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    Please use this identifier to cite or link to this item: http://ir.lib.ncu.edu.tw/handle/987654321/26877

    Title: On the oxygen reduction reaction catalyzed by Ti-Cu binary films in 0.5 M sulfuric acid solution
    Authors: Lin,JC;Chuang,CL;Lai,CM;Chu,HC;Chen,YS
    Contributors: 機械工程研究所
    Date: 2009
    Issue Date: 2010-06-29 18:02:16 (UTC+8)
    Publisher: 中央大學
    Abstract: Ti-Cu binary films co-sputtered in vacuum are catalytically active for the oxygen reduction in 0.5 M H2SO4. The activity for the oxygen reduction reaction (ORR) increased with increasing the Cu-content in the Ti-Cu films and it reached to a maximum with the copper composition up to 90 aft The constant Tafel slope of similar to 190 mV/decade which is comparable to that obtained on pure Cu films indicates that the active sites for oxygen reduction is copper sites. Through investigation of Tafel polarization, the Ti-Cu films revealed a constant Tafel slope (i.e., 190 mV/decade) similar to that of ORR on the pure Cu film. This infers that the electrochemical reduction of oxygen is predominated on the Cu-sites in the film. In the cyclic voltammograms, the strong broad peak should have arisen from the oxidation of Cu to Cu+ and Cu2+ ions. This oxidation indicated that the Ti-Cu films are unstable and the Cu-component is susceptible to dissolution in 0.5 M H2SO4. This dissolution caused a loss of catalytic activity in the films. Preparing the Ti-Cu films enriched in Ti will stabilize these films to prevent the Cu-dissolution. (C) 2009 Elsevier B.V. All rights reserved.
    Relation: THIN SOLID FILMS
    Appears in Collections:[機械工程研究所] 期刊論文

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