On the resistance of silver migration in Ag-Pd conductive thick films under humid environment and applied dc field

NCUIR > Engineering College > Graduate Institute of Mechanical Engineering > journal & Dissertation > Item 987654321/27048

Please use this identifier to cite or link to this item: http://ir.lib.ncu.edu.tw/handle/987654321/27048

Title:	On the resistance of silver migration in Ag-Pd conductive thick films under humid environment and applied dc field
Authors:	Lin,JC;Chan,JY
Contributors:	機械工程學系
Keywords:	PALLADIUM;ALLOY;SPECTROSCOPY;TECHNOLOGY;OXIDES;ESCA
Date:	1996
Issue Date:	2010-06-29 18:06:25 (UTC+8)
Publisher:	中央大學
Abstract:	Silver migration occurring in pure silver conductive thick films was minimized by using Ag-Pd alloys. The in situ microscopic observation, under humid environment and an applied d.c. field, showed that the out-growth of silver dendrites from the cathode decreases with increasing (5-20%) amount of Pd in the Ag-Pd specimens, and ceases completely at 30% Pd. The enhancement of silver migration resistance with increasing Pd concentration in Ag-Pd conductors was evident by the measurements of the short circuit current between a couple of thick-him electrodes in distilled water at 5 V. Through the study of anodic potentiodynamic polarization in 0.01 M NaOH and the examination of the surface films on the thick films by X-ray diffraction and surface analyses (Auger and ESCA), it was found that the anodic formation of PdO blocks the silver dissolution, and minimizes the occurrence of silver migration.
Relation:	MATERIALS CHEMISTRY AND PHYSICS
Appears in Collections:	[Graduate Institute of Mechanical Engineering] journal & Dissertation

Files in This Item:

File	Description	Size	Format
index.html		0Kb	HTML	417	View/Open

社群 sharing