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    請使用永久網址來引用或連結此文件: http://ir.lib.ncu.edu.tw/handle/987654321/2861


    題名: 磨料噴射技術應用於模具鋼精微拋光之研究;A Study on Micro Polishing of mold steel by Abrasive Jet Technology
    作者: 孫麗雯;Li-wen Sun
    貢獻者: 機械工程研究所
    關鍵詞: 曲面拋光;放電加工;磨料噴射;霧化法;Mirror machining of curved surface;Electrical discharge machined
    日期: 2007-06-22
    上傳時間: 2009-09-21 11:58:28 (UTC+8)
    出版者: 國立中央大學圖書館
    摘要: 本研究主要運用一自動磨料噴射精微拋光系統,探討其磨料噴射拋光法對於SKD61模具鋼放電面、研磨面與銑削面(微溝槽、微流道)等不同加工表面的拋光改善效果。 實驗證明水蠟能增加磨料的滑動效果並減緩表面硬化現象,且在添加劑混合比例500: 1000: 1500(水蠟: 磨料: 水)之下,對於1.0 μm Ra放電表面,以#2000SiC磨料,能在加工時間90 min內將表面改善至0.08 μmRa之近似鏡面效果。對於0.36 μmRa研磨表面,以#3000SiC磨料,能在加工時間60 min內將表面改善至0.054 μmRa之鏡面效果。對於0.24 μmRa微溝槽表面,以#3000SiC磨料,能在加工時間30min內將表面改善至0.06 μmRa之鏡面效果。對於0.36 μmRa直線型微流道表面,以#1000SiC磨料,能在加工時間60 min內將表面改善至0.06 μmRa之鏡面效果。而研究以霧化法所製作具滑動研磨功能之蠟砂(#3000SiC),能成功在加工時間45 min內將研磨面原始粗糙度0.36 μmRa改善至0.049 μmRa之鏡面拋光效果,且由實驗證明蠟砂能大幅減少SiC的嵌入與延後硬化效果。 This research mainly constructed out an automatic abrasive jet system for micro polishing machining, and took different SKD61 surface such as EDMed surface、grinding surface and milling surfac (micro-groove and micro-channel)as target of improving. From research, a fact was found that Water Wax could improve sliding polishing effect and reduce hardening phenomenon After Water Wax and #2000SiC abrasives were mixed, the roughness of EDMed surface could reduced from Ra: 1.0 µm to 0.08 µm within 90 minutes of machining time. After water wax and #3000SiC abrasives were mixed, the roughness of grinding surface could be reduced from Ra: 0.36 µm to 0.054 µm within 60 minutes of machining time. After water wax and #3000SiC abrasives were mixed, the roughness of micro-groove surface could be reduced from Ra: 0.24 µm to 0.06 µm within 30 minutes of machining time. After water wax and #1000SiC abrasives were mixed, the roughness of micro- channel surface could be reduced from Ra: 0.36 µm to 0.06 µm within 60 minutes of machining time. In this research, the SiC with Wax made atomization was proposed in this research. Within 45 minutes of machining time, the roughness of grinding surface could be reduced from Ra: 0.36 µm to 0.049 µm. The whole polishing time was not only shortened but also improved the hardening phenomenon caused by similar ball impact and surface embedment thoroughly.
    顯示於類別:[機械工程研究所] 博碩士論文

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