Asymmetrical solder microstructure in Ni/Sn/Cu solder joint

NCUIR > Engineering College > Institute of Materials Science and Engineering > journal & Dissertation > Item 987654321/29828

Please use this identifier to cite or link to this item: http://ir.lib.ncu.edu.tw/handle/987654321/29828

Title:	Asymmetrical solder microstructure in Ni/Sn/Cu solder joint
Authors:	Wang,S. J.;Liu,C. Y.
Contributors:	材料科學與工程研究所
Keywords:	INTERFACIAL REACTIONS;SN
Date:	2006
Issue Date:	2010-07-06 15:58:55 (UTC+8)
Publisher:	中央大學
Abstract:	Asymmetrical solder microstructure was observed in the Ni/Sn/Cu solder joint. The asymmetrical solder microstructure resulted from the Cu concentration gradient along the Ni/Sn/Cu solder joint. Mechanical tests showed that the mechanical property of the N
Relation:	SCRIPTA MATERIALIA
Appears in Collections:	[Institute of Materials Science and Engineering] journal & Dissertation

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