On the structure of micrometer copper features fabricated by intermittent micro-anode guided electroplating

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題名:	On the structure of micrometer copper features fabricated by intermittent micro-anode guided electroplating
作者:	Lin,JC;Yang,JH;Chang,TK;Jiang,SB
貢獻者:	機械工程研究所
關鍵詞:	LOCALIZED ELECTROCHEMICAL DEPOSITION;MICROFABRICATION;COLUMNS
日期:	2009
上傳時間:	2010-06-29 18:02:18 (UTC+8)
出版者:	中央大學
摘要:	Micrometer copper features were fabricated by an intermittent micro-anode guided electroplating (MACE) process and revealed different structures depending upon the experimental conditions. A hollow microtube was developed at 4.0V with an initial distance of 2 mu m/step. By decreasing the voltage from 4.0 to 3.2 V while increasing the initial distance from 2 to 25 mu m/step, a dense copper column with a smooth surface was formed instead of a rough-surfaced tube. The dense column was prepared on a base with larger area compared to that used for the hollow tube. The observation of different structures by electrochemical deposition could be explained using a quantitative model based on finite element analysis. According to this model, the structure is determined by the ratio of field strength at the periphery to that in the center (i.e., E-e/E-t) of the location. Using a ratio higher than 1.5 results in hollow tubes, whereas a ratio less than 1.0 produces dense pillars. (C) 2009 Elsevier Ltd. All rights reserved.
關聯:	ELECTROCHIMICA ACTA
顯示於類別:	[機械工程研究所] 期刊論文

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