隨著科技不斷進步，半導體工業發展也由早期的5吋、6吋晶圓為主，演進到目前以12吋晶圓為主流。本實驗以12吋晶圓為主，利用不同的塗佈方式與轉速之應用，同時考慮預塗及雙層塗佈對膜厚之相對應關係，探討如何以最少的塗佈液、最短的塗佈時間、較低的塗佈轉速，在12吋晶圓上塗佈一層膜厚均勻之塗佈層。實驗結果發現，以1000cP之矽油為預塗層時，其膜厚與轉速及塗佈時間呈現一線性之分佈圖，而進行第二層塗佈時膜厚與轉速線性分佈現象只介於轉速為1100rpm至1300rpm之間。而以相同黏滯係數之矽油所塗佈之不同預塗層厚度，對最終液膜厚度並無影響。另外分別以不同黏滯係數100cP及1000cP之矽油為預塗層時，雖然預塗層厚度相同，但在第二層塗佈條件相同下，最終塗佈液膜厚度也不會一樣。因此本實驗以1000cP矽油搭配單層及雙層塗佈方法，在塗佈轉速2000rpm以下，控制塗佈時間及矽油用量，即可在12吋晶圓上塗佈一層厚度介於30~100μm之間且均勻度高於97%之液膜，達到本實驗所期望之大尺寸晶圓塗佈膜厚。 With science and technology being constantly progressive, semiconductor industry it develops to be the main fact by early 5、 6 inch wafer, gradual progress has become the mainstream by 12 inch wafer up till now. This experiment base on 12 inch wafer with different coating method and spin speed applying, consider the film thickness relation of first and second layer coating at the same time. Discussion how to use the least liquid、shortest coating time、lower spin speed in 12 inch wafer with thick and even coating. The experimental result is found when use 1000cP silicon oil as first layer coating, the film thickness present as a linear distribution map, same phenomenon is only between 1100rpm to 1300rpm while carrying on the second layer coating. Different first layer film thickness with the same viscosity of silicon oil has not influenced to the final thickness. While regarding different viscosity 100cP and 1000cP of silicon oil as first layer coating, though the thickness is the same, but under the same condition of second layer coating the final film thickness can not be the same either. This experiment match single and double layer coating method with the silicon oil of 1000cP、under spin speed 2000rpm、control spin time and oil of silicon , can coating one thick film while between 30 to 100μm and uniformity degree higher than 97% of liquid film in 12 inch wafer. It is thick coating on 12 inch wafer which experiment expects.
