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    Please use this identifier to cite or link to this item: http://ir.lib.ncu.edu.tw/handle/987654321/29844


    Title: Electromigration-induced UBM consumption and the resulting failure mechanisms in flip-chip solder joints
    Authors: Lin YL,Chang CW,Tsai CM,Lee CW,Kao CR
    Contributors: 材料科學與工程研究所
    Keywords: UNDER-BUMP-METALLIZATION;INTERFACIAL REACTIONS;CU CONCENTRATION;SURFACE FINISH;NI;DISSOLUTION
    Date: 2006
    Issue Date: 2010-07-06 15:59:12 (UTC+8)
    Publisher: 中央大學
    Abstract: Eutectic PbSn flip chip solder joint was subjected to 5 X 10(3) A/cm(2) current stressing at 150 degrees C and 3.5 X 10(4) A/cm(2) current stressing at 30 degrees C. The under bump metallurgy (UBM) on the chip was sputtered Ni/Cu, and the substrate side w
    Relation: JOURNAL OF ELECTRONIC MATERIALS
    Appears in Collections:[材料科學與工程研究所 ] 期刊論文

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