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    Please use this identifier to cite or link to this item: http://ir.lib.ncu.edu.tw/handle/987654321/2715


    Title: 黏彈性磨料應用於精微螺旋研拋之研究;A Study on Fine Spiral Polishing by Using Viscoelastic Abrasive
    Authors: 蕭聖勳;Sheng-Hsun Hsiao
    Contributors: 機械工程研究所
    Keywords: 螺旋研拋;內孔拋光;磨料流動加工;abrasive;polishing
    Date: 2006-07-05
    Issue Date: 2009-09-21 11:54:03 (UTC+8)
    Publisher: 國立中央大學圖書館
    Abstract: 本實驗之研究是利用一螺桿旋轉驅動黏彈性磨料,進行對工件內圓孔表面的螺旋研磨拋光。實驗中,藉由控制加工時間、磨料粒徑、磨料濃度、主軸轉速、加工間隙等加工參數,探討對工作溫度、磨料黏度、表面粗糙度與材料去除率的影響,並找出最佳參數組合;同時亦觀察實驗後,各加工參數對工件表面形貌之影響。 由實驗結果顯示,隨著加工時間的增加,磨料會呈現良好的流動性,此特性有利於精微之螺旋研拋,使達成理想之表面精拋效果。而在選用微細磨粒與高濃度之磨料,配合適當的主軸轉速及較小的加工間隙條件下,可獲得最佳表面改善效果,有效地將工件之表面粗糙度由0.23µmRa大幅降至0.08µmRa以下。 The study is about the polishing of inner surface by abrasive, which is propelled by a spiral spindle. In the experiment, we discussed the effects upon working temperature, abrasive viscosity, surface roughness, and material removal rate by controlling machining time, particle size, abrasive concentration and the speed of spindle rotation. Also, we observe the influence of these parameters on the polished surface. Thus we could find the best parameter setting. The result of the experiment shows that the liquidity of abrasive would rise with the increase of machining time. This property is beneficial for fine spiral polishing to achieve a more ideal polishing effect. The best polishing effect can be obtained by using small-particle and high-concentration abrasive, smaller machining gap and setting high spindle-rotation speed. The roughness of the surface can be effectively lowered from 0.23µmRa to 0.08µmRa.
    Appears in Collections:[機械工程研究所] 博碩士論文

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