In Situ Measurements of Thermal and Electrical Effects of Strain in Flip-Chip Silicon Dies Using Synchrotron Radiation X-rays (vol 38, pg 2308, 2009)

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Title:	In Situ Measurements of Thermal and Electrical Effects of Strain in Flip-Chip Silicon Dies Using Synchrotron Radiation X-rays (vol 38, pg 2308, 2009)
Authors:	Wu,AT;Tsai,CY;Kao,CL;Shih,MK;Lai,YS;Lee,HY;Ku,CS
Contributors:	化學工程與材料工程學系
Keywords:	N/A
Date:	2009
Issue Date:	2010-06-29 17:27:14 (UTC+8)
Publisher:	中央大學
Abstract:	N/A
Relation:	JOURNAL OF ELECTRONIC MATERIALS
Appears in Collections:	[National Central University Department of Chemical & Materials Engineering] journal & Dissertation

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