本論文在探討數種商用助銲劑對錫-3銀-0.5銅無鉛銲錫在基板迴銲後電化學遷移行為之影響。電化學遷移研究在電導率186.2μS/cm之水中進行，迴銲時使用不同助銲劑，迴銲後兩銲球(直徑約1.2mm)相距0.80mm，在兩銲球間施加3或5V偏壓，結果顯示：隨著助銲劑的固形物含量的不同，當助銲劑的固形物含量增加，會延長電化學遷移短路之時間。 助銲劑成份中松香之C=O鍵結，其氧原子在迴銲後，已改變了其原本之C=O鍵結，而助銲劑與銲錫作用後，其表面之C-H鍵結，可以抑制電化學遷移之產生。 助銲劑之鹵素含量影響了電化學遷移的發生，而助銲劑中鹵素活性劑溴化物的添加，將促進電化學遷移之發生。 This paper relates to the effects of fluxes on the electrochemical migration of reflowed Sn-3Ag-0.5Cu solders in water. Electrochemical migration behaviors of reflowed Sn-3Ag-0.5Cu solders, so called Pb-free solders, by applying different fluxes have been studied. The electrochemical migration increasing resistance of the Sn-3Ag-0.5Cu solders at a bias of 3 or 5V with increasing Solid Content. Rosin is one of the contents of flux, and the C=O bonding of rosin is reduced after reflowing. When applying the fluxes to the solders, the C-H bonding in the surface of solders could increase the resistance of electrochemical migration. Halogen Content of the flux would change the characteristic of electrochemical migration. Halogen Content would encourage the electrochemical migrations.
