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    题名: Cross-Interaction Between Au/Sn and Cu/Sn Interfacial Reactions
    作者: Yen,YW;Tseng,HW;Zeng,K;Wang,SJ;Liu,CY
    贡献者: 化學工程與材料工程學系
    关键词: LEAD-FREE SOLDER;CU-SN;AU;TERNARY;BUMP;SYSTEMS;COUPLES;JOINTS
    日期: 2009
    上传时间: 2010-06-29 17:26:36 (UTC+8)
    出版者: 中央大學
    摘要: The cross-interaction between Sn/Cu and Sn/Au interfacial reactions in an Au/Sn/Cu sandwich structure was studied. Field-emission electron probe microanalysis (FE-EPMA) revealed that the Cu content in the three Au-Sn phases (AuSn, AuSn2, and AuSn4) was very low, less than 1 at.%. This meansa that pound Cu from the opposite Cu foil did not participate in the interfacial reaction at the Sn/Au interface. On the opposite Sn/Cu side, Au-substituted (Cu,Au)(6)Sn-5 formed within the initial 1 min of reflow. With prolonged reflow, the Au content in the Au-substituted (Cu,Au)(6)Sn-5 increased and it transformed into a Cu-substituted (Au,Cu)Sn phase with 25 at.% Cu after 1 min of reflow at 250A degrees C. The x-ray diffraction (XRD) pattern confirmed the phase transformation of Au-substituted (Cu,Au)(6)Sn-5 to Cu-substituted (Au,Cu)Sn phase. In addition, there was greater Au consumption in the Au/Sn/Cu sandwich joint structure than in the single Au/Sn reaction case, due to some of the Au participating in the opposite Sn/Cu interfacial reaction.
    關聯: JOURNAL OF ELECTRONIC MATERIALS
    显示于类别:[化學工程與材料工程研究所] 期刊論文

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