以微陽極導引電鍍法製作鎳銅合金微柱; Fabrication of micrometer columns by micro-anode guided eletroplating

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Please use this identifier to cite or link to this item: http://ir.lib.ncu.edu.tw/handle/987654321/2540

Title:	以微陽極導引電鍍法製作鎳銅合金微柱;Fabrication of micrometer columns by micro-anode guided eletroplating
Authors:	鄭家宏;Jia-Hong Jeng
Contributors:	機械工程研究所
Keywords:	鎳銅合金微柱;合金電鍍;微陽極導引電鍍;micro Ni-Cu column;micro anode guided electroplating;alloy electroplating
Date:	2005-06-07
Issue Date:	2009-09-21 11:49:49 (UTC+8)
Publisher:	國立中央大學圖書館
Abstract:	摘要本研究以微陽極導引電鍍法(Micro anode guided electroplating,MAGE)製作鎳銅合金微柱，討論在(1.硫酸鹽。2.檸檬酸鹽)兩種溶液中製作微鎳銅合金微柱之可行性。實驗中改變兩極偏壓及鍍浴中硫酸銅莫耳濃度探討其對鎳銅合金微柱中鎳/銅比例與微柱形貌影響。檸檬酸鹽鍍浴中，偏壓4.2V，兩極間距為10μm，所得微柱均為鎳銅合金成分。改變溶液中的硫酸銅莫耳濃度對合金微柱之形貌影響甚鉅，硫酸銅添加4mM時所製得合金微柱表面平滑且表面顆粒粗細均勻；若添硫酸銅加超過8mM，微柱表面開始不平整且有不均勻顆粒狀析出物。檸檬酸鹽鍍浴中，硫酸銅濃度維持在4mM，兩極間距固定為10μm、兩極偏壓逐漸由3.8V、4.0V、4.2V增加至4.4V，微柱中合金成份鎳/銅比例分別由 75/25、80/20、83/17增加至87/23；固定偏壓在3.8V時，微柱中和金成份鎳/銅之比例卻隨著鍍液中，硫酸銅濃度由4mM、8mM增加至12mM，由75/25、59/41降低至49/51，結果顯示：鎳銅合金微柱中鎳/銅比例隨著偏壓增加而變大；卻隨著硫酸銅濃度增加而變小。鎳銅合金微柱應可應用在溫度測量，其誤差值最小為0.7℃。 Abstract Micro-column with the composition of nickel-copper alloy was fabricated by micro anode guided electroplating (MAGE) method. There are two solutions were used (sulfate and citrate solution) for discussing the practicability of fabricating the micrometer Ni-Cu alloy column. In experiment, we change the bias between anode and cathode, the concentration of copper sulfate in solution, in order to discussing the variation of the proportion of nickel to copper and the surface morphology of micro Ni-Cu alloy column by SEM. In the citrate solution, we can fabricate a uniform micro Ni-Cu alloy column at the applied voltage was 4.2V and the gap between anode with cathode is 10μm. Changing the concentration of copper sulfate in solution is the most effect of the surface morphology and the structure of the micro-alloy column. As the concentration of copper sulfate in solution is 4mM, the surface morphology of micro Ni-Cu alloy column is more smoothly and the structure is more solidly. When the concentration of copper sulfate is increasing to 8mM, the deposits on the column surface is becoming to roughly deposit and the diameter of column uniformly. The proportion of nickel to copper is increasing from 75/25、80/20、83/17 to 87/23 with the in creasing of the applied voltage between the anode and cathode, but the proportion of nickel to copper is decreasing from 75/25、59/41 to 49/51 with the increasing of the concentration of copper sulfate in bath. We did fabricated the micro Ni-Cu alloy column and successfully make use of measuring temperature.
Appears in Collections:	[Graduate Institute of Mechanical Engineering] Electronic Thesis & Dissertation

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