the lead-time of product design, and improve shock resistance as well.
    Appears in Collections:[機械工程研究所] 博碩士論文

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