TFT-LCD 導光板衝擊模擬分析及驗證研究

NCU Institutional Repository > 工學院 > 機械工程學系碩士在職專班 > 博碩士論文 > Item 987654321/2652

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题名:	TFT-LCD 導光板衝擊模擬分析及驗證研究
作者:	王玉仙;Yu-hsien Wang
贡献者:	機械工程研究所碩士在職專班
关键词:	衝擊;液晶面板;Shock;TFT-LCD
日期:	2007-07-06
上传时间:	2009-09-21 11:52:58 (UTC+8)
出版者:	國立中央大學圖書館
摘要:	本研究對TFT-LCD (Thin film transistor liquid crystal display)之導光板(Light guide plate)進行衝擊分析及試驗驗証，由於衝擊時間短暫，要去了解其受衝擊時反應相當不易，研究中採用兩種方式—衝擊試驗驗証與有限元素模擬分析，探討TFT-LCD模組受衝擊時之動態行為，藉由數值模擬與實驗兩者相互印証，以對結構設計提出適切改善。為了TFT-LCD模組設計能達到在模具開發製作前就加以評估的目的，研究中使用有限元素軟體MSC-Dytran對TFT-LCD模組進行衝擊模擬，預測TFT-LCD模組衝擊時整體的力學行為，並與實驗結果比較，進行分析模型修正；隨後對TFT-LCD模組進行設計改善，建立TFT-LCD模組設計的分析評估方式。衝擊試驗是了解產品能承受多大衝擊的指標，能承受的衝擊值愈大，產品的可靠度愈高，本研究中對產品進行Y方向衝擊，探討所造成的衝擊響應，藉由衝擊試驗找出產品結構上的弱點進行改善，進而提高產品的可靠度。試驗結果不僅可以了解TFT-LCD模組可能發生的變形，並能驗證有限元素分析模式的合理性。由TFT-LCD模組有限元素分析過程中，發現LGP 固定處受衝擊時有高應力區現象，和衝擊試驗結果發生脆裂的地方吻合，進而以有限元素分析對此作設計改善，其改善方式為結合背板(Back cover)上之銅柱，多增加一處卡榫，經過模擬分析與衝擊試驗比對後，證實對策有效且可消除原先高應力區現象。本文以試驗及模擬，建立了TFT-LCD模組設計的評估方式，應用實驗與數值模擬方法，可以有效地進行TFT-LCD模組設計，有助於開發初期設計驗證預估，縮短開發時程，快速導入量產，提高產品在業界的競爭力。 This research is centered on the impact test analysis and test examination for the light guide plate of the TFT-LCD(Thin film transistor liquid crystal display)module. Due to extremely short duration of impact test, it is quite difficult to realize the impact response. This research is adopted with two methods — the impact test for examination and the finite element analysis model. Through the finite element analysis and experiment for truth examination of TFT-LCD module during impact test, we propose the adequate design improvement for the structure design. In the purpose of the evaluation of TFT-LCD module design before the developing mold period, the simulation of impact test on the TFT-LCD module is analyzed by MSC-Dytran finite element software which can predict the whole dynamic action of TFT-LCD module during impact test and compare to the experimental results to modify the analysis model. Thus, we can improve the design on TFT-LCD module and establish the analysis evaluation method of the TFT-LCD module design. The impact test is aimed to understand the maximum indicating value of impact resistance for products. The large value means that products come with higher reliability. In this research, we conducted Y direction impact onto products to investigate the impact response. Through impact test, we could figure out the structure weakness of products and also increased the product reliability. The test results not only reveal the possible deformation of the TFT-LCD module but also examine the reasonability for the finite element analysis model. Under the process of the finite element analysis of the TFT-LCD module, we found that Light guide plate linkage parts would be affected by impacted and showed high stress area phenomenon which match the crack parts happening to the impact test. Thus, we proposed further design improvement by means of the finite element analysis. The improvement was that we combine the copper cylinder by adding stopper. After the comparison of the simulation analysis and the impact test, we confirmed that the improvement effectively and also eliminate the high stress area phenomenon. This research developed the evaluated model for TFT-LCD module design after testing and simulation. It can be effective for the design of the TFT-LCD module by applied to experimental and value simulated methods. Thus it can help designers pre-estimate the product strength during the beginning of the development and also shorten the design duration, quickly bring out to mass production to exalt the industry competence of the products.
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