中大機構典藏-NCU Institutional Repository-提供博碩士論文、考古題、期刊論文、研究計畫等下載:Item 987654321/26375
English  |  正體中文  |  简体中文  |  全文笔数/总笔数 : 66984/66984 (100%)
造访人次 : 22909588      在线人数 : 249
RC Version 7.0 © Powered By DSPACE, MIT. Enhanced by NTU Library IR team.
搜寻范围 查询小技巧:
  • 您可在西文检索词汇前后加上"双引号",以获取较精准的检索结果
  • 若欲以作者姓名搜寻,建议至进阶搜寻限定作者字段,可获得较完整数据
  • 进阶搜寻


    jsp.display-item.identifier=請使用永久網址來引用或連結此文件: http://ir.lib.ncu.edu.tw/handle/987654321/26375


    题名: Dewetting Retardation on Ag/Cu Coated Light Emitting Diode Lead Frames During the Solder Immersion Process
    作者: Huang,KC;Shieu,FS;Hsiao,YH;Liu,CY
    贡献者: 化學工程與材料工程學系
    关键词: SURFACE FINISH;JOINTS;METALLURGY;RELIABILITY;CU6SN5;NI;SN
    日期: 2009
    上传时间: 2010-06-29 17:26:38 (UTC+8)
    出版者: 中央大學
    摘要: The process of SnPb immersion in Ag/Cu coated light emitting diode lead frames (LED LFs) (alloy 42) was investigated. SnPb solder was found to cause dewetting of the LF substrate after 6 s of immersion. We believed that the dewetting of the SnPb solder could be attributed to spalling of the interfacial compound grains. The addition of a small amount of Ni to the molten SnPb solder (0.1 wt.%) retarded that spalling and helped to prevent dewetting. The mechanisms for spalling retardation by the addition of Ni additives are as follows: (1) the Ni additives slow down the reaction rate between the molten SnPb solder and the Ag/Cu plating layer; (2) the Ni additives participate in interfacial reactions to form (Cu,Ni)(6)Sn-5 ternary compounds, which are more stable than binary compounds and have a slower ripening process.
    關聯: JOURNAL OF ELECTRONIC MATERIALS
    显示于类别:[化學工程與材料工程研究所] 期刊論文

    文件中的档案:

    档案 描述 大小格式浏览次数
    index.html0KbHTML561检视/开启


    在NCUIR中所有的数据项都受到原著作权保护.

    社群 sharing

    ::: Copyright National Central University. | 國立中央大學圖書館版權所有 | 收藏本站 | 設為首頁 | 最佳瀏覽畫面: 1024*768 | 建站日期:8-24-2009 :::
    DSpace Software Copyright © 2002-2004  MIT &  Hewlett-Packard  /   Enhanced by   NTU Library IR team Copyright ©   - 回馈  - 隱私權政策聲明