直流、脈衝微電鍍之質傳與其微析鍍合金之熱電性質; On the mass transport of direct and pulse microplating and the thermoelectric property of the micrometer alloying deposit

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题名:	直流、脈衝微電鍍之質傳與其微析鍍合金之熱電性質;On the mass transport of direct and pulse microplating and the thermoelectric property of the micrometer alloying deposit
作者:	張庭綱;Ting-kang Chang
贡献者:	機械工程研究所
关键词:	微金屬柱;微電鍍;微陽極導引電鍍;局部電化學沉積;微熱偶;MAGE;continuous MAGE;micro column;micro therm
日期:	2009-07-01
上传时间:	2009-09-21 11:57:16 (UTC+8)
出版者:	國立中央大學圖書館
摘要:	本研究採用直流與脈衝兩種方式微陽極導引電鍍法，用以製備微米級之鎳與銅質微柱。析鍍過程中，採用微細參考電極使其接近微柱成長區，量取局部之電位，並紀錄陰陽兩極間電流值。由局部之電位變化可以推算離子濃度，並計算出離子補充之質傳率，電流之大小則可用來計算金屬離子的消耗率。無論是直流或脈衝微電鍍，其結果均顯示:微柱外型與內部結構，深受偏壓以及工作比(duty cycle)之影響，此種偏壓與工作比之影響，實與離子質傳速率與消耗速率之平衡有關。當離子補充率大於離子消耗率時，微柱之外觀平滑且內部緻密；反之，得出形貌粗糙內部多孔性之結構。若以微電鍍技術析鍍銅鎳合金微柱，其合金微柱成分受到為偏壓與銅離子濃度兩者影響，偏壓增大鎳含量增多；反之，則銅含量增加。鍍浴中銅離子濃度越高，微柱中銅的成分越高；反之，則銅成分減少。含銅離子0.012 M之鍍浴中，在偏壓3.8V可析鍍出與商用銅鎳合金成份比例相近之合金。其一合金與銅微柱接合改為可用來測量微區域之溫度熱電材料。間歇式微電鍍製程由於電場變動大，析鍍品質不易控制，若輔以視覺控制與影像處理，做為回饋訊號之依據，則可提供穩定之電場變化，成功地析鍍出外型平整內部緻密之微柱。 Micrometer copper and nickel columns were fabricated by direct and pulse current micro anode guided electroplating (MAGE) in this study. A micro reference electrode coupled with potentiostat was used to probe the local potential during electrodeposition and record the deposition current. The local concentration of metallic ions can be estimated from the local potential probed to calculate the supplying rate of the ions. The consumption rate was calculated from the deposition current. The surface morphology and the internal structure of the deposits were majorly determined by the electric bias and duty cycle due to their influence on the rate of electrical discharge and the rate of mass transport of the metallic ions. The metal column could be grown with a smooth surface and compact internal as the supplying rate of metallic ions (mass transport) is sufficient to compensate the consuming rate of the ions (caused by electrical discharge). On the other hand, the metal column would be grown with rough surface and porous internal. The alloy Ni/Cu columns also could be fabricated by MAGE process. The composition of Ni-Cu alloys was determined by the applied voltage and the concentration of cupric ions in the bath. With higher voltage applied, the Ni-content in the alloy is higher; increasing the concentration of cupric ions, the Ni-content in the alloy is becoming less. A micro column alloy with similar composition to the commercial Ni-Cu thermocouple was fabricated in the citrate bath containing 0.012M Cu2+ at 3.8V. Continuous MAGE was developed by means of visual control, image process and current feedback to maintain a steady strength of electric field. This method is better than intermittent MAGE to fabricate microcolumns with good quality.
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