電化學矽加工之研究與分析; The Analysis and Investigation on Silicon Plate by Electrochemical Machining

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Title:	電化學矽加工之研究與分析;The Analysis and Investigation on Silicon Plate by Electrochemical Machining
Authors:	紀朝傑;Chao-Jie Ji
Contributors:	機械工程研究所
Keywords:	電化學加工;P 型矽基板;p-type silicon;Electrochemical machining
Date:	2008-07-09
Issue Date:	2009-09-21 12:02:21 (UTC+8)
Publisher:	國立中央大學圖書館
Abstract:	在眾多非傳統加工中，電化學加工(Electro-Chemical Machining, ECM)擁有加工速度快、無表面應力集中以及表面粗糙度佳的優勢，具有相當的發展潛力和高附加價值。本研究採用直徑100μm之碳化鎢棒作為刀具，氫氟酸作為電解液，對P型單晶之矽基板進行加工。本文採用兩種實驗方法：單一因子法探討電化學加工參數(加工電壓、電解液濃度、初始電極間隙、刀具轉速以及刀具進給速度)對加工孔徑的影響；田口實驗方法探討加工參數(加工電壓、電解液濃度、刀具轉速以及刀具進給速度)的相對重要性。實驗結果顯示，刀具轉速和初始電極間隙，此兩個變因對於加工孔徑影響微乎其微；加工電壓和電解液濃度是影響加工較大之參數。最後，以最佳參數進行加工，得到加工孔徑約300μm。 In numerous non-traditional machining, the electrochemical machining (ECM) has the advantage of quick processing speed, good convergence in surface stress, and nice smoothness in workpiece surface with enormous potentialities and highly added value. Single-crystal p-Si is machined by ECM. A tungsten carbide cylinder with diameter of 100 micro-meter is selected as the electrode tool. Hydrofluoric acid is selected as the electrolyte. In this research, the single variable method and Taguchi statistical method are used to analyze the influence of the parameters (such as applied voltage, concentration of electrolyte, initial inter electrode gap, rotational speed of the tool, tool feeding rate, etc) on the overcut of the drilling and the relative importance among parameters. From experimental results, it shows that the feeding rate and the rotating rate of the electrode have only slightly influence on machining. Finally, the best parameters are taken for drilling the silicon substrate, and a hole with diameter of about 300μm is obtained.
Appears in Collections:	[Graduate Institute of Mechanical Engineering] Electronic Thesis & Dissertation

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