English  |  正體中文  |  简体中文  |  Items with full text/Total items : 66984/66984 (100%)
Visitors : 23164836      Online Users : 463
RC Version 7.0 © Powered By DSPACE, MIT. Enhanced by NTU Library IR team.
Scope Tips:
  • please add "double quotation mark" for query phrases to get precise results
  • please goto advance search for comprehansive author search
  • Adv. Search
    HomeLoginUploadHelpAboutAdminister Goto mobile version


    Please use this identifier to cite or link to this item: http://ir.lib.ncu.edu.tw/handle/987654321/26446


    Title: The Effects of Solid-State Aging on the Intermetallic Compounds of Sn-Ag-Bi-In Solders on Cu Substrates
    Authors: Wu,AT;Chen,MH;Siao,CN
    Contributors: 化學工程與材料工程學系
    Keywords: INTERFACIAL REACTIONS;JOINT RELIABILITY;LAYER FORMATION;SHEAR-STRENGTH;METALLIZATION;LIQUID;BALL
    Date: 2009
    Issue Date: 2010-06-29 17:28:15 (UTC+8)
    Publisher: 中央大學
    Abstract: The growth behavior of the intermetallic compounds that formed at the interfaces between Sn-Ag-Bi-In solders and Cu substrates during solid-state aging is investigated. The compositions of the intermetallic compounds are Cu-3(Sn,In) near the Cu substrates and Cu-6(Sn,In)(5) near the solders; very little Bi or Ag was dissolved in the compounds. The aging temperatures were 120A degrees C, 150A degrees C, and 180A degrees C for 5 days, 10 days, 20 days, and 40 days. The change in the morphology of Cu-6(Sn,In)(5) from scallop type to layer type was prominent at the aging temperature of 180A degrees C. The thickness of the compound layers did not vary much at the lower aging temperatures but followed the diffusion- controlled mechanism at 180A degrees C. Massive Kirkendall voids were observed in Cu-3(Sn,In) layers at the aging temperature of 180A degrees C.
    Relation: JOURNAL OF ELECTRONIC MATERIALS
    Appears in Collections:[化學工程與材料工程研究所] 期刊論文

    Files in This Item:

    File Description SizeFormat
    index.html0KbHTML472View/Open


    All items in NCUIR are protected by copyright, with all rights reserved.

    社群 sharing

    ::: Copyright National Central University. | 國立中央大學圖書館版權所有 | 收藏本站 | 設為首頁 | 最佳瀏覽畫面: 1024*768 | 建站日期:8-24-2009 :::
    DSpace Software Copyright © 2002-2004  MIT &  Hewlett-Packard  /   Enhanced by   NTU Library IR team Copyright ©   - Feedback  - 隱私權政策聲明