近年來，積體電路技術發展日新月異，且隨著電子設備小型化、輕量化、薄型化與低成本的需求發展趨勢下，積層陶瓷晶片電容器的特性與功能已成為電子產品中不可或缺的基本元件。本研究探討之對象積層陶瓷電容製程中生胚陶瓷薄膜厚度，此一特性影響後續製程中的生產難易度，並決定產品的容值分布及中心值。由於目前的檢驗方式為人工線外檢驗作業與使用X-ray線上即時檢驗，人工檢驗費時又無法即時反映出薄帶的厚度，或者使用昂貴的機器設備進行線上即時檢驗，所花費成本過高。為解決上述的問題，本研究根據Beer-Lambert’s Law推導出X7R薄帶厚度與影像灰階關係式，實驗找出最佳的光源，並利用工業級CCD與影像擷取卡，配合VB程式進行線上檢驗，計算出所量測出的薄帶厚度，即時將量測出的厚度繪製於SPC管制圖，進行即時監控。 In recent years, the integrated circuit technique has been constantly improved. The electronic products nowadays are required with low cost, miniaturization, reducing in weight and thin type. The Multi-Layer Ceramic Capacitors (MLCC) have already become the necessary components for electronic products. The green foil thickness is closely related to the capacity of the MLCCs and hence it is an important inspection item in the MLCC manufacturing processes. To avoid using expensive X-ray measurement system, the green foil thickness is still inspected by operators in many manufacturing factories. The inspecting process is very time-consuming and usually becomes the bottle-neck of the whole process. In this paper, we derived the relationship between the X7R foil thickness and the grayness of the image based on the Beer-Lambert’s Law, and developed a real-time online inspection system. Experiment results shows the measurement error is within 2.5% for this system.
