產品在運輸、搬運或使用過程中會承受到各種形式的衝擊，隨著電子類產品輕薄化的趨勢，衝擊試驗對電子類產品產生的影響亦隨之增加，通常廠商會於產品開發階段進行衝擊測試以驗證產品強度，確保產品出貨至客戶端甚至是使用者實際使用時不致損壞。本研究即是以TFT-LCD模組為研究對象，針對TFT-LCD模組於衝擊試驗時經常發生的前框卡勾跳脫問題進行分析與探討，研究中以有限元素法進行數值模擬，並與實驗數據進行比對，獲得有效之分析模型，依此建立完整的衝擊試驗數值模擬及分析模式。 研究中採用兩種方式進行，即衝擊試驗驗証與有限元素模擬分析，透過相互印証，探討TFT-LCD模組受衝擊時之動態行為，對前框卡勾設計提出適切改善。研究中使用有限元素軟體MSC-Dytran對TFT-LCD模組進行衝擊模擬分析，預測TFT-LCD模組衝擊時整體的力學行為，並與實驗結果比較進行分析模型修正，以驗證有限元素模型之正確性。在有限元素模型經合理性驗證後，對TFT-LCD模組前框卡勾進行設計改善，透過材料厚度變更及增加補強肋設計的改善提案，解決此卡勾跳脫的問題，並依此建立TFT-LCD模組前框卡勾設計的分析評估方式。 以本文所採用之分析評估模式，可有效預測產品於衝擊試驗中之衝擊行為，幫助設計者於開發初期預估產品強度、發掘並改善問題，以縮短設計開發時程及降低成本，進而提高產業競爭力。 Products are subjected to different kinds of impact during transportation, shipping and operation. With the trends of electronic products turning diminutive, the raise of impact test to the electronic products has also being raised. It is now, considered a norm that manufacturers will conduct the impact test during the period of manufacturing and developing in order to insure that goods will be delivered to the various vendors or the final end-users in a excellent condition for usage. This empirical research took TFT-LCD modules as subjects, paying particular attention in analyzing and discussing the issue of bezel “snapping”, a problem which frequently occur during the module under impact test. The research was conducted with the finite element analysis model for examination and then compared to the experimental results in order to obtain effective analysis. Thus, we could establish completely impact test value simulation and analysis pattern. This study carried on two experimental methods — the impact test for examination and the finite element analysis model. Through the finite element analysis and experiment for truth examination of TFT-LCD module during impact test, we proposed the adequate design improvement for bezel design. In experiment, the simulation of impact test on the TFT-LCD module was analyzed by MSC-Dytran finite element software which could predict the whole dynamic action of TFT-LCD module during impact test and compared to the experimental results to modify the analysis model and examined the accuracy of the finite element analysis model. After the finite element model was verified effectively, we did improve the design on the bezel snap of the TFT-LCD module by changed the item thickness and increased the rib design methods to solve the “snapping” problem. And we established the analysis evaluation methods of the design on the bezel snap of the TFT-LCD module. The analyzed evaluated model adopted in this study can severely predict the impact response of products during impact test. Thus it can help designers develop and pre-estimate the product strength and also improve to solve the problems with the purpose to shorten design duration and reduce cost and exalt the industry competence.
