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    Title: 多層薄膜干涉濾光片製鍍在軟性基板的研究---子計畫三:薄膜製鍍與基板表面之改質;Surface Refinement of Substrates for the Deposition of Optical Thin Films
    Authors: 李正中
    Contributors: 光電科學與工程學系
    Keywords: 光學薄膜;軟性基板;薄膜附著性;表面處理;電漿處理;Optical thin films;Flexible substrate;Surface treatment;Plasmatreatment;光電工程
    Date: 2010-07-01
    Issue Date: 2010-06-21 11:53:29 (UTC+8)
    Publisher: 行政院國家科學委員會
    Abstract: 本研究計畫目的為研究軟性材質之塑膠基板與製鍍多層薄膜之間的附著性問題。在開發軟性基板的鍍膜技術時,所遭遇到最重要的問題之ㄧ是薄膜材料與塑膠基板間的附著性不佳。為了克服此問題,我們需要將基板做表面處理以增加附著力,並瞭解處理後基板表面之光學特性。因電漿處理法與短波光源處理法比較沒有污染環境之顧慮,且處理面積也較大,所以本研究以電漿表面處理法與短波光源處理法作為主要的研究方向。塑膠基板經由電漿表面處理或短波光源處理後,基板表面將會變粗糙,且某些化學鍵結比例亦會改變。且經由表面處理後的基板,鍍上單層膜或多層膜之後,會因為基板與薄膜材料間中間層(interface layer)的產生而造成與原先鍍膜前的設計不同,光學成效因此而變。所以本研究將分為兩部分:第一部分主要先以射頻電漿源或短波光源對塑膠基板表面處理後,量測基板的穿透率變化與表面粗糙度變化以及表面接觸角;第二部分則以表面處理過的基板鍍上單層膜,再去量測鍍膜後的應力、穿透率以模擬中間層的現象和吸收情形、以及基板與薄膜附著之程度。電漿表面處理的方法是以不同的氣體產生高低不同功率的電漿對基板進行表面處理。初步著重於基板經由電漿處理後的變化,分別從基板表面接觸角、基板穿透率變化、基板表面粗糙度變化探討之。其中基板表面接觸角可利用接觸角量測儀量測;基板穿透率變化以可見光-近紅外光光譜儀量測;表面粗糙度則以原子力顯微鏡﹙AFM﹚配合電子顯微鏡(SEM)量測之。基板經由電漿表面處理後,我們將鍍膜於基板,並以光譜儀測量吸收情形;以傅氏轉換紅外線光譜儀﹙FTIR﹚量測基板在紅外線的吸收,由吸收譜線可知鍵結強度的改變;請子計畫1 及2 量測應力,以變化電漿及鍍膜參數使應力盡量降低。附著力則依照ASTM﹙American Society for Testing and Materials﹚所訂出的D3359 標準測試方式,以百格刀於膜面劃出一百格後,以膠帶黏貼後快速撕開,觀察膜面脫落的百分比。殘餘膜面積小於60%定為0B,完全沒有薄膜脫落則訂為5B。介於此兩者之間則分別以1B~4B 訂定之。以上的研究方法可以獲得附著性良好的電漿處理參數,並可修正因為電漿處理所造成的光學方面的缺失,以達到塑膠基板上鍍出一個兼具附著與抗反射效果的光學薄膜。結果將交由子計畫4 參考以完成各種濾光片在軟性基板的製鍍。The improvement of adhesion of coating of optical thin films on flexible substrates was proposed in this project. In general the bonding between the film and plastic substrate is physical bonding and very weak. To increase the adhesion, the surface of the substrate shall be treated to be chemically active so that there is strong chemical bonding between depositing films and substrate. Plasma treatment or short wavelength irradiation on the plastic surface just before the deposition will be applied. After the surface treatment, surface contact angle, transmittance of the substrate and surface roughness will be investigated by using contact angle instrument, spectrophotometer, atomic force microscope, AFM and scanning electron microscope, SEM, respectively. Several metallic films and dielectric films will be coated on the treated substrate for tress and adhesion test. The stress test will be done by subproject 1 and subproject 2. The adhesion will be tested according to the procedure D3359 of ASTM(American Society for Testing and Materials). FTIR spectrophotometer will be used to investigate the chemical bonds of the interface layer between the substrate. To make sure the absorption will not too large, loss in transmission will also be investigated by using a spectrometer. All the results will be the reference of subproject 4 for multilayer coatings. 研究期間 : 9808 ~ 9907
    Relation: 財團法人國家實驗研究院科技政策研究與資訊中心
    Appears in Collections:[Department of Optics and Photonics] Research Project

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